BAS40 FUTUREWAFER | Alldatasheet

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Technical content

Surface Mount Switching Diode 1 Document No.: F21837S 27-DEC-2021 V 2.1 www.futurewafer.com.tw FQE-001-04 1-1. Feature List

  • For General Purpose Switching Applications
  • Fast Switching Speed
  • Totally Lead-Free & Fully RoHS Compliant
  • Halogen and Antimony Free. “Green” Device
  • High Breakdown Voltage
  • Low Capacitance
  • Low Leakage Current SOT23 1-3. Mechanical Characteristics
  • Molded JEDEC Package: SOT23 / SOT323
  • Packing: Tape and Reel
  • Flammability Rating UL 94V-0
  • Halogen Free
  • JEDEC MSL Classification: Level 1 1-2. Applications
  • Ultra High-Speed Switching
  • Voltage Clamping Parameter Symbol Conditions Values Units Peak Repetitive Reverse Voltage V RRM T J = 25°C 40 V Working Peak Reverse Voltage V RWM DC Reverse Voltage V R Non-repetitive Peak Reverse Voltage V RM Average Forward Current I F - 200 mA Repetitive Peak Forward Current I FRM t p ≤ 1 s; δ ≤ 0.5 Non-repetitive Peak Forward Surge Current I FSM t p ≤ 10 ms 600 Power Dissipation P D - 200 mW Thermal Resistance, Junction-Ambient (Air) R ƟJA - 500 °C/W Operating Temperature Range T J - -55 ~ +150 °C Storage Temperature Range T STG - SOT323 BAS40 BAS40-04 BAS40-05 BAS40-06 1. Synopsis 1-4. Absolute Maximum Ratings

Surface Mount Switching Diode 2 Document No.: F21837S 27-DEC-2021 V 2.1 www.futurewafer.com.tw FQE-001-04 2. Contents

Surface Mount Switching Diode 3 Document No.: F21837S 27-DEC-2021 V 2.1 www.futurewafer.com.tw FQE-001-04 Parameter Symbol Conditions Min. Max. Units Typ. Reverse Breakdown Voltage V BR I R = 10uA 40 - V - Forward Voltage V F I F = 1mA - 0.38 - I F = 40mA - 1.0 - Reverse Recovery Time t rr I F = I T = 10mA, I rr = 1mA, R L = 100Ω - 5.0 nS - Reverse Leakage Current I R V R = 30V, T J = 25°C - 100 nA 20 Junction Capacitance C I/O Pin Capacitance to GND. V dc = 0V, f = 1MHZ - 5.0 pF 4.0 Average Forward Current, I F (A) Forward Voltage, V F (V) T A = 125°C T A = 85°C T A = 25°C Fig 1. Typical Forward Characteristics Fig 2. Reverse Current Reverse Voltage, V R (V) Reverse Current, I R (nA) T A = 25°C T A = 75°C T A = 125°C Fig 3. Typical Junction Capacitance Junction Capacitance (pF) Reverse Voltage, V R (V) Fig 4. Power Derating Curve Case Temperature, T C (°C) Power Dissipation, P D (mW) 3-1. Electrical Characteristics 3. Electrical Property 3-2. Ratings and Characteristics Curve (TA=25°C unless otherwise noted)

Surface Mount Switching Diode 4 Document No.: F21837S 27-DEC-2021 V 2.1 www.futurewafer.com.tw FQE-001-04 4. Soldering Parameters

Surface Mount Switching Diode 5 Document No.: F21837S 27-DEC-2021 V 2.1 www.futurewafer.com.tw FQE-001-04 Unit: mm 5-1. Dimension-SOT23 5-2. PCB Pad Layout Recommendation-SOT23 5. Package Information SOT23 Dim Min. Max. Typ. A 0.37 0.51 0.40 B 1.20 1.40 1.30 C 2.30 2.50 2.40 D 0.89 1.03 0.915 F 0.45 0.60 0.535 G 1.78 2.05 1.83 H 2.80 3.00 2.90 J 0.013 0.10 0.05 K 0.890 1.00 0.975 K1 0.903 1.10 1.025 L 0.45 0.61 0.55 L1 0.25 0.55 0.40 M 0.085 0.150 0.110 a 8° Dim Millimeter C 2.0 X 0.8 X1 1.35 Y 0.9 Y1 2.9

Surface Mount Switching Diode 6 Document No.: F21837S 27-DEC-2021 V 2.1 www.futurewafer.com.tw FQE-001-04 5-3. Dimension-SOT323 5-4. PCB Pad Layout Recommendation-SOT323 SOT323 Dim Min. Max. Typ. A 0.8 1.1 - A1 - 0.1 - bp 0.3 0.4 - c 0.10 0.25 - D 1.8 2.2 - E 1.15 1.35 - e - - 1.3 e1 - - 0.65 HE 2.0 2.2 - Lp 0.15 0.45 - Q 0.13 0.23 - v - - 0.2 w - - 0.2 Unit:mm

Surface Mount Switching Diode 7 Document No.: F21837S 27-DEC-2021 V 2.1 www.futurewafer.com.tw FQE-001-04 6-1. Taping and Reel Specification 6-2. Embossed Carrier Tape Specification 6. Packing Dimension W D D1 E F P P0 P2 t W Value 8 mm 1.5 ±0.1 1.3 Max. 1.75 ±0.1 3.5 ±0.05 ±0.1 ±0.1 ±0.1 0.4 Max. ±0.3 A0 / B0 / Determined by Component Size. The Clearance Between The Component And The Cavity Must Comply to The Rotational and Lateral Movement Requirement Provided in Figures in The “Maximum Component Movement in Tape Pocket” Section. Unit: mm Taping Width Tape Orientation 8mm Direction Of Feed

Surface Mount Switching Diode 8 Document No.: F21837S 27-DEC-2021 V 2.1 www.futurewafer.com.tw FQE-001-04 6-3. Surface Mount Reel Specification Dimension Tape Width Reel Size A B C D N G T Values 8 mm 7” 178 2.0 +0.5/-0 +0.5/-0.2 20.5 ±0.2 8.4 +1.5/-0.0 14.4 6-4. Tape Leader and Trailer Specification Unit: mm

Surface Mount Switching Diode 9 Document No.: F21837S 27-DEC-2021 V 2.1 www.futurewafer.com.tw FQE-001-04 Part Number Symbol Part Number Symbol BAS40 BAS40W BAS40-04 BAS40-04W BAS40-05 BAS40-05W BAS40-06 BAS40-06W 7. Pin Out

Surface Mount Switching Diode 10 Document No.: F21837S 27-DEC-2021 V 2.1 www.futurewafer.com.tw FQE-001-04 Part Number Marking Code Quantity Component Package Packaging Option BAS40 43F 3,000 PCS SOT23 Tape & Reel - 8mm tape / 7”reel BAS40-04 44F BAS40-05 45F BAS40-06 46F BAS40W 43F SOT323 BAS40-04W 44F BAS40-05W 45F BAS40-06W 46F 9. Version Version Date File No. Recording Basis A 07-Feb-2018 New Create Market F21837S B 22-Apr-2019 Update Company Info. System 2.0 22-Apr-2021 Update Version System 2.1 27-Dec-2021 Update Version System 8. Ordering Information Futurewafer Tech Co., Ltd. 台灣未來芯科技股份有限公司 TEL: +886-3-3350161 / FAX: +886-3-3350172 cherry@futurewafer.com.tw No. 286-11F, Sec. 3, Sanmin Rd., Taoyuan Dist., Taoyuan City 330, Taiwan 9-1. History 9-2. Company Profile