BAS20L

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Document overview

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Technical content

Features

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant
• S and NSV Prefixes for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable MAXIMUM RATINGS Rating Symbol Value Unit Continuous Reverse Voltage BAS19, NSVBAS19 BAS20, SBAS20 BAS21, SBAS21 VR 120 200 250 Vdc Repetitive Peak Reverse Voltage BAS19, NSVBAS19 BAS20, SBAS20 BAS21, SBAS21 VRRM 120 200 250 Vdc Continuous Forward Current IF 200 mAdc Peak Forward Surge Current IFM(surge) 625 mAdc Junction and Storage Temperature Range TJ, Tstg −55 to +150 Power Dissipation (Note 1) PD 385 mW Electrostatic Discharge ESD HM < 500 MM < 400 V V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. HIGH VOLTAGE SWITCHING DIODE CATHODE ANODE MARKING DIAGRAMS http://onsemi.com CATHODE ANODE CATHODE ANODE SOT−23 (TO−236) CASE 318 STYLE 8 SC−88A (SOT−353) CASE 419A SOT−23 SC−88A

ORDERING INFORMATION

See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. Jx M /C0071 /C0071 x = P, R, or S P = BAS19L, NSVBAS19L R = BAS20L, SBAS20L S = BAS21L, SBAS21L or BAS21DW5, SBAS21DW5 M = Date Code /C0071 = Pb−Free Package Jx M /C0071 /C0071 321 *Date Code orientation and/or overbar may vary depending upon the manufacturing location. (Note: Microdot may be in either location)

BAS19L, NSVBAS19L, BAS20L, SBAS20L, BAS21L, SBAS21L, BAS21DW5, SBAS21DW5 http://onsemi.com THERMAL CHARACTERISTICS (SOT−23) Characteristic Symbol Max Unit Total Device Dissipation FR−5 Board (Note 2) TA = 25°C Derate above 25°C PD 225 1.8 mW mW/°C Thermal Resistance Junction−to−Ambient (SOT−23) R/C0113JA 556 °C/W Total Device Dissipation Alumina Substrate (Note 3) TA = 25°C Derate above 25°C PD 300 2.4 mW mW/°C Thermal Resistance Junction−to−Ambient R/C0113JA 417 °C/W Junction and Storage Temperature Range TJ, Tstg −55 to +150 °C THERMAL CHARACTERISTICS (SC−88A) Characteristic Symbol Max Unit Power Dissipation (Note 4) PD 385 mW Thermal Resistance − Junction−to−Ambient Derate Above 25°C R/C0113JA 328 3.0 °C/W mW/°C Maximum Junction Temperature TJmax 150 °C Operating Junction and Storage Temperature Range TJ, Tstg −55 to +150 °C ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Min Max Unit Reverse Voltage Leakage Current (VR = 100 Vdc) BAS19, NSVBAS19 (VR = 150 Vdc) BAS20, SBAS20 (VR = 200 Vdc) BAS21, SBAS21 (VR = 100 Vdc, TJ = 150°C) BAS19 (VR = 150 Vdc, TJ = 150°C) BAS20, SBAS20 (VR = 200 Vdc, TJ = 150°C) BAS21, SBAS21 IR 0.1 0.1 0.1 100 100 100 /C0109Adc Reverse Breakdown Voltage (IBR = 100 /C0109Adc) BAS19, NSVBAS19 (IBR = 100 /C0109Adc) BAS20, SBAS20 (IBR = 100 /C0109Adc) BAS21, SBAS21 V(BR) 120 200 250 Vdc Forward Voltage (IF = 100 mAdc) (IF = 200 mAdc) VF 1.0 1.25 Vdc Diode Capacitance (VR = 0, f = 1.0 MHz) CD − 5.0 pF Reverse Recovery Time (IF = IR = 30 mAdc, IR(REC) = 3.0 mAdc, RL = 100) trr − 50 ns

BAS19L, NSVBAS19L, BAS20L, SBAS20L, BAS21L, SBAS21L, BAS21DW5, SBAS21DW5 http://onsemi.com Device Package Shipping† BAS19LT1G SOT−23 (Pb−Free) 3000 / Tape & Reel BAS19LT3G SOT−23 (Pb−Free) 10000 / Tape & Reel NSVBAS19LT1G* SOT−23 (Pb−Free) 3000 / Tape & Reel BAS20LT1G SOT−23 (Pb−Free) 3000 / Tape & Reel BAS20LT3G SOT−23 (Pb−Free) 10000 / Tape & Reel SBAS20LT1G* SOT−23 (Pb−Free) 3000 / Tape & Reel BAS21LT1G SOT−23 (Pb−Free) 3000 / Tape & Reel SBAS21LT1G* SOT−23 (Pb−Free) 3000 / Tape & Reel BAS21LT3G SOT−23 (Pb−Free) 10000 / Tape & Reel SBAS21LT3G* SOT−23 (Pb−Free) 10000 / Tape & Reel BAS21DW5T1G SC−88A (Pb−Free) 3000 / Tape & Reel SBAS21DW5T1G* SC−88A (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *S and NSV Prefixes for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable.

BAS19L, NSVBAS19L, BAS20L, SBAS20L, BAS21L, SBAS21L, BAS21DW5, SBAS21DW5 http://onsemi.com PACKAGE DIMENSIONS SOT−23 (TO−236) CASE 318−08 ISSUE AP D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. /C0466mm inches/C0467SCALE 10:1 0.8 0.031 0.9 0.035 0.95 0.0370.95 0.037 2.0 0.079 SOLDERING FOOTPRINT* VIEW C L 0.25 /C0113 e E E b A SEE VIEW C DIM A MIN NOM MAX MIN MILLIMETERS 0.89 1.00 1.11 0.035 INCHES A1 0.01 0.06 0.10 0.001 b 0.37 0.44 0.50 0.015 c 0.09 0.13 0.18 0.003 D 2.80 2.90 3.04 0.110 E 1.20 1.30 1.40 0.047 e 1.78 1.90 2.04 0.070 L 0.10 0.20 0.30 0.004 0.040 0.044 0.002 0.004 0.018 0.020 0.005 0.007 0.114 0.120 0.051 0.055 0.075 0.081 0.008 0.012 NOM MAX H c STYLE 8: PIN 1. ANODE 2. NO CONNECTION 3. CATHODE *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

BAS19L, NSVBAS19L, BAS20L, SBAS20L, BAS21L, SBAS21L, BAS21DW5, SBAS21DW5 http://onsemi.com PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A −01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. DIM A MIN MAX MIN MAX MILLIMETERS 1.80 2.200.071 0.087 INCHES B 1.15 1.350.045 0.053 C 0.80 1.100.031 0.043 D 0.10 0.300.004 0.012 G 0.65 BSC0.026 BSC J 0.10 0.250.004 0.010 K 0.10 0.300.004 0.012 N 0.20 REF0.008 REF S 2.00 2.200.079 0.087 B0.2 (0.008) MM 12 3 A G S D 5 PL H C N J K −B− SC−88A (SC−70−5/SOT−353) CASE 419A−02 ISSUE K /C0466mm inches/C0467SCALE 20:1 0.65 0.025 0.65 0.025 0.50 0.0197 0.40 0.0157 1.9 0.0748 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 BAS19LT1/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative