BAL99

BAL99

Document overview

• Manufacturer or author: Diodes Incorporated
• PDF pages: 5

Technical content

Features

• Fast Switching Speed: maximum of 4ns
• Low-Forward Voltage: maximum of 0.715V at 1mA
• Low Capacitance: maximum of 2pF
• Surface-Mount Package Ideally Suited for Automated Insertion
• For General Purpose Switching Applications
• Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
• Halogen and Antimony Free. “Green” Device (Note 3)
• For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative. https://www.diodes.com/quality/product-definitions/ Mechanical Data
• Package: SOT23
• Package Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminals: Solderable per MIL-STD-202, Method 208. Lead Free Plating (Matte Tin Finish Annealed over Alloy 42 Leadframe)
• Polarity: See Diagram
• Weight: 0.008 grams (Approximate) Ordering Information (Notes 4 & 5) Orderable Part Number Package Packing Qty. Carrier BAL99-7-F SOT23 3000 Tape & Reel Notes: 1. EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. All applicable RoHS exemptions applied. 2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen - and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl ) and <1000ppm antimony compounds. 4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes -packaging/. 5. Product manufactured with Date Code V8 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code V8 are built with Non-Green Molding Compound and may contain Halogens or Sb 2O3 Fire Retardants. Marking Information Date Code Key Year 1998 - 2024 2025 2026 2027 2028 2029 2030 2031 2032 2033 Code J - L M N P R S T U V W Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec Code 1 2 3 4 5 6 7 8 9 O N D TOP VIEW SOT23 Internal Schematic TOP VIEW JF, KJF = Product Type Marking Code YM = Date Code Marking Y = Year (ex: L = 2024) M = Month (ex: 9 = September) A Bar around the Date Code Marking Denotes Assembly Site Green KJF YM

Document number: DS12009 Rev. 18 - 2 2 of 5 www.diodes.com November 2024 © 2024 Copyright Diodes Incorporated. All Rights Reserved. BAL99 Maximum Ratings (@TA = +25° C, unless otherwise specified.) Characteristic Symbol Value Unit Non-Repetitive Peak Reverse Voltage VRM 100 V Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 75 V RMS Reverse Voltage VR(RMS) 53 V Forward Continuous Current (Note 6) IFM 300 mA Non-Repetitive Peak Forward Surge Current @ t = 1.0µs @ t = 1.0s IFSM 2.0 1.0 A Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation (Note 6) PD 350 mW Thermal Resistance Junction to Ambient Air (Note 6) RθJA 357 °C/W Operating and Storage Temperature Range TJ, TSTG -65 to +150 °C Electrical Characteristics (@TA = +25° C, unless otherwise specified.) Characteristic Symbol Min Max Unit Test Condition Reverse Breakdown Voltage (Note 7) V(BR)R 75 ⎯ V IR = 100µA Forward Voltage VF ⎯ 0.715 0.855 1.0 1.25 V IF = 1.0mA IF = 10mA IF = 50mA IF = 150mA Reverse Current (Note 7) IR ⎯ 2.5 µA µA µA nA VR = 75V VR = 75V, TJ = +150°C VR = 25V, TJ = +150°C VR = 20V Total Capacitance CT ⎯ 2.0 pF VR = 0, f = 1.0MHz Reverse Recovery Time tRR ⎯ 4.0 ns IF = IR = 10mA, IRR = 0.1 x IR, RL = 100Ω Notes: 6. Part mounted on FR-4 board with 1 inch square, 2oz copper pad layout. 7. Short duration pulse test used to minimize self-heating effect.

Document number: DS12009 Rev. 18 - 2 4 of 5 www.diodes.com November 2024 © 2024 Copyright Diodes Incorporated. All Rights Reserved. BAL99 Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. SOT23 J K1 K GAUGE PLANE 0.25 H L M All 7° A C B D GF a SOT23 Dim Min Max Typ A 0.37 0.51 0.40 B 1.20 1.40 1.30 C 2.30 2.50 2.40 D 0.89 1.03 0.915 F 0.45 0.60 0.535 G 1.78 2.05 1.83 H 2.80 3.00 2.90 J 0.013 0.10 0.05 K 0.890 1.00 0.975 K1 0.903 1.10 1.025 L 0.45 0.61 0.55 L1 0.25 0.55 0.40 M 0.085 0.150 0.110 a 0° 8° -- All Dimensions in mm Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. SOT23 X Y Y1 C Dimensions Value (in mm) C 2.0 X 0.8 X1 1.35 Y 0.9 Y1 2.9

Document number: DS12009 Rev. 18 - 2 5 of 5 www.diodes.com November 2024 © 2024 Copyright Diodes Incorporated. All Rights Reserved. BAL99 IMPORTANT NOTICE 1. DIODES INCORPORATED (Diodes) AND ITS SUBSIDIARIES MAKE NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO ANY INFORMATION CONTAINED IN THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON -INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 2. The Information contained herein is for informational purpose only and is provided only to il lustrate the operation of Diodes ’ products described herein and application examples. Diodes does not assume any liability arising out of the application or use of this document or any product described herein. This document is intended for skilled an d technically trained engineering customers and users who design with Diodes ’ products. Diodes’ products may be used to facilitate safety-related applications; however, in all instances customers and users are responsible for (a) selecting the appropriate Diodes products for their applications, (b) evaluating the suitability of Diodes’ products for their intended applications, (c) ensuring their applications, which incorporate Diodes’ products, comply the applicable legal and regulatory requirements as well as safety and functional-safety related standards, and (d) ensuring they design with appropriate safeguards (including testing, validation, quality co ntrol techniques, redundancy, malfunction prevention, and appropriate treatment for aging degradation) to mini mize the risks associated with their applications. 3. Diodes assumes no liability for any application -related information, support, assistance or feedback that may be provided by Diodes from time to time. Any customer or user of this document or p roducts described herein will assume all risks and liabilities associated with such use, and will hold Diodes and all companies whose products are represented herein or on Diodes’ websites, harmless against al l damages and liabilities. 4. Products described herein may be covered by one or more United States, international or foreign patents and pending patent applications. Product names and markings noted herein may also be covered by one or more United States, international or fore ign trademarks and tra demark applications. Diodes does not convey any license under any of its intellectual property rights or the rights of any third parties (including third parties whose products and services may be described in this document or on Diodes’ website) under this document. 5. Diodes’ products are provided subject to Diodes’ Standard Terms and Conditions of Sale (https://www.diodes.com/about/company/terms-and-conditions/terms-and-conditions-of-sales/) or other applicable terms. This document does not alter or expand the applicable warranties provided by Diodes. Diodes does not warrant or accept any liability whatsoever in r espect of any products purchased through unauthorized sales channel. 6. Diodes’ products and technology may not be used for or incorporated into any products or systems whose manufacture, use or sale is prohibited under any applicable laws and regulations. Should customers or users use Di odes’ products in contravention of any applicable laws or regulations, or for any unintended or unauthorized application, customers and users will (a) be solely responsible for any da mages, losses or penalties arising in connection therewith or as a result ther eof, and (b) indemnify and hold Diodes and its representatives and agents harmless against any and all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim relating to any noncompliance with the applicable laws and regulations, as well as any unintended or unauthorized application. 7. While efforts have been made to ensure the information contained in this document is accurate, complete and current, it may c ontain technical inaccuracies, omissions and typographical errors. Diodes does not warrant that information contained in this document is error -free and Diodes is under no obligation to update or otherwise correct this information. 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