BAS40-04 | DigiCamel IC Datasheet

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PDF pages: 21

Technical content

1.1 General description

Table 1. Product overview

1.2 Features

1.3 Applications

1.4 Quick reference data

Table 2. Quick reference data Table 3. Pinning

BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved. [1] T j =2 5 °C prior to surge. Table 5. Marking codes Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).

BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved. [2] Reflow soldering is the only recommended soldering method. [3] Soldering point at pins 2, 3, 5 and 6. Table 7. Thermal characteristics Table 8. Characteristics Tamb =2 5 °C unless otherwise specified.

BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 08 — 13 January 2010 8 of 21 NXP Semiconductors BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes (1) T amb = 125 °C (2) T amb =8 5 °C (3) T amb =2 5 °C (4) T amb = −40 °C (1) T amb = 125 °C (2) T amb =8 5 °C (3) T amb =2 5 °C Fig 1. Forward current as a function of forward voltage; typical values Fig 2. Reverse current as a function of reverse voltage; typical values f=1 0k H z T amb =2 5 °C; f = 1 MHz Fig 3. Differential resistance as a function of forward current; typical values Fig 4. Diode capacitance as a function of reverse voltage; typical values 102 10−1 10−2 mlc361 0.6 0.80.40.2 1 VF (V) IF (mA) (1) (2) (3) (4) 103 102 10−1 10−2 mlc362 2010 40 30 VR (V) IR (μA) (1) (2) (3) mlc364 103 10−1 10211 0 102 rdif (Ω) IF (mA) 01 0 2 0 4 0 30 mlc363 VR (V) Cd (pF)

BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 08 — 13 January 2010 9 of 21 NXP Semiconductors BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes 8. Package outline Fig 5. Package outline SOD323 (SC-76) Fig 6. Package outline SOD523 (SC-79) Fig 7. Package outline SOT23 (TO-236AB) Fig 8. Package outline SOD123F Fig 9. Package outline SOD882 Fig 10. Package outline SOT323 (SC-70) 03-12-17Dimensions in mm 0.25 0.10 0.45 0.152.7 2.3 1.8 1.6 0.40 0.25 1.1 0.8 1.35 1.15 02-12-13Dimensions in mm 1.65 1.55 1.25 1.15 0.17 0.11 0.34 0.26 0.65 0.58 0.85 0.75 04-11-04Dimensions in mm 0.45 0.15 1.9 1.1 0.9 3.0 2.8 2.5 2.1 1.4 1.2 0.48 0.38 0.15 0.09 04-11-29Dimensions in mm 1.2 1.0 0.25 0.10 3.6 3.4 2.7 2.5 0.55 0.35 0.70 0.55 1.7 1.5 03-04-17Dimensions in mm 0.55 0.47 0.65 0.62 0.55 0.50 0.46 cathode marking on top side 1.02 0.95 0.30 0.22 0.30 0.22 04-11-04Dimensions in mm 0.45 0.15 1.1 0.8 2.2 1.8 2.2 2.0 1.35 1.15 1.3 0.4 0.3 0.25 0.10

BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 08 — 13 January 2010 10 of 21 NXP Semiconductors BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes Fig 11. Package outline SOT143B Fig 12. Package outline SOT363 (SC-88) Fig 13. Package outline SOT416 (SC-75) Fig 14. Package outline SOT666 04-11-16Dimensions in mm 3.0 2.8 1.1 0.9 2.5 2.1 1.4 1.2 1.7 1.9 0.48 0.38 0.15 0.09 0.45 0.15 0.88 0.78 06-03-16Dimensions in mm 0.25 0.10 0.3 0.2 pin 1 index 1.3 0.65 2.2 2.0 1.35 1.15 2.2 1.8 1.1 0.8 0.45 0.15 13 2 465 04-11-04Dimensions in mm 0.95 0.60 1.8 1.4 1.75 1.45 0.9 0.7 0.25 0.10 0.30 0.15 3 0.45 0.15 Dimensions in mm 04-11-08 1.7 1.5 1.7 1.5 1.3 1.1 0.18 0.08 0.27 0.170.5 pin 1 index 123 456 0.6 0.5 0.3 0.1

BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 08 — 13 January 2010 12 of 21 NXP Semiconductors BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes 10. Soldering Dimensions in mm Fig 15. Reflow soldering footprint SOD323 (SC-76) Dimensions in mm Fig 16. Wave soldering footprint SOD323 (SC-76) Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 17. Reflow soldering footprint SOD523 (SC-79) msa433 1.65 0.50 (2×) 2.10 1.60 2.80 0.60 3.05 0.500.95 solder lands solder resist occupied area solder paste msa415 1.40 4.40 5.00 1.202.75 preferred transport direction during soldering solder lands solder resist occupied area mgs343 1.80 1.90 0.30 0.40 0.501.20 0.60 2.15 solder lands solder resist occupied area solder paste

BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 08 — 13 January 2010 13 of 21 NXP Semiconductors BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes Dimensions in mm Fig 18. Reflow soldering footprint SOT23 (TO-236AB) Dimensions in mm Fig 19. Wave soldering footprint SOT23 (TO-236AB) MSA439 1.00 0.60 (3x) 1.30 2.50 3.00 0.85 2.70 2.90 0.50 (3x) 0.60 (3x) 3.30 0.85 solder lands solder resist occupied area solder paste MSA427 4.004.60 2.80 4.50 1.20 3.40 1.20 (2x) preferred transport direction during soldering solder lands solder resist occupied area

BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 08 — 13 January 2010 14 of 21 NXP Semiconductors BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 20. Reflow soldering footprint SOD123F Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 21. Reflow soldering footprint SOD882 1.6 1.6 2.9 4.4 1.1 1.22.1 1.1 (2×) solder lands solder resist occupied area solder paste mbl872 1.30 0.60 (2×) 0.70 (2×) 0.80 (2×)0.90 0.30 (2×) 0.40 (2×) 0.50 (2×) solder lands solder resist occupied area solder paste

BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 08 — 13 January 2010 15 of 21 NXP Semiconductors BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes Fig 22. Reflow soldering footprint SOT323 (SC-70) Fig 23. Wave soldering footprint SOT323 (SC-70) msa429 0.852.35 0.55 (3×) 1.3250.75 2.40 2.65 1.30 0.60 (3×) 0.50 (3×) 1.90 solder lands solder resist occupied area solder paste Dimensions in mm msa419 4.00 4.60 2.103.65 1.15 2.70 1 0.90 (2×) preferred transport direction during soldering solder lands solder resist occupied area Dimensions in mm

BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 08 — 13 January 2010 16 of 21 NXP Semiconductors BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes Dimensions in mm Fig 24. Reflow soldering footprint SOT143B Fig 25. Wave soldering footprint SOT143B msa441 0.60 (4x) 1.30 2.50 3.002.70 0.50 (3x) 0.60 (3x) 3.25 0.90 1.00 solder lands solder resist occupied area solder paste msa422 4.00 4.60 1.20 (3×) 4.45 1.15 3.40 1.00 preferred transport direction during soldering solder lands solder resist occupied area Dimensions in mm

BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 08 — 13 January 2010 17 of 21 NXP Semiconductors BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes Fig 26. Reflow soldering footprint SOT363 (SC-88) Fig 27. Wave soldering footprint SOT363 (SC-88) solder lands solder resist occupied area solder paste sot363_fr 2.65 2.35 0.4 (2×) 0.6 (2×) 0.5 (4×) 0.5 (4×) 0.6 (4×) 0.6 (4×) 1.5 1.8 Dimensions in mm sot363_fw solder lands solder resist occupied area preferred transport direction during soldering 5.3 1.3 1.3 1.5 0.3 1.5 4.5 2.45 2.5 Dimensions in mm

BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 08 — 13 January 2010 18 of 21 NXP Semiconductors BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes Fig 28. Reflow soldering footprint SOT416 Reflow soldering is the only recommended soldering method. Fig 29. Reflow soldering footprint SOT666 solder resist occupied area solder lands solder pasteDimensions in mm msa438 2.0 0.6 (3x) 0.7 1.5 1.1 2.2 0.5 (3x) 0.85 0.6 1.9 solder lands placement area occupied area solder paste sot666_fr 2.75 2.45 2.1 1.6 0.4 (6×) 0.55 (2×) 0.25 (2×) 0.6 (2×) 0.65 (2×) 0.3 (2×) 0.325 (4×) 0.45 (4×) 0.5 (4×) 0.375 (4×) 1.72 1.7 1.075 0.538 Dimensions in mm

Figure 12 “Package outline SOT363 (SC-88)”: updated
Figure 16 “Wave soldering footprint SOD323 (SC-76)”: updated
Figure 17 “Reflow soldering footprint SOD523 (SC-79)”: updated
Figure 21 “Reflow soldering footprint SOD882”: updated
Figure 22 “Reflow soldering footprint SOT323 (SC-70)”: updated
Figure 23 “Wave soldering footprint SOT323 (SC-70)”: updated
Figure 25 “Wave soldering footprint SOT143B”: updated
Figure 26 “Reflow soldering footprint SOT363 (SC-88)”: updated
Figure 27 “Wave soldering footprint SOT363 (SC-88)”: updated
Figure 28 “Reflow soldering footprint SOT416”: updated
Figure 29 “Reflow soldering footprint SOT666”: updated BAS40_1PSXXSB4X_SER_7 20060512 Product data sheet - BAS40_1PSXXSB4X_SER_6 BAS40_1PSXXSB4X_SER_6 20050809 Product data sheet - 1PS70SB40_3 1PS75SB45_2 1PS76SB40_3 1PS79SB40_2 1PS88SB48_3 BAS40H_1 BAS40L_1 BAS40-05V_1 BAS40-07V_1 BAS40W_3 BAS40_SERIES_5 1PS70SB40_3 19990426 Product specification - 1PS70SB40_2 1PS75SB45_2 19990426 Product specification - 1PS75SB45_1 1PS76SB40_3 20040126 Product specification - 1PS76SB40_2 1PS79SB40_2 19990426 Product specification - 1PS79SB40_1 1PS88SB48_3 20021107 Product specification - 1PS88SB48_2 BAS40H_1 20050425 Produ ct data sheet - - BAS40L_1 20030520 Product specification - - BAS40-05V_1 20021121 Produ ct specification - - BAS40-07V_1 20020327 Product specification - - BAS40W_3 19990426 Product specification - BAS40W_2 BAS40_SERIES_5 20011010 Produ ct specification - BAS40_4

BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 08 — 13 January 2010 20 of 21 NXP Semiconductors BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes 12. Legal information

12.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

12.2 Definitions

Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

12.3 Disclaimers

General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.

12.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This docu ment contains the product specification.

NXP Semiconductors BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 13 January 2010 Document identifier: BAS40_1PSXXSB4X_SER_8 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 14. Contents

Product Information

BAS40-04 specifications and overview.

Summary

General-purpose Schottky diodes Rev. 08-13 January 2010

Description

General-purpose Schottky diodes Rev. 08-13 January 2010

Source title BAS40-04 Datasheet(PDF) - NXP Semiconductors

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