BAS116 DSK | Alldatasheet
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Technical content
Surface mount switching diode B A S 1 1 6
FEATURES
z Low leakage current applications. z Medium speed switching times. z Surface mount package idea lly suited for automatic Insertion.
APPLICATIONS
z High speed switching application. SOT-23
ORDERING INFORMATION
Type No. Marking Package Code B A S 1 1 6 J V S O T - 2 3 MAXIMUM RATING @ Ta=25℃ unless otherwise specified Characteristic Symbol Limits Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Reverse Voltage V RRM V RWM V R 85 V RMS Reverse Voltage V R(RMS) 60 V Forward Continuous Current I FM 215 mA Repetitive Peak Forward Current I FRM 500 mA Non-Repetitive Peak Forward Surge Current @ t = 1 . 0 μs @ t = 1 . 0 m s @ t = 1 . 0 s I FSM 4.0 1.0 0.5 A Power Dissipation P d 250 mW Thermal Resistance Junction to Ambient Air R θJA 500 ℃/W Operating Junction Temperature Range T j 150 ℃ Storage Temperature Range T STG -65 to +150 ℃ Pb Lead-free Diode Semiconductor Korea www.diode.kr
Surface mount switching diode B A S 1 1 6
ELECTRICAL CHARACTERISTICS
@ Ta=25℃ unless otherwise specified Characteristic Symbol Mi n Typ MAX UNIT Test Condition Reverse Breakdown Voltage V (BR)R 85 - - V I R = 100μA Forward Voltage V FM - - 0.9 1.0 1.1 1.25 V I F =1mA I F =10mA I F =50mA I F =150mA Reverse Leakage Current I R - - 5.0 nA V R =75V Junction Capacitance C j - 2 - pF V R =0V,f=1.0MHz Reverse Recovery Time t rr - - 3 ns I F R =10mAI rr =0.1*I R TYPICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified www.diode.kr Diode Semiconductor Korea
Surface mount switching diode B A S 1 1 6 PACKAGE OUTLINE Plastic surface mounted package SOT-23 SOLDERING FOOTPRINT Unit : mm
PACKAGE INFORMATION
BAS116 SOT-23 3000/Tape&Reel SOT-23 Dim Min Max A 2.85 2.95 B 1.25 1.35 C 1.0Typical D 0.37 0.43 E 0.35 0.48 G 1.85 1.95 H 0.02 0.1 J 0.1Typical K 2.35 2.45 All Dimensions in mm www.diode.kr Diode Semiconductor Korea