BAS521_15 DIODES | Alldatasheet

Document overview

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Technical content

Features

  • Fast Switching Speed: max. 50 ns
  • High Reverse Breakdown Voltage: 300V
  • Low Leakage Current: 100nA at room temperature
  • Ultra Small Plastic SMD Package
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3) Mechanical Data
  • Case: SOD-523
  • Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0
  • Moisture Sensitivity: Level 1 per J-STD-020
  • Terminal Connections: Cathode Bar
  • Terminals: Finish - Matte Tin annealed over Alloy 42 leadframe.
  • Solderable per MIL-STD-202, Method 208
  • Weight: 0.0014 grams (approximate) Ordering Information (Note 4) Part Number Case Packaging (Note 5) BAS521-7 SOD523 3000/Tape & Reel BAS521-13 SOD523 10000/Tape & Reel Notes: 1. No purposely added lead. Fully EU Directiv e 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 5. Dispensed in every other cavity of the tape. Marking Information To p View Device Schematic 99 = Product Type Marking Code Bar Denotes Cathode Side SOD523

Document number: DS32175 Rev. 5 - 2 2 of 4 www.diodes.com December 2012 © Diodes Incorporated BAS521 Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Repetitive Peak Reverse Voltage VRRM 300 V Working Peak Reverse Voltage DC Blocking Voltage VRWM 300 V Forward Current (Note 6) IF 250 mA Non-Repetitive Peak Forward Surge Current @ t = 1.0µs IFSM 4.5 A Repetitive Peak Forward Current (Note 6) IFRM 1 A Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation (Note 6) PD 325 mW Thermal Resistance Junction to Ambient Air (Note 6) RθJA 385 °C/W Operating and Storage Temperature Range TJ, TSTG -65 to +150 °C Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Min Max Unit Test Condition Reverse Breakdown Voltage (Note 7) V(BR)R 300 ⎯ V IR = 100μA Forward Voltage VF ⎯ 1.1 V IF = 100mA Reverse Current (Note 7) IR 150 100 nA nA μA VR = 5V VR = 250V VR = 250V, TJ = +150°C Total Capacitance CT ⎯ 5 pF VR = 0, f = 1.0MHz Reverse Recovery Time trr ⎯ 50 ns IF = IR = 30mA, Irr = 0.1 x IR, RL = 100Ω Notes: 6. Part mounted on FR-4 board with recommended pad layou t, which can be found on our website at http://www.diodes.com. 7. Short duration pulse test used to minimize self-heating effect. 0 125 175 350 100 200 T , AMBIENT TEMPERATURE ( C) Fig. 1 Power Derating Curve, Total Package A ° P , POWER DISSIPATION (mW)D 25 10050 75 150 150 250 300 Note 6 V , INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 2 Typical Forward Characteristics, Per Element F 0.1 100 1,000I, I NSTANTANEOUS FORWARD CURRENT (mA)F

Document number: DS32175 Rev. 5 - 2 3 of 4 www.diodes.com December 2012 © Diodes Incorporated BAS521 0.1 100 1,000 10,000 100,000 0 50 100 150 200 250 300 V , INSTANTANEOUS REVERSE VOLTAGE (V) Fig. 3 Typical Reverse Characteristics, Per Element R I , INS TANTANEOUS REVERSE CURRENT (nA)R T = - º CA 55 T = 25ºCA T = 5 º CA 8 T = 125ºCA T = 150ºCA 0.2 0.4 0.6 0.8 1.0 1.2 01 02 03 0 4 0 C , TOTAL CAPACITANCE (pF)T Package Outline Dimensions Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version. Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. SOD523 Dim Min Max A 0.25 0.35 B 0.70 0.90 C 1.50 1.70 H 1.10 1.30 K 0.55 0.65 L 0.10 0.30 M 0.10 0.12 All Dimensions in mm Dimensions Value (in mm) G 0.80 X 0.60 X1 2.00 Y 0.70 HC A B K M L Y X G

Document number: DS32175 Rev. 5 - 2 4 of 4 www.diodes.com December 2012 © Diodes Incorporated BAS521 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries rese rve the right to make modifications, enhanc ements, improvements, corrections or ot her changes without further notice to this document and any product descri bed herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or an y product described herein; neither does Di odes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or us er of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated a nd all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthoriz ed sales channel. Should Customers purchase or use Diodes Inco rporated products for any unintended or una uthorized application, Customers shall i ndemnify and hold Diodes Incorporated and its representativ es harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of t his document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical component s in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when proper ly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifi cations of their life support dev ices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or s ystems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporate d and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2012, Diodes Incorporated www.diodes.com