BAL-CC1101-01D3 STMICROELECTRONICS | Alldatasheet

Document overview

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Technical content

Features

 50 Ω nominal input / conjugate match to CC1101 / CC1150  Low insertion loss  Low amplitude imbalance  Low phase imbalance  Coated Flip-Chip on glass  Small footprint: < 2.1 mm² Benefits  Extremely low profile (< 550 µm after reflow)  High RF performance  RF BOM and area reduction

Description

STMicroelectronics BAL-CC1101-01D3 is an ultra miniature balun which integrates a matching network in a monolithic glass substrate. This has been customized for the CC1101 / CC1150 TI transceiver. It’s a design using STMicroelectronics IPD (integrated passive device) technology on non- conductive glass substrate to optimize RF performance. Figure 1. Application schematic

1 Characteristics

Table 1. Absolute maximum rating (limiting values) Table 2. Electrical characteristics - RF performance (Tamb = 25 °C)

1.1 Measurements

Figure 2. Transmission (S21) Figure 3. Insertion loss in band Figure 4. Return loss single-ended Figure 5. Return loss differential Figure 6. Phase imbalance Figure 7. Amplitude imbalance

Figure 8. H2 attenuation Figure 9. H3 attenuation

2 Package information

specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.

2.1 Flip-Chip pa ckage information

Figure 10. Flip-Chip package outline Table 3. Flip-Chip package mechanical data

Figure 17. Flip Chip tape and reel specifications

3 Ordering information

4 Revision history

Table 4. Ordering information Table 5. Document revision history 02-May-2016 3 Updated Figure 10 and Table 3.