BAS70 FUTUREWAFER | Alldatasheet

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1 Document No.: F21837G 27-DEC-2021 V 2.0 www.futurewafer.com.tw FQE-001-04 BAS70 Series Surface Mount Switching Diode 1-1. Feature List

  • For General Purpose Switching Applications
  • Fast Switching Speed
  • Totally Lead-Free & Fully RoHS Compliant
  • Halogen and Antimony Free. “Green” Device
  • High Breakdown Voltage
  • Low Capacitance
  • Low Leakage Current SOT23 1-3. Mechanical Characteristics
  • Molded JEDEC Package: - SOT23 / SOT323 - SOD123FL - SOD323 / SOD323FL - SOD523FL - DFN1006-2L
  • Packing: Tape and Reel
  • Flammability rating UL 94V-0
  • Halogen Free
  • JEDEC MSL Classification: Level 1 1-2. Applications
  • Ultra High-Speed Switching
  • Voltage Clamping Parameter Symbol Conditions Values Units Peak Repetitive Reverse Voltage V RRM T J = 25°C 70 V Working Peak Reverse Voltage V RWM DC Reverse Voltage V R Non-repetitive Peak Reverse Voltage V RM Average Forward Current I F - 70 mA Repetitive Peak Forward Current I FRM t p ≤ 1 s; δ ≤ 0.5 Non-repetitive Peak Forward Surge Current I FSM t p ≤ 10 ms 100 Power Dissipation P D - 200 mW Thermal Resistance, Junction-Ambient (Air) R ƟJA - 500 °C/W Operating Temperature Range T J - -55 ~ +150 °C Storage Temperature Range T STG - SOT323 SOD323 SOD323FL SOD523FL SOD123FL DFN1006-2L 1-4. Absolute Maximum Ratings 1. Synopsis

2 Document No.: F21837G 27-DEC-2021 V 2.0 www.futurewafer.com.tw FQE-001-04 BAS70 Series Surface Mount Switching Diode 2. Contents

3 Document No.: F21837G 27-DEC-2021 V 2.0 www.futurewafer.com.tw FQE-001-04 BAS70 Series Surface Mount Switching Diode Parameter Symbol Condition Min. Max. Units Reverse Breakdown Voltage V BR I R = 10uA 70 - V Forward Voltage V F I F = 1mA - 0.41 I F = 10mA - 0.75 I F = 15mA - 1 Reverse Recovery Time t rr I F = 10mA, V R = 6V, I rr = 1mA, R L = 100Ω - 5.0 nS Reverse Leakage Current I R V R = 50V, T J = 25°C - 10 uA Junction Capacitance C I/O Pin Capacitance to GND. V dc = 0V, f = 1MHZ - 2.0 pF Fig 1. Typical Forward Characteristics Average Forward Current, I F (mA) Forward Voltage, V F (V) T A = 125°C T A = 85°C T A = 25°C T A = -40°C Fig 2. Reverse Current Percent of Reverse Voltage, V R (%) Reverse Current, I R (uA) T A = 25°C T A = 85°C T A = 125°C Fig 3. Typical Junction Capacitance Junction Capacitance (pF) Reverse Voltage, V R (V) Fig 4. Power Derating Curve Case Temperature, T C (°C) Power Dissipation, P D (mW) 3-1. Electrical Characteristics 3. Electrical Property 3-2. Ratings and Characteristics Curve (TA=25°C unless otherwise noted)

4 Document No.: F21837G 27-DEC-2021 V 2.0 www.futurewafer.com.tw FQE-001-04 BAS70 Series Surface Mount Switching Diode 4. Soldering Parameters

5 Document No.: F21837G 27-DEC-2021 V 2.0 www.futurewafer.com.tw FQE-001-04 BAS70 Series Surface Mount Switching Diode Unit: mm 5-1. Dimension-SOT23 5-2. PCB Pad Layout Recommendation-SOT23 5. Package Information SOT23 Dim Min. Max. Typ. A 0.37 0.51 0.40 B 1.20 1.40 1.30 C 2.30 2.50 2.40 D 0.89 1.03 0.915 F 0.45 0.60 0.535 G 1.78 2.05 1.83 H 2.80 3.00 2.90 J 0.013 0.10 0.05 K 0.890 1.00 0.975 K1 0.903 1.10 1.025 L 0.45 0.61 0.55 L1 0.25 0.55 0.40 M 0.085 0.150 0.110 a 8° Dim Millimeter C 2.0 X 0.8 X1 1.35 Y 0.9 Y1 2.9

