BAS521WT HUIXIN | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 4
Technical content
Features
- AEC-Q101 Qualified
- Small surface mounting type
- High speed
- Suitable for high packing density
- High voltage capability
- Halogen and Antimony Free(HAF), RoHS compliant Application
- Ultra high speed switching Absolute Maximum Ratings (Ta = 25 ℃) Parameter Symbol Value Unit Repetitive Peak Reverse Voltage V RRM 300 V Reverse Voltage V R 300 V Continuous Forward Current I F 225 mA Repetitive Peak Forward Current I FRM 625 mA Non-Repetitive Peak Forward Current tp ≤1 ms tp ≤1 µs IFSM 1 4 A Power Dissipation P tot 250 mW Junction Temperature T j 150 ℃ Storage Temperature Range T stg - 65 to + 150 ℃ Thermal Characteristics Parameter Symbol Value Unit Thermal Resistance Junction to Ambient 1) R θJA 500 ℃/W 1) Device mounted on FR-4 PCB with minimum recommended pad layout. Anode2 Top View Simplified outline SOD-523 and symbol 1 2 PINNING PIN Cathode
DESCRIPTION
a 6GMK1UL4
Characteristics at Ta = 25 ℃ Parameter Symbol Min. Max. Unit Forward Voltage at IF = 100 mA VF - 1.1 V Reverse Breakdown Voltage at IR = 100 µA V(BR)R 300 - V Reverse Current at VR = 250 V IR - 150 nA Reverse Recovery Time at IF = IR = 30 mA, RL = 100 Ω, irr = 0.1 IR trr - 50 ns Total Capacitance at VR = 0 V, f = 1 MHz CT - 5 pF 6GMK2UL4
Electrical Characteristics Curves Fig 1. Total Capacitance vs. Reverse Voltage Fig 3. Forward Characteristics Fig 2. Reverse Characteristics VF, Forward Voltage (V) IF, Forward Current (A) VR, Reverse Voltage (V) IR, Reverse Current (µA) VR, Reverse Voltage (V) CT, Total Capacitance (pF) Fig 4. Power Derating Curve TA, Ambient Temperature(℃) Power Dissipation PD (W) 6GMK3UL4
Plastic surface mounted package SOD-523 Recommended Soldering Footprint E b A C p D A H ∠ ALL ROUND E 0.8 0.6 1.7 UNIT A b p C D E HE V mm 0.77 0.51 0.15 0.08 1.30 1.10 0.85 0.75 1.7 1.5 0.1 O 0.40 50.25 6GMK4UL4