BAS316 SKTECHNOLGY | Alldatasheet
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Technical content
DESCRIPTION
Simplified outline SOD-323 and symbol Non-reptitive Peak Forward Surge Current Parameter Maximum Repetitive Peak Reverse Voltage Maximum RMS voltage Operating and Storage Temperature Range Continuous Forward Current VRRM VRMS IF IFSM Ptot 100 V 75 V 300 -55 ~ +150 A mW Units T , Tj stg Symbols
FEATURES
▪ For surface mounted applications ▪ Glass Passivated Chip Junction ▪ Fast reverse recovery time ▪ Ideal for automated placement ▪ Lead free in comply with EU RoHS 2011/65/EU directives MECHANICAL DATA ▪Case: SOD-323 ▪Terminals: Solderable per MIL-STD-750, Method 2026 ▪ pprox. Weight: 5.48mg / 0.00019oz A mA at 1ms 4 Absolute Maximum Ratings at 25 °C Total Power Dissipation 400 Characteristics at T = 25 °Ca Parameter Reverse Voltage Breakdown at I =1R μA V(BR)R 75 V Units Symbols BAS316 Maximum Forward Voltage VF Vat 150 m A 1.1 at V =75V T =25R j at V =75V T =150R j IR 50 μA 5 pFCjTypical Junction Capacitance Maximum Reverse Recovery Time nstrr Typical 6 BAS316 Peak Reverse Current （1）Measured with IF = 0.5 A, IR = 1 A, Irr = 0.25 A (1) BAS316 1 of 3 REV.08
0.0 25 50 75 100 125 150 175 Fig.1 Forward Current Derating Curve Total Power Dissipation (mW) Ambient Temperature (°C) Fig.3 Typical Instaneous Forward Characteristics Instaneous Forward Current (mA) 1.0 1000 Instaneous Forward Voltage (V) Fig.2 Typical Reverse Characteristics 0.01 0.1 100 20 40 60 80 100 12000 percent of Rated Peak Voltage (%)Reverse Instaneous Current（ A）Reverse μ Fig.4 Typical Junction Capacitance Junction Capacitance ( pF) 1.0 10 1000.1 100 Reverse Voltage (V) T =25J °C T =25J °C T =150J °C 0.8 1.0 1.6 100 T =25J °C 2 of 3 REV.08 BAS316
Plastic surface mounted package; 2 leads SOD-323 UNIT mm max min mil max min 5.9 3.1 108 100 A C D E E1 ∠ 0.4 0.25 9.8 b A1 0.45 0.2 7.9 0.2 SOD-323 mechanical dataSOD-323 mechanical data b D EE A ∠ALL ROUND C The recommended mounting pad size 1.4 (55) 1.2 (47) mm (mil)Unit： 1.2 (47) 1.2 (47) 3 of 3 REV.08 BAS316