BAS70-04 | DigiCamel IC Datasheet

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BAS70_06 PHILIPS | Alldatasheet

Document overview

Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
PDF pages: 20

Technical content

1.1 General description

1.2 Features

1.3 Applications

Table 1. Product overview

1.4 Quick reference data

Table 2. Quick reference data Table 3. Pinning

BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. [1] Tj=2 5°C prior to surge. Table 5. Marking codes Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).

BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. [2] Reﬂow soldering is the only recommended soldering method. [3] Soldering point at pins 2, 3, 5 and 6. Table 7. Thermal characteristics Table 8. Characteristics Tamb =2 5°C unless otherwise speciﬁed.

BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 08 — 4 May 2006 7 of 20 Philips Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes (1) Tamb = 125°C (2) Tamb =8 5°C (3) Tamb =2 5°C (4) Tamb = −40 °C (1) Tamb = 125°C (2) Tamb =8 5°C (3) Tamb =2 5°C Fig 1. Forward current as a function of forward voltage; typical values Fig 2. Reverse current as a function of reverse voltage; typical values f = 10 kHz T amb =2 5°C; f = 1 MHz Fig 3. Differential forward resistance as a function of forward current; typical values Fig 4. Diode capacitance as a function of reverse voltage; typical values 0 0.2 0.4 0.6 0.8 1 IF (mA) VF (V) mra803 (1) (4)(2) (3) 102 10−1 10−2 mra805 102 0 2 04 06 08 0 VR (V) IR (µA) (1) (3) (2) 10−1 10−2 10−3 11 0 rdif (Ω ) IF (mA) mra802 10−1 102 102 103 0.5 1.5 0 2 04 06 08 0 mra804 C d (pF) VR (V)

BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 08 — 4 May 2006 8 of 20 Philips Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes 8. Package outline Fig 5. Package outline SOD323 (SC-76) Fig 6. Package outline SOD523 (SC-79) Fig 7. Package outline SOT23 (TO-236AB) Fig 8. Package outline SOD123F Fig 9. Package outline SOD882 Fig 10. Package outline SOT323 (SC-70) 03-12-17Dimensions in mm 0.25 0.10 0.45 0.152.7 2.3 1.8 1.6 0.40 0.25 1.1 0.8 1.35 1.15 02-12-13Dimensions in mm 1.65 1.55 1.25 1.15 0.17 0.11 0.34 0.26 0.65 0.58 0.85 0.75 04-11-04Dimensions in mm 0.45 0.15 1.9 1.1 0.9 3.0 2.8 2.5 2.1 1.4 1.2 0.48 0.38 0.15 0.09 04-11-29Dimensions in mm 1.2 1.0 0.25 0.10 3.6 3.4 2.7 2.5 0.55 0.35 0.70 0.55 1.7 1.5 03-04-17Dimensions in mm 0.55 0.47 0.65 0.62 0.55 0.50 0.46 cathode marking on top side 1.02 0.95 0.30 0.22 0.30 0.22 04-11-04Dimensions in mm 0.45 0.15 1.1 0.8 2.2 1.8 2.2 2.0 1.35 1.15 1.3 0.4 0.3 0.25 0.10

BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 08 — 4 May 2006 9 of 20 Philips Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes Fig 11. Package outline SOT143B Fig 12. Package outline SOT363 (SC-88) Fig 13. Package outline SOT666 04-11-16Dimensions in mm 3.0 2.8 1.1 0.9 2.5 2.1 1.4 1.2 1.7 1.9 0.48 0.38 0.15 0.09 0.45 0.15 0.88 0.78 04-11-08Dimensions in mm 0.25 0.10 0.3 0.2 pin 1 index 1.3 0.65 2.2 2.0 1.35 1.15 2.2 1.8 1.1 0.8 0.45 0.15 13 2 465 Dimensions in mm 04-11-08 1.7 1.5 1.7 1.5 1.3 1.1 0.18 0.08 0.27 0.170.5 pin 1 index 123 456 0.6 0.5 0.3 0.1

BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 08 — 4 May 2006 11 of 20 Philips Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes 10. Soldering Dimensions in mm Fig 14. Reﬂow soldering footprint SOD323 (SC-76) Dimensions in mm Fig 15. Wave soldering footprint SOD323 (SC-76) Reﬂow soldering is the only recommended soldering method. Dimensions in mm Fig 16. Reﬂow soldering footprint SOD523 (SC-79) msa433 1.65 0.50 (2×) 2.10 1.60 2.80 0.60 3.05 0.500.95 solder lands solder resist occupied area solder paste MSA415 1.40 4.40 5.00 1.202.75 solder lands solder resist occupied area preferred transport direction during soldering MGS343 solder lands solder resist occupied area solder paste 1.80 1.90 0.30 0.40 0.501.20 0.60 2.15

BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 08 — 4 May 2006 12 of 20 Philips Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes Dimensions in mm Fig 17. Reﬂow soldering footprint SOT23 (TO-236AB) Dimensions in mm Fig 18. Wave soldering footprint SOT23 (TO-236AB) MSA439 1.00 0.60 (3x) 1.30 2.50 3.00 0.85 2.70 2.90 0.50 (3x) 0.60 (3x) 3.30 0.85 solder lands solder resist occupied area solder paste MSA427 4.004.60 2.80 4.50 1.20 3.40 1.20 (2x) preferred transport direction during soldering solder lands solder resist occupied area

BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 08 — 4 May 2006 13 of 20 Philips Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes Reﬂow soldering is the only recommended soldering method. Dimensions in mm Fig 19. Reﬂow soldering footprint SOD123F Reﬂow soldering is the only recommended soldering method. Dimensions in mm Fig 20. Reﬂow soldering footprint SOD882 1.6 1.6 2.9 4.4 1.1 1.22.1 1.1 (2×) solder lands solder resist occupied area solder paste MBL872 1.30 0.60 (2·) 0.70 (2·) 0.80 (2·) solder lands solder resist occupied area solder paste 0.90 0.30 (2·) 0.40 (2·) 0.50 (2·)

BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 08 — 4 May 2006 14 of 20 Philips Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes Dimensions in mm Fig 21. Reﬂow soldering footprint SOT323 (SC-70) Dimensions in mm Fig 22. Wave soldering footprint SOT323 (SC-70) MSA429 0.852.35 0.55 (3x) 1.3250.75 2.40 2.65 1.30 0.60 (3x) 0.50 (3x) 1.90 solder lands solder resist occupied area solder paste MSA419 4.00 4.60 2.103.65 1.15 2.70 1 0.90 (2x) preferred transport direction during soldering solder lands solder resist occupied area

BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 08 — 4 May 2006 15 of 20 Philips Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes Dimensions in mm Fig 23. Reﬂow soldering footprint SOT143B Dimensions in mm Fig 24. Wave soldering footprint SOT143B msa441 0.60 (4x) 1.30 2.50 3.002.70 0.50 (3x) 0.60 (3x) 3.25 0.90 1.00 solder lands solder resist occupied area solder paste MSA422 4.004.60 1.20 (3x) 4.45 1.15 3.40 1.00 preferred transport direction during soldering solder lands solder resist occupied area

BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 08 — 4 May 2006 16 of 20 Philips Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes Dimensions in mm Fig 25. Reﬂow soldering footprint SOT363 (SC-88) Fig 26. Wave soldering footprint SOT363 (SC-88) MSA432 solder lands solder resist occupied area solder paste 1.20 2.40 0.50 (4·) 0.40 (2·) 0.90 2.10 0.50 (4·) 0.60 (2·) 2.35 2.65 solder lands solder resist occupied area 1.15 3.75 transport direction during soldering 1.000.30 4.004.50 5.25 sot363Dimensions in mm

BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 08 — 4 May 2006 17 of 20 Philips Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes Reﬂow soldering is the only recommended soldering method. Fig 27. Reﬂow soldering footprint SOT666 solder lands solder resist placement area occupied area 0.075 Dimensions in mm 2.75 2.45 2.10 1.60 1.20 2.20 2.50 0.15 (4·) 0.375 (4·) 0.40 (6·) 0.55 (2·)

20060504 Product data sheet - BAS70_1PS7XSB70_

Table 9 “Packing methods”: added packing method 2 mm pitch for SOD523
Figure 26 “Wave soldering footprint SOT363 (SC-88)”: amended
Figure 27 “Reﬂow soldering footprint SOT666”: amended
Section 12 “Legal information”: updated BAS70_1PS7XSB70_ SER_7

20050718 Product data sheet - 1PS76SB70_2

BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 08 — 4 May 2006 19 of 20 Philips Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes 12. Legal information

12.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Deﬁnitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.semiconductors.philips.com.

12.2 Deﬁnitions

Draft —The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modiﬁcations or additions. Philips Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet —A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Philips Semiconductors sales ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the full data sheet shall prevail.

12.3 Disclaimers

General — Information in this document is believed to be accurate and reliable. However, Philips Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes —Philips Semiconductors reserves the right to make changes to information published in this document, including without limitation speciﬁcations and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use —Philips Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a Philips Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Philips Semiconductors accepts no liability for inclusion and/or use of Philips Semiconductors products in such equipment or applications and therefore such inclusion and/or use is for the customer’s own risk. Applications —Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the speciﬁed use without further testing or modiﬁcation. Limiting values —Stress above one or more limiting values (as deﬁned in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale —Philips Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.semiconductors.philips.com/proﬁle/terms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by Philips Semiconductors. In case of any inconsistency or conﬂict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license —Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

12.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales ofﬁce addresses, send an email to: sales.addresses@www.semiconductors.philips.com Document status[1][2] Product status[3] Deﬁnition Objective [short] data sheet Development This document contains data from the objective speciﬁcation for product development. Preliminary [short] data sheet Qualiﬁcation This document contains data from the preliminary speciﬁcation. Product [short] data sheet Production This document contains the product speciﬁcation.

Philips Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes © Koninklijke Philips Electronics N.V. 2006. All rights reserved. For more information, please visit: http://www.semiconductors.philips.com. Date of release: 4 May 2006 Document identifier: BAS70_1PS7XSB70_SER_8 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 14. Contents

Product Information

BAS70-04 specifications and overview.

Summary

General-purpose Schottky diodes Rev. 08-4 May 2006

Description

General-purpose Schottky diodes Rev. 08-4 May 2006

Source title BAS70-04 Datasheet(PDF) - NXP Semiconductors

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