6 Document No.: F21837G 27-DEC-2021 V 2.0 www.futurewafer.com.tw FQE-001-04 BAS70 Series Surface Mount Switching Diode 5-3. Dimension-SOT323 5-4. PCB Pad Layout Recommendation-SOT323 SOT323 Dim Min. Max. Typ. A 0.8 1.1 - A1 - 0.1 - bp 0.3 0.4 - c 0.10 0.25 - D 1.8 2.2 - E 1.15 1.35 - e - - 1.3 e1 - - 0.65 HE 2.0 2.2 - Lp 0.15 0.45 - Q 0.13 0.23 - v - - 0.2 w - - 0.2 Unit:mm

7 Document No.: F21837G 27-DEC-2021 V 2.0 www.futurewafer.com.tw FQE-001-04 BAS70 Series Surface Mount Switching Diode Unit: mm (inch) 5-5. Dimension-SOD123FL 5-6. PCB Pad Layout Recommendation-SOD123FL SOD123FL Dim Min. Max. Body Length 2.60 3.00 Lead Span Nominal 3.50 3.90 Lead Width 0.70 1.20 Body Width 1.65 1.95 Height 0.80 1.25 Lead Height 0.195 0.205 Lead Length 0.35 0.60 Unit: mm

8 Document No.: F21837G 27-DEC-2021 V 2.0 www.futurewafer.com.tw FQE-001-04 BAS70 Series Surface Mount Switching Diode 5-7. Dimension-SOD323 5-8. PCB Pad Layout Recommendation-SOD323 SOD323 Dim Millimeters Min. Max. Body Length 1.60 1.90 Body Width 1.15 1.45 Lead Span Nominal 2.39 2.70 Height 0.80 1.10 Lead Width 0.25 0.40 Lead Height 0.10 0.20 Lead Length 0.20 0.40

9 Document No.: F21837G 27-DEC-2021 V 2.0 www.futurewafer.com.tw FQE-001-04 BAS70 Series Surface Mount Switching Diode SOD323FL Dim. Min. Typ. Max. A 0.80 - 1.10 b 0.25 - 0.40 c 0.10 - 0.15 D 1.15 - 1.35 E 1.60 - 1.80 He 2.30 - 2.80 L1 0.7 - 1.0 L2 0.8 - 1.2 α1 - - 7° α2 - - 3° β1 - - 7° β2 - - 3° Dimension Values G 2.0 X 1.4 X1 3.0 Y 0.5 Unit:mm Unit:mm 5-9. Dimension-SOD323FL 5-10. PCB Pad Layout Recommendation-SOD323FL

10 Document No.: F21837G 27-DEC-2021 V 2.0 www.futurewafer.com.tw FQE-001-04 BAS70 Series Surface Mount Switching Diode Unit: mm 5-11. Dimension-SOD523FL 5-12. PCB Pad Layout Recommendation-SOD523FL SOD523FL Symbol Min. Max. A 0.55 0.65 b 0.26 0.34 c 0.11 0.17 D 0.75 0.85 E 1.15 1.25 He 1.55 1.65 L 0.10 0.30 SOD523FL Dim Values G 0.80 X 0.60 X1 2.00 Y 0.70 Unit: mm

11 Document No.: F21837G 27-DEC-2021 V 2.0 www.futurewafer.com.tw FQE-001-04 BAS70 Series Surface Mount Switching Diode 5-14. PCB Pad Layout Recommendation-DFN1006-2L DFN1006-2L Dim Inches Millimeters ( C ) .033 0.85 G .012 0.30 X .024 0.60 Y .022 0.55 Z .055 1.40 5-13. Dimension-DFN1006-2L

12 Document No.: F21837G 27-DEC-2021 V 2.0 www.futurewafer.com.tw FQE-001-04 BAS70 Series Surface Mount Switching Diode 6-1. Taping and Reel Specification-SOT23 & SOT323 6-2. Embossed Carrier Tape Specification-SOT23 & SOT323 6. Packing Dimension W D D1 E F P P0 P2 t W Value 8 mm 1.5 ±0.1 1.3 Max. 1.75 ±0.1 3.5 ±0.05 ±0.1 ±0.1 ±0.1 0.4 Max. ±0.3 A0 / B0 / Determined by Component Size. The Clearance Between The Component And The Cavity Must Comply to The Rotational and Lateral Movement Requirement Provided in Figures in The “Maximum Component Movement in Tape Pocket” Section. Unit: mm Taping Width Tape Orientation 8mm Direction Of Feed

13 Document No.: F21837G 27-DEC-2021 V 2.0 www.futurewafer.com.tw FQE-001-04 BAS70 Series Surface Mount Switching Diode 6-3. Taping and Reel Specification-SOD123FL & SOD323 & SOD323FL Taping Width Tape Orientation 8mm 6-4. Embossed Carrier Tape Specification-SOD123FL & SOD323 & SOD323FL Dimension W D D1 E F P P0 P2 t W Values 8 mm 1.5 ±0.1 1.3 Max. 1.75 ±0.1 3.5 ±0.05 ±0.1 ±0.1 ±0.1 0.23 ±0.02 8 +0.3 / -0.1 A0 / B0 / Determined by Component Size. The Clearance Between the Component And The Cavity Must Comply to The Rotational And Lateral Movement Requirement Provided in Figures in The “Maximum Component Movement in Tape Pocket” Section. Unit: mm Direction Of Feed

14 Document No.: F21837G 27-DEC-2021 V 2.0 www.futurewafer.com.tw FQE-001-04 BAS70 Series Surface Mount Switching Diode 6-5. Taping and Reel Specification-SOD523FL Taping Width Tape Orientation 8mm 6-6. Embossed Carrier Tape Specification-SOD523FL Dimension W D D1 E F P P0 P2 t W Values 8 mm 1.5 ±0.1 0.6 Max. 1.75 ±0.1 3.5 ±0.05 ±0.1 ±0.1 ±0.1 0.23 ±0.02 8 +0.3 / -0.1 A0 / B0 / Determined by Component Size. The Clearance Between the Component And The Cavity Must Comply to The Rotational And Lateral Movement Requirement Provided in Figures in The “Maximum Component Movement in Tape Pocket” Section. Unit: mm Direction Of Feed

15 Document No.: F21837G 27-DEC-2021 V 2.0 www.futurewafer.com.tw FQE-001-04 BAS70 Series Surface Mount Switching Diode 6-7. Taping and Reel Specification-DFN1006-2L 6-8. Embossed Carrier Tape Specification-DFN1006-2L Tape Width Tape Orientation 8mm Dim W D D1 E F P P0 P2 t W Values 8 mm 1.5 +0.1 / -0.0 0.6 Max. 1.75 ± 0.1 3.5 ± 0.05 ± 0.1 ± 0.1 ± 0.1 0.4 M ax. 8 +0.3 / -0.1 A0 / B0 / Determined by Component Size. The Clearance Between The Component And The Cavity Must Comply to The Rotational and Lateral Movement Requirement Provided in Figures in The “Maximum Component Movement in Tape Pocket” Section. Unit: mm Direction Of Feed

16 Document No.: F21837G 27-DEC-2021 V 2.0 www.futurewafer.com.tw FQE-001-04 BAS70 Series Surface Mount Switching Diode 6-9. Surface Mount Reel Specification Dimension Tape Width Reel Size A B C D N G T Values 8 mm 7” 178 2.0 +0.5/-0 +0.5/-0.2 20.5 ±0.2 8.4 +1.5/-0.0 14.4 6-10. Tape Leader and Trailer Specification Unit: mm

17 Document No.: F21837G 27-DEC-2021 V 2.0 www.futurewafer.com.tw FQE-001-04 BAS70 Series Surface Mount Switching Diode Part Number Symbol Part Number Symbol BAS70 BAS70W BAS70-04 BAS70-04W BAS70-05 BAS70-05W BAS70-06 BAS70-06W BAS70H BAS70D BAS70DL BAS70S BAS70LP 7. Pin Out

18 Document No.: F21837G 27-DEC-2021 V 2.0 www.futurewafer.com.tw FQE-001-04 BAS70 Series Surface Mount Switching Diode Part Number Marking Code Quantity Component Package Packaging Option BAS70 73 SOT23 Tape & Reel - 8mm tape / 7”reel 3,000 PCS BAS70-04 74 BAS70-05 75 BAS70-06 76 BAS70W 73 SOT323 BAS70-04W 74 BAS70-05W 75 BAS70-06W 76 BAS70H AH SOD123FL BAS70D F30 SOD323 BAS70DL S2 SOD323FL BAS70S G8 8,000 PCS SOD523FL BAS70LP S8 10,000 PCS DFN1006-2L 9. Version Version Date File No. Recording Basis A 07-Feb-2018 New Create Market F21837G B 22-Apr-2019 Update Company Info. System 2.0 27-Dec-2021 Update Version System 8. Ordering Information Futurewafer Tech Co., Ltd. 台灣未來芯科技股份有限公司 TEL: +886-3-3350161 / FAX: +886-3-3350172 cherry@futurewafer.com.tw No. 286-11F, Sec. 3, Sanmin Rd., Taoyuan Dist., Taoyuan City 330, Taiwan 9-1. History 9-2. Company Profile