BAT42_14 TSC | Alldatasheet
Document overview
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Technical content
- Low forward voltage drop - Through-hole device type mounting - Hermetically sealed glasss - Compression bonded construction - Solder hot dip tin (Sn) lead finish - All external surfaces are corrosion resistant and leads are readily solderable SYMBOL UNIT P D mW VRRM V VR V IF(AV) mA IFSM A TJ , TSTG oC SYMBOL UNIT Breakdown Voltage BV V Maximum Peak Reverse Current IR nA Junction Capacitance CJ pF Reverse Recovery Time trr ns Document Number: DS_S1412008 Version: C14 BAT42 / BAT43 Taiwan Semiconductor Small Signal Product Hermetically Sealed Glass Fast Switching Schottky Barrier Diode
FEATURES
Repetitive Peak Reverse Voltage PARAMETER Maximum DC Blocking Voltage DO-35 Hermetically Sealed Glass MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted) V Operating and Storage Temperature Range PARAMETER Average Forward Rectified Current Peak Forward Surge Current -1 . 0 0 -0 . 4 0 VR=1V, f=1.0MHz (Note 1) VR=25V BAT43 -1 . 0 0 0.26 0.33 500 7 (Typ) Note 1: Reverse recovery test conditions: IF=IR=10mA, IRR=1mA, RL=100Ω VALUE 200 200 -65 to +125 MIN MAX -0 . 6 5 -0 . 4 5 V F 5 (Typ) Forward Voltage Drop All Types IR=100μA IF=200mA IF=10mA IF=50mA IF=200mA IF=2mA IF=15mA BAT42
(TA=25℃ unless otherwise noted) Document Number: DS_S1412008 Version: C14 Taiwan Semiconductor BAT42 / BAT43 RATINGS AND CHARACTERISTICS CURVES 100 150 200 250 0 25 50 75 100 125 150 175 200 Ptot - Power Dissipation (mW) TA - Ambient Temperature (oC) Fig.1 Admissible Power Dissipation VS. Ambient Temperature 0.01 0.1 100 1000 0 200 400 600 800 1000 1200 IF - Forward Current (mA) VF - Instantaneous Forward Voltage (mV) Fig. 2 Typical Reverse Characteristics 125 °C -40 °C 25 °C 0.01 0.1 100 1000 0 1 02 03 04 05 0 IR - Reverse Leakage Current (uA) VR - Reverse Voltage (V) Fig. 3 Typical Reverse Characteristics 125 °C 100 °C 75 °C 50 °C 25 °C 0 1 02 03 04 05 06 0 Capacitance (pF) VR - Reverse Voltage (V) Fig. 4 TypicalCapacitance VS. Reverse Applied Voltage
PART NO. Note 2: Part No. Suffix „-xx “ would be used for special requirement PART NO. Min Max Min Max A 0.34 0.60 0.013 0.024 B 2.90 5.08 0.114 0.200 C 25.40 38.10 1.000 1.500 D 1.30 2.28 0.051 0.090 "x" is Device Code from "2" thru "3". Document Number: DS_S1412008 Version: C14 MARKING DIAGRAM DIM. Unit (mm) Unit (inch) PACKAGE OUTLINE DIMENSION -xx PACKING Define manufacture source Green compound GR0-L0BAT42
ORDERING INFORMATION
PART NO. SUFFIX (Note 2) PACKING CODE PACKING CODE SUFFIX PACKAGE 5K / Box (Ammo) PACKING CODE SUFFIX G BAT42 Note 1: "x" is Device Code from "2" thru "3". BAT42 / BAT43 Taiwan Semiconductor Multiple manufacture source Green compound R0 GBAT42 R0G DESCRIPTIONPREFERRED P/N PACKING CODE BAT42-L0 R0G BAT4x (Note1) R0 DO-35 PART NO. SUFFIX 10K / 14" Reel
assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_S1412008 Version: C14 BAT42 / BAT43 Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,