BAT41HT1G ONSEMI | Alldatasheet

Document overview

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Technical content

Features

  • Fast Switching Speed
  • Low Leakage Current
  • Low Forward V oltage − 0.45 V @ IF = 1 mAdc
  • ESD Rating − Human Body Model: Class 3A − Machine Model: Class C
  • Surface Mount Device
  • Low Capacitance Diode
  • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant* MAXIMUM RATINGS Rating Symbol Value Unit Reverse Voltage VR 100 V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERMAL CHARACTERISTICS Characteristic Symbol Value Unit Total Device Dissipation FR−5 Board, (Note 1) TA = 25°C Derate above 25°C PD 200 1.57 mW mW/°C Forward Current (DC) IF 200 mA Non−Repetitive Peak Forward Current, tp < 10 msec IFSM 2 A Thermal Resistance Junction−to−Ambient R/C0113JA 635 °C/W Junction and Storage Temperature Range TJ, Tstg −55 to150 1. FR −4 Minimum Pad *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. This document contains information on a product under development. ON Semiconductor reserves the right to change or discontinue this product without notice.

100 VOLT SCHOTTKY

Device Package Shipping †

ORDERING INFORMATION

SOD−323 CASE 477 STYLE 1 CATHODE ANODE MARKING DIAGRAM http://onsemi.com BAT41HT1G SOD −323 (Pb−Free) 3,000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. JCM /C0071 /C0071 21 JC = Device Code M = Date Code /C0071 = Pb−Free Package (Note: Microdot may be in either location)

http://onsemi.com ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Min Typ Max Unit Reverse Breakdown Voltage (IR = 10 μA) VR 100 − − V Reverse Leakage (VR = 50 V) IR − − 0.1 μAdc Forward Voltage (IF = 1 mAdc) VF − − 0.45 Vdc Forward Voltage (IF = 10 mAdc) VF − − 0.6 Vdc Forward Voltage (IF = 100 mAdc) VF − − 0.82 Vdc Forward Voltage (IF = 200 mAdc) VF − − 1.0 Vdc Forward Voltage Reverse Leakage (VR = 100 V) IR − − 0.2 /C0109Adc Total Capacitance (VR = 1.0 V, f = 1.0 MHz) CT − 4 10 pF

http://onsemi.com PACKAGE DIMENSIONS HE SOD−323 CASE 477−02 ISSUE H NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. LEAD THICKNESS SPECIFIED PER L/F DRAWING WITH SOLDER PLATING. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 5. DIMENSION L IS MEASURED FROM END OF RADIUS. NOTE 3 D 1 2b E A C NOTE 5 L 1.60 0.063 0.63 0.025 0.83 0.033 2.85 0.112 HE DIM MIN NOM MAX MILLIMETERS A 0.80 0.90 1.00 A1 0.00 0.05 0.10 A3 0.15 REF b 0.25 0.32 0.4 C 0.089 0.12 0.177 D 1.60 1.70 1.80 E 1.15 1.25 1.35 0.08 2.30 2.50 2.70 L 0.031 0.035 0.040 0.000 0.002 0.004

0.006 REF

0.010 0.012 0.016 0.003 0.005 0.007 0.062 0.066 0.070 0.045 0.049 0.053 0.003 0.090 0.098 0.105 MIN NOM MAX INCHES *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* STYLE 1: PIN 1. CATHODE (POLARITY BAND) 2. ANODE ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems in tended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resa le in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 BAT41HT1/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative