BAS85_14 TSC | Alldatasheet

Document overview

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Technical content

Small Signal Product CREAT BY ART - Low forward voltage drop - Ideal for automated placement - Hermetically sealed glass - Compression bonded construction - All external surfaces are corrosion resistant and leads are readily solderable - Solder hot dip tin (Sn) lead finish - Polarity: Indicated by black cathode band SYMBOL UNIT P D mW VRRM V VR V IF(AV) mA IFSM A TJ oC TSTG oC SYMBOL UNIT Breakdown Voltage BV V Reverse Leakage Current IR μA Forward Voltage Reverse Recovery Time trr ns Junction Capacitance CJ pF Document Number: DS_S1412007 Version: C14 Storage Temperature Range PARAMETER VALUE BAS85 Taiwan Semiconductor Hermetically Sealed Glass Fast Switching Schottky Barrier Diodes

FEATURES

Repetitive Peak Reverse Voltage Maximum DC Blocking Voltage 200 Peak Forward Surge Current Operating Junction Temperature MIN TYP MAX MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted) -65 to +125 200 0.24 V 0.32 0.40 0.50I F=30mA IF=100mA (Note 1) Note 1: Reverse recovery test conditions : IF=IR=10mA, RL=100Ω, IRR=1mA 0.80 MECHANICAL DATA VR=1V, f=1.0MHz VF PARAMETER IR=10μA VR=25V IF=0.1mA IF=1.0mA IF=10mA Average Forward Rectified Current

PART NO. Note 1: Part No. Suffix „-xx “ would be used for special requirement PART NO. Min Max Min Max A 3.30 3.70 0.130 0.146 B 1.40 1.60 0.055 0.063 C 0.20 0.50 0.008 0.020 A B C D Document Number: DS_S1412007 Version: C14 Define manufacture source Halogen free GL0-L0BAS85BAS85-L0 L0G Multiple manufacture source Halogen free GL0BAS85BAS85 L0G BAS85 Taiwan Semiconductor Small Signal Product

ORDERING INFORMATION

PART NO. SUFFIX (Note 1) PACKING CODE PACKING CODE SUFFIX PACKAGE PACKING BAS85 L0 G MINI MELF 10K / 13" Reel L1 2.5K / 7" Reel-xx EXAMPLE PREFERRED P/N PART NO. SUFFIX PACKING CODE PACKING CODE SUFFIX

DESCRIPTION

DIM. Unit (mm) Unit (inch) SUGGEST PAD LAYOUT DIM. Unit (mm) Unit (inch) Typ. Typ. 5.00 0.197 1.25 0.049 2.00 0.079 2.50 0.098 C B A

assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_S1412007 Version: C14 BAS85 Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,