BAS516_17 BILIN | Alldatasheet

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Technical content

High Speed Switching Diode B A S 5 1 6 H 0 0 2 www.gmesemi.com R e v . A 1

FEATURES

 Ultra small plastic SMD package.  High switching speed: max.4ns.  Continuous reverse voltage: max.75V.  Repetitive peak reve rse voltage: max.85V  Repetitive peak forward current: max.500mA SOD-523

APPLICATIONS

 High-speed switching in surface mounted circuits.

ORDERING INFORMATION

T y p e N o . M a r k i n g P a c k a g e C o d e BAS516 61 SOD-523 MAXIMUM RATING @ Ta=25℃ unless otherwise specified Parameter Symbol Limits Unit Repetitive peak reverse voltage VRRM 100 V Continuous reverse voltage VR 100 V Continuous forward current IF 250 mA Repetitive forward current IFRM 500 mA Non-repetitive peak forward surge current t=1μs t = 1 m s t = 1 s IFSM 0.5 A Total power dissipation Ptot 200 mW Thermal resistance from junction to soldering point R th j-s 120 K/W Junction temperature Tj 150 ℃ Storage temperature Tstg -65 to +150 ℃ Pb Lead-free

High Speed Switching Diode B A S 5 1 6 H 0 0 2 www.gmesemi.com R e v . A 2 ELECTRICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified Parameter Symbol Min. Max. Unit Conditions Forward voltage V F

0.715 V I F=1mA

0.855 V I F=10mA

1 V I F=50mA

1.25 V I F=150mA

μA VR=25V VR=25V TJ=150℃ μA μA VR=75V VR=75V TJ=150℃ Diode capacitance C d 1 pF V R=0,f=1MHz Reverse recovery time t rr 4 ns I F=10mA,IR=10mA,RL=400Ω TYPICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified

High Speed Switching Diode B A S 5 1 6 H 0 0 2 www.gmesemi.com R e v . A 3

High Speed Switching Diode B A S 5 1 6 H 0 0 2 www.gmesemi.com R e v . A 4 PACKAGE OUTLINE Plastic surface mounted package SOD-523 SOLDERING FOOTPRINT U n i t :mm

PACKAGE INFORMATION

BAS516 SOD-523 3000/Tape&Reel SOD-523 Dim Min Max A 1.1 1..3 B 0.7 0.9 C 0.5 0.7 D 0.3 Typical E 0.15 0.25 J 0.1 Typical K 1.5 1.7 All Dimensions in mm