BAS516H-HF COMCHIP | Alldatasheet

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  • Small package. - Fast switching speed. - Surface mount package ldeally suited for automatic lnsertion. - Low reverse current. Comchip Technology CO., LTD. Circuit Diagram Cathode Anode Parameter Unit Peak repetitive reverse voltage VRRM VRM VR(RMS) V V A Symbol Value 100 250 Non-repetitive peak reverse voltage mA Thermal resistance from junction to ambient RθJA °C/W 150 833 Junction temperature TJ Power dissipation PD mW 2Max. Peak forward surge current @t=8.3ms Working peak reverse voltage Storage temperature range TSTG °C-55 ~ +150 IO VRWM VRMS reverse voltage Average rectified output current 150 IFSM - Case: SOD-523 standard package, - Terminals: Solderable per MIL-STD-750, method 2026 Dimensions in inches and (millimeter) SOD-523 0.005(0.135) 0.004(0.100) 0.024(0.60) 0.028(0.70) 0.049(1.25) 0.045(1.15) 0.033(0.85) 0.030(0.75) 0.067(1.70) 0.059(1.50) 0.016(0.40) 0.012(0.30) REV:C Page 1

Comchip Technology CO., LTD. Electrical Characteristics (at TA=25°C unless otherwise noted) Parameter Conditions Min. Max. UnitTyp. Reverse current VR=25V Reverse voltage VIR=100µA 75 VR=75V Forward voltage 0.715 0.855 1.25 V V nA µA V V ns pFTotal capacitance Reverse recovery time VR=0V, f=1MHz IF=IR=10mA, Irr=0.1*IR, RL=100Ω IF=1mA IF=10mA IF=50mA IF=150mA Symbol IR V(BR) VF Ctod trr 0 7525 50 Fig.2 - Reverse Characteristics 10000 1000 100 Reverse Voltage, VR (V) Fig.4 - Power Derating Curve Ambient Temperature, TA (°C) 200 150 100 0 15025 50 75 100 125 Fig.3 - Capacitance Characteristics 0.01 100 0.1 250 Forward Voltage, VF (V) Fig.1 - Forward Characteristics Reverse Voltage, VR (V) 0 205 10 15 0.7 1.1 0.8 0.9 1.0 Capacitance Between Terminals, CT (pF) Ta=100°C Ta=25°C Ta=25°C f=1MHz Forward Current, IF (mA) Reverse Current, IR (nA) Power Dissipation, PD (mW) Rating and Characteristic Curves (BAS516H-HF) REV:C Page 2

Comchip Technology CO., LTD. Reel Taping Specification (For BAS516H-F-HF) Notes: 1. A, B, and C are determined by component size. The clearance between the components and the cavity must be within 0.05mm min. to 0.50mm max. Trailer Device Leader 400mm (min)160mm (min) Direction of Feed B C d D D2D1 SOD-523 SYMBOL (mm) (inch) 1.968 Min. 4.00 ± 0.10 50.00 Min. 13.00 ± 0.50 0.512 ± 0.020 SYMBOL (mm) E F P P0 P1 W 1.75 ± 0.10 0.069 ± 0.004 3.50 ± 0.05 0.138 ±0.002 SOD-523 See Note 1 8.30 Max. 0.315 Max. A 14.40 Max. 0.560 Max. T

0.024 Max

0.60 Max. 1.50 + 0.10 0.059 +0.004 178 ± 2.00 7.008 ± 0.079 P1 d P W F B T C A REV:C Page 3 D1 D2 D 120°

Comchip Technology CO., LTD. Reel Taping Specification (For BAS516H-H-HF) Notes: 1. A, B, and C are determined by component size. The clearance between the components and the cavity must be within 0.05mm min. to 0.50mm max. Trailer Device Leader 400mm (min)160mm (min) Direction of Feed B C d D D2D1 SOD-523 SYMBOL (mm) (inch) 1.968 Min. 4.00 ± 0.10 50.00 Min. 13.00 ± 0.50 0.512 ± 0.020 SYMBOL (mm) E F P P0 P1 W 1.75 ± 0.10 0.069 ± 0.004 3.50 ± 0.05 0.138 ±0.002 SOD-523 See Note 1 8.30 Max. 0.315 Max. A 14.40 Max. 0.560 Max. T 0.60 Max. 1.50 + 0.10 0.059 +0.004 178 ± 2.00 7.008 ± 0.079 P1 d P W F B T C A REV:C Page 4 D1 D2 D 120°

Comchip Technology CO., LTD. Marking Code = Cathode band A 61 Suggested P.C.B. PAD Layout SIZE (inch) 0.056 (mm) 1.42 0.60 0.70 0.024 0.028 SOD-523 A B C D E 2.02 0.82 0.080 0.032 C B A D E Note: 1. The pad layout is for reference purpose only. Part Number BAS516H-F-HF Marking Code A 61. REV:C Page 5 BAS516H-H-HF Standard Packaging Case Type REEL PACK 3,000 8,000 REEL (pcs) Reel Size (inch) SOD-523 BAS516H-F-HF BAS516H-H-HF