B5817WL SKTECHNOLGY | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 4

Technical content

Features

  • Metal silicon junction, majority carrier conduction
  • Guarding for overvoltage protection
  • Low power loss, high efficiency
  • High current capability
  • low forward voltage drop
  • High surge capability
  • For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications Maximum Ratings and Electrical characteristics Ratings at ambient temperature unless otherwise specified.25 °C 20 30 40 Peak Forward Surge Current, 8.3ms Single Half Sine-wave Superimposed On Rated Load (JEDEC method) at TL = 70°C Maximum Instantaneous Forward Voltage at 1 A Maximum Instantaneous Forward Voltage at 3.1 A Maximum Instantaneous Reverse Current at Rated DC Reverse Voltage TA = 100°C TA = 25°C Storage and Operating Junction Temperature Range 0.55 0.875 0.45 0.75 0.6 0.9 PINNING PIN

DESCRIPTION

Weight：17mg，0.0006 oz Simplified outline SOD-123FL and symbol B5817WL B5818WL B5819WL B5817WL THRU B5819WL 1 of 4 REV.08

Fig.1 Forward Current Derating Curve 0.2 0.4 0.6 0.8 1.0 1.2 0.0 20 40 60 80 100 120 140 Average Forward Current (A) Lead Temperature (°C) Single phase half-wave 60 Hz resistive or inductive load 10 100 Fig.5 Maximum Non-Repetitive Peak Forward Surage Current Peak A)Forward Surage Current ( Number of Cycles at 50Hz 8.3 ms Single Half Sine Wave (JEDEC Method) 0.1 0 0.4 0.5 0.7 Fig.3 Typical Forward Characteristic Instaneous Forward Current (A) Instaneous Forward Voltage (V) 0.1 1.0 T =25 J T =125 J 0.2 0.5 0.3 0.60.2 Fig.2 Typical Reverse Characteristics Instaneous Current ( μA)Reverse 20 40 60 800 T =25J °C T =75J °C T =125J °C Percent of Rated Peak Reverse Voltage（%） 100 100 101 102 103 104 Fig.4 Typical Junction Capacitance 0.1 Junction Capacitance ( pF) Reverse Voltage (V) 100 200 500 1001 0.01 100 0.1 100 Fig.6- Typical Transient Thermal Impedance Transient Thermal Impedance（ /W）°C t, Pulse Duration（sec） 0.1 1 10 B5817WL THRU B5819WL 2 of 4 REV.08

Plastic surface mounted package; 2 leads SOD123FL A A C ∠ALL ROUND V AM e UNIT mm max min mil max min 7.9 4.7 114 102 150 138 A C D E HE ∠ 1.1 0.8 e Bottom View HE ∠ALL ROUND E D E g pad pad Top View 0.9 0.7 g g The recommended mounting pad size 2.0 (79) 1.2 (47) mm (mil)Unit： 1.2 (47) 1.2 (47) B5817WL THRU B5819WL 3 of 4 REV.08

Recommended condition of flow soldering 2 to 5 min more than 1 min less than 10s 100°C 120°C 245°C 265°C Temperature of Soldering (°C) Preliminary Heating Soldering Cooling (in air) 100 150 200 250 300 Recommended condition of reflow soldering Recommended peak temperature is over 245 °C. If peak temperature is below 245 °C, you may adjust the following parameters; time length of peak temperature (longer), time length of soldering (longer), thickness of solder paste (thicker) Temperature: 320°C Time: 3s max. Times: one time

  • Condition of hand soldering
  • Remark: Lead free solder paste (96.5Sn/3.0Ag/0.5Cu) Temperature of Soldering (°C) Pre Heating Rate 1 to 5°C / s Preliminary Heating 130 to 170°C, 50 to 120s Soldering 230°C 20 to 30s Cooling more than 60s Reflow Heating Rate 1 to 5°C / s Peak Temperature 245 to 260°C, 10s max. 100 150 200 250 300 2 times max. 4 of 4 REV.08 B5817WL THRU B5819WL