BAW101-7 DIODES | Alldatasheet

Document overview

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Technical content

Features

  • Fast Switching Speed
  • High Reverse Breakdown Voltage
  • Two Electrically Isolated Elem ents in a Single Compact Package
  • Low Leakage Current
  • Lead, Halogen and Antimony Free, RoHS Compliant (Note 1)
  • "Green" Device (Note 2) Mechanical Data
  • Case: SOT143
  • Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0
  • Moisture Sensitivity: Level 1 per J-STD-020
  • Lead Free Plating (Matte Tin Finish annealed over Alloy 42 leadframe).
  • Polarity: See Diagram Below
  • Weight: 0.008 grams (approximate) Ordering Information (Note 3) Part Number Case Packaging BAW101-7 SOT143 3000/Tape & Reel Notes: 1. No purposefully added lead. Halogen and Antimony free. 2. Diodes Inc.\`s “Green” Policy can be found on our website at http://www.diodes.com 3. For packaging details, go to our website at http://www.diodes.com. Marking Information Date Code Key Year 2011 2012 2013 2014 2015 2016 2017 Code Y Z A B C D E Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec Code 1 2 3 4 5 6 7 8 9 O N D Device Schematic KT9 = Product Type Marking Code YM = Date Code Marking Y = Year (ex: Y = 2011) M = Month (ex: 9 = September) KT9 YM

Document number: DS32092 Rev. 3 - 2 2 of 4 www.diodes.com June 2011 © Diodes Incorporated BAW101 NEW PRODUCT Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Symbol Value Unit Repetitive Peak Reverse Voltage Single Diode VRRM 300

600 V Series Connection

Working Peak Reverse Voltage DC Blocking Voltage Single Diode V RWM VR 300 600 V Series Connection RMS Reverse Voltage VR(RMS) 212 V Forward Current (Note 4) Single Diode Loaded IF 250 140 mA Double Diode Loaded Non-Repetitive Peak Forward Surge Current Square Wave @ t = 1.0μs IFSM 4.5 A Repetitive Peak Forward Current (Note 4) IFRM 625 mA Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation (Note 4) PD 400 mW Thermal Resistance Junction to Ambient Air (Note 4) RθJA 312 °C/W Operating and Storage Temperature Range TJ, TSTG -65 to +150 °C Electrical Characteristics @TA = 25°C unless otherwise specified Characteristic Symbol Min Max Unit Test Condition Reverse Breakdown Voltage (Note 5) V(BR)R 300 ⎯ V IR = 100μA Forward Voltage VF ⎯ 1.1 V IF = 100mA Reverse Current (Note 5) IR ⎯ 150 nA μA VR = 250V VR = 250V, TJ = 150°C Total Capacitance CT ⎯ 2.0 pF VR = 0, f = 1.0MHz Reverse Recovery Time trr ⎯ 50 ns IF = IR = 30mA, Irr = 0.1 x IR, RL = 100Ω Notes: 4. Part mounted on FR-4 board with recommended pad layou t, which can be found on our website at http://www.diodes.com. 5. Short duration pulse test used to minimize self-heating effect. 0 150 200 500 400 300 100 200 T , AMBIENT TEMPERATURE ( C) Fig. 1 Power Derating Curve, Total Package A ° P , POWER DISSIPATION (mW)D 25 12575 10050 175 Note 4 100 1,000 0.4 0.2 0.6 V , INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 2 Typical Forward Characteristics, Per Element F 0.8 1.21.0 1.4 T = -55ºCA T = 25ºCA T = 85ºCA T = 125ºCA T = 150ºCA I , INSTANTANEOUS FORWARD CURRENT (mA)F

Document number: DS32092 Rev. 3 - 2 3 of 4 www.diodes.com June 2011 © Diodes Incorporated BAW101 NEW PRODUCT 0.1 100 1,000 10,000 100,000 0 50 100 150 200 250 V , INSTANTANEOUS REVERSE VOLTAGE (V) Fig. 3 Typical Reverse Characteristics, Per Element R T = -55ºCA T = 25ºCA T = 85ºCA T = 125ºCA T = 150ºCA I , INSTANTANEOUS REVERSE CURRENT (nA)R C , TOTAL CAPACITANCE (pF)T V , DC REVERSE VOLTAGE (V) Fig. 4 Total Capacitance vs. Reverse Voltage, Per Element R Typical 0.5 0.55 0.6 0.65 0.7 0.75 0.8 0 5 10 15 20 25 30 35 40 Package Outline Dimensions Suggested Pad Layout SOT143 Dim Min Max A1 0.37 0.51 A2 0.77 0.93 B 1.20 1.40 C 2.28 2.48 D 1.58 1.83 F 0.45 0.60 G 1.78 2.03 H 2.80 3.00 J 0.013 1.00 K 0.89 0.10 L 0.46 0.60 M 0.085 0.18 All Dimensions in mm Dimensions Value (in mm) Z 2.70 G 1.30 X 2.50 X1 1.0 X2 0.60 Y 0.70 C 2.0 J L M B C K H G D F X1 X2 GZ Y C XX2

Document number: DS32092 Rev. 3 - 2 4 of 4 www.diodes.com June 2011 © Diodes Incorporated BAW101 NEW PRODUCT IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries rese rve the right to make modifications, enhanc ements, improvements, corrections or ot her changes without further notice to this document and any product descri bed herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or an y product described herein; neither does Di odes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or us er of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthoriz ed sales channel. Should Customers purchase or use Diodes Inco rporated products for any unintended or una uthorized application, Customers shall i ndemnify and hold Diodes Incorporated and its representativ es harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical component s in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when proper ly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifi cations of their life support dev ices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or s ystems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporate d and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2011, Diodes Incorporated www.diodes.com