BAT54 FUTUREWAFER | Alldatasheet

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Surface Mount Schottky Barrier Diode Document No.: F41806F 07-DEC-2021 V 2.1 www.futurewafer.com.tw FQE-001-04 1. Synopsis 1-1. General Description These Schottky Barrier Diodes are Designed for High Speed Switching Applications, Circuit Protection, And Voltage Clamping. Extremely Low Forward Voltage Reduces Conduction Loss. Miniature Surface Mount Package is Excellent For Handheld And Portable Applications Where Space is Limited. 1-2. Feature List

  • Low Turn-on Voltage
  • Extremely Fast Switching Speed
  • PN Junction Guard Ring for Transient and ESD Protection
  • Totally Lead -Free & Fully RoHS Compliant
  • Halogen and Antimony Free. “Green” Device 1-3. Mechanical Characteristics
  • Molded JEDEC Package : - SOT23 / - SOT323 - SOT363 / - SOD123 - SOD323 / - SOD323FL - SOD523FL / - DFN1006-2L
  • Packing: Tape and Reel
  • Flammability rating UL 94V -0
  • Halogen Free
  • JEDEC MSL Classification: Level 1 1-3. Device Characteristics BAT54L DFN1006-2L BAT54H SOD323 BAT54WS SOD323FL BAT54K SOD523FL BAT54CW SOT323 BAT54BRW SOT363 BAT54 SOT23 BAT54T SOD123

Surface Mount Schottky Barrier Diode Document No.: F41806F 07-DEC-2021 V 2.1 www.futurewafer.com.tw FQE-001-04 2. Contents

Surface Mount Schottky Barrier Diode Document No.: F41806F 07-DEC-2021 V 2.1 www.futurewafer.com.tw FQE-001-04 3. Electrical Property 3-1. Electrical Characteristics 3-2. Thermal Characteristics 3-3. Ratings and Characteristics Curve (TA=25°C Unless Otherwise Noted)-Fig 1~2 Fig 1. Power Derating Curve Average Temperature, T A (°C) Power Dissipation, P D (mW) Fig 2. Typical Instantaneous Forward Characteristics Instantaneous Forward Current, I F (mA) Instantaneous Forward Voltage, V F (V) T A = 25°C T A = 85°C T A = 125°C

Surface Mount Schottky Barrier Diode Document No.: F41806F 07-DEC-2021 V 2.1 www.futurewafer.com.tw FQE-001-04 3-3. Ratings and Characteristics Curve (TA=25°C Unless Otherwise Noted)-Fig 3~7 Fig 5. Average Forward Power Dissipation vs. Average Forward Current Forward Current, I F (A) Power Dissipation, P D (W) Reverse Voltage, V R (V) Instantaneous Reverse Current, I R (uA) Fig 3. Typical Reverse Current Characteristics Fig 4. Total Capacitance vs. V R Total Capacitance, C J (pF) Reverse Voltage, V R (V) I R (TJ) / I R (T J = 25°C) Fig 6. Reverse Leakage Current vs. Junction Temperature Average Temperature, T A (°C) δ=0.05 δ=0.1 δ=0.2 δ=0.5 δ=1.0 T A = 25°C T A = 85°C T A = 125°C V R = 3V Fig 7. Relative Variation of Thermal Impedance Junction to Ambient vs. Pulse Duration Pulse Duration, t p (S) Z thJA / R thJA SOT323 / SOT363 / SOD323 / 323FL SOD523FL SOT23 / SOD123 / DFN1006-2L

Surface Mount Schottky Barrier Diode Document No.: F41806F 07-DEC-2021 V 2.1 www.futurewafer.com.tw FQE-001-04 4. Soldering Parameters

Surface Mount Schottky Barrier Diode Document No.: F41806F 07-DEC-2021 V 2.1 www.futurewafer.com.tw FQE-001-04 5. Package Information 5-1. Dimension-SOT23 5-2. PCB Pad Layout Recommendation-SOT23 Unit:mm

Surface Mount Schottky Barrier Diode Document No.: F41806F 07-DEC-2021 V 2.1 www.futurewafer.com.tw FQE-001-04 5-3. Dimension-SOT323 5-4. PCB Pad Layout Recommendation-SOT323 Unit:mm Unit:mm

Surface Mount Schottky Barrier Diode Document No.: F41806F 07-DEC-2021 V 2.1 www.futurewafer.com.tw FQE-001-04 5-5. Dimension-SOT363 5-6. PCB Pad Layout Recommendation-SOT363 Unit:mm Unit:mm

Surface Mount Schottky Barrier Diode Document No.: F41806F 07-DEC-2021 V 2.1 www.futurewafer.com.tw FQE-001-04 5-7. Dimension-SOD123 5-8. PCB Pad Layout Recommendation-SOD123 Unit:mm Unit: mm(inch)

Surface Mount Schottky Barrier Diode Document No.: F41806F 07-DEC-2021 V 2.1 www.futurewafer.com.tw FQE-001-04 5-9. Dimension-SOD323 5-10. PCB Pad Layout Recommendation-SOD323

Surface Mount Schottky Barrier Diode Document No.: F41806F 07-DEC-2021 V 2.1 www.futurewafer.com.tw FQE-001-04 5-11. Dimension-SOD323FL 5-12. PCB Pad Layout Recommendation-SOD323FL Unit:mm Unit:mm

Surface Mount Schottky Barrier Diode Document No.: F41806F 07-DEC-2021 V 2.1 www.futurewafer.com.tw FQE-001-04 5-13. Dimension-SOD523FL 5-14. PCB Pad Layout Recommendation-SOD523FL Unit:mm Unit:mm

Surface Mount Schottky Barrier Diode Document No.: F41806F 07-DEC-2021 V 2.1 www.futurewafer.com.tw FQE-001-04 5-15. Dimension-DFN1006-2L 5-16. PCB Pad Layout Recommendation-DFN1006-2L

Surface Mount Schottky Barrier Diode Document No.: F41806F 07-DEC-2021 V 2.1 www.futurewafer.com.tw FQE-001-04 6. Ordering Information

Surface Mount Schottky Barrier Diode Document No.: F41806F 07-DEC-2021 V 2.1 www.futurewafer.com.tw FQE-001-04 7. Version 7-1. History 7-2. Company Profile Futurewafer Tech Co., Ltd. 台灣未來芯科技股份有限公司 TEL: +886-3-3350161 / FAX: +886-3-3350172 cherry@futurewafer.com.tw No. 286-11F, Sec. 3, Sanmin Rd., Taoyuan Dist., Taoyuan City 330, Taiwan