BAS85 TSC | Alldatasheet

Document overview

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Technical content

Features

— Low forward voltage drop — LL-34( Mini-MELF) package — Through-Hole device type mounting — Hermetically sealed glass — Compression bonded construction — All external surfaces are corrosion resistant and terminals are readily solderable — RoHS compliant — Solder Hot Dip Tin (Sn) lead finish Dimensions in inches and (millimeters) Maximum Ratings and Electrical Characteristics Rating at 25 o C ambient temperature unless otherwise specified. Maximum Ratings Type Number Symbol Value Units Power Dissipation Pd 200 mW Repetitive Peak Reverse Voltage VRRM 30 V Maximum DC Blocking Voltage VR 30 V Average Forward Rectified Current IF(AV) 200 mA Peak Forward Surge Current IFSM 4 A Operating Junction Temperature TJ 125 O C Storage Temperature Range TSTG -65 to + 125 O C

Electrical Characteristics

Type Number Symbol Min Typ Max Units Breakdown Voltage I R=10uA BV 30 V Reverse Leakage Current V R=25V IR 2 uA Forward Voltage IF=0.1mA IF=1.0mA I F = 1 0 m A I F = 3 0 m A IF =100mA VF 0.24 0.32 0.40 0.50 0.80 V R e v e r s e R e c o v e r y T i m e ( N o t e 1 ) Trr 5 nS Junction Capacitance V R=1V, f=1.0MHz Cj 10 pF Notes: 1. Reverse Recovery Test Conditions: IF= IR =10mA, RL=100Ω, IRR=1mA Version: A08 Preliminary