B57451V5333H062

B57442V5472H062 EPCOS | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 19

Technical content

for automotive, case size 0805 (2012) Series/Type: B574**V5 Date: February 2009 © EPCOS AG 2009. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.

1) Depends on mounting situation

Applications

Temperature measurement and compensation

Features

Qualification based on AEC-Q200 Rev-C Multilayer SMD NTC with inner electrodes Nickel barrier termination For temperature measurement up to 150 °C Excellent long-term aging stability in high-temperature and high-humidity environment Superior resistance stability during soldering (change <1%) Options Alternative resistance ratings, resistance tolerances and B value tolerances available on request. Delivery mode Cardboard tape, 180-mm reel Dimensional drawing Dimensions in mm Approx. weight 13 mg General technical data Operating temperature range Top 40 ... 150 °C Max. power (at 25 °C, on PCB) P251) 210 mW Resistance tolerance ΔRR/RR ±3, ±5 % Rated temperature TR 25 °C Dissipation factor (on PCB) δth1) approx. 3.5 mW/K Thermal cooling time constant (on PCB) τc1) approx. 10 s Heat capacity Cth1) approx. 35 mJ/K Electrical specification and ordering codes R25 Ω No. of R/T characteristic B25/50 K B25/85 K B25/100 K Ordering code + = Resistance tolerance H = ±3% J = ±5% 4.7 k 8500 3590 3635 3650 ±3% B57442V5472+062 4.7 k 8507 4386 4455 4480 ±3% B57452V5472+062 10 k 8500 3590 3635 3650 ±3% B57442V5103+062 10 k 8502 3940 3980 4000 ±3% B57451V5103+062 10 k 8507 4386 4455 4480 ±3% B57452V5103+062 33 k 8502 3940 3980 4000 ±3% B57451V5333+062 100 k 8507 4386 4455 4480 ±3% B57452V5104+062 Temperature measurement and compensation B574**V5 SMD NTC thermistors for automotive, case size 0805 (2012) Automotive Page 2 of 19Please read Cautions and warnings and Important notes at the end of this document.

Tests of SMD NTC thermistors are based on AEC-Q200 Rev-C. The parts are mounted on standardized PCB. Test Standard Test conditions ΔR25/R25 (typical) Remarks Pre- and post-stress electrical test Resistance at: 25 °C and 100 °C High temperature exposure (storage) MIL-STD-202 Method 108 Test temperature: 150 °C Duration: 1000 h Unpowered < 5% Temperature cycling JESD22 Method JA-104 Lower test temperature: 40 °C Upper test temperature: 150 °C Number of cycles: 1000 < 5% Moisture resistance MIL-STD-202 Method 106 Lower test temperature: 25 °C Upper test temperature: 65 °C Rel. humidity of air: 90% ... 98% (during cooling phase: 80% ... 98%) Duration of 1 cycle: 24 h Number of cycles: 10 Unpowered < 5% Biased humidity MIL-STD-202 Method 103 Test temperature: 85 °C Rel. humidity of air: 85% Duration: 1000 h Test voltage: V = 0.3 V DC < 5% Operational life MIL-STD-202 Method 108 Test temperature: 150 °C Pmax = 0.35 mW Duration: 1000 h < 5% External visual MIL-STD-883E Method 2009 Visual inspection Physical dimensions JESD22 Method JB-100 Measured with calibers Within the specified values Therminal strength (leaded) MIL-STD-202 Method 211 Not applicable for SMD thermistors Resistance to solvents MIL-STD-202 Method 215 Not applicable for SMD thermistors (component has no marking, color coding or coating) Mechanical shock MIL-STD-202 Method 213 Peak value: 1500 g Half sine Condition F < 5% Temperature measurement and compensation B574**V5 SMD NTC thermistors for automotive, case size 0805 (2012) Automotive Page 3 of 19Please read Cautions and warnings and Important notes at the end of this document.

Test Standard Test conditions ΔR25/R25 (typical) Remarks Vibration MIL-STD-202 Method 204 Acceleration: 5 g Sweep time: 20 min Frequency range: 10 ... 2000 Hz 3 × 12 cycles < 5% Resistance to soldering heat MIL-STD-202 Method 210 Dip: 260 °C; 10 s 1 heat cycle < 3% Thermal shock MIL-STD-202 Method 107 Lower test temperature: 40 °C Upper test temperature: 150 °C Dwell time: 15 min Number of cycles: 300 air-air < 5% ESD AEC-Q200-002 Discharge capacitance: 150 pF Discharge resistance: 2 kΩ Charging voltage: 6 kV Contact discharge 2 pulses in each polarity < 5% Solderability J-STD-002 a) Dip: 235 °C; 5 s: aging 4 h @ 155 °C b) Dip: 215 °C; 5 s: steam aging 8 h @ 92 °C c) Dip: 260 °C; 7 s: steam aging 8 h @ 92 °C 95% of termination wetted Electrical characterization R(25 °C), R(100 °C), B(25/100) Within the specified values Flammability UL-94 V-0 or V-1 Not applicable for SMD thermistors (component is not coated or encapsulated with plastic materials) Board flex AEC-Q200-005 Method -005 Max. bending: 2 mm Duration @ max. bending: 60 s < 5% Terminal strength AEC-Q200-006 Method -006 Max. F: 17.7 N < 5% Temperature measurement and compensation B574**V5 SMD NTC thermistors for automotive, case size 0805 (2012) Automotive Page 4 of 19Please read Cautions and warnings and Important notes at the end of this document.

R/T No. 8500 8502 8507 T (°C) B25/100 = 3650 K B25/100 = 4000 K B25/100 = 4480 K RT/R25 α (%/K) RT/R25 α (%/K) RT/R25 α (%/K) Temperature measurement and compensation B574**V5 SMD NTC thermistors for automotive, case size 0805 (2012) Automotive Page 5 of 19Please read Cautions and warnings and Important notes at the end of this document.

1) ≤0.2 mm over 10 sprocket holes. Taping and packing

1 Taping of SMD NTC thermistors

1.1 Cardboard tape for case size 0402 and 0603 (taping to IEC 60286-3)

Dimensions (mm) Case size 0402 (8-mm tape) Case size 0603 (8-mm tape) Tolerance T2 0.70 1.10 max. T 0.60 0.90 max. D0 1.50 1.50 ±0.10 P0 4.00 4.00 ±0.101) P2 2.00 2.00 ±0.05 P1 2.00 4.00 ±0.10 W 8.00 8.00 ±0.30 E 1.75 1.75 ±0.10 F 3.50 3.50 ±0.05 G 0.75 0.75 min. Temperature measurement and compensation B574**V5 SMD NTC thermistors for automotive, case size 0805 (2012) Automotive Page 6 of 19Please read Cautions and warnings and Important notes at the end of this document.

2) ≤0.2 mm over 10 sprocket holes.

1.2 Blister tape for case size 0805 (taping to IEC 60286-3)

Dimensions (mm) Case size 0805 (8-mm tape) Tolerance A0 × B0 1.60 × 2.40 ±0.2 K0 1.40 max. T2 2.5 max. D0 1.50 +0.10/–0 D1 1.00 min. P0 4.00 ±0.102) P2 2.00 ±0.05 P1 4.00 ±0.10 W 8.00 ±0.30 E 1.75 ±0.10 F 3.50 ±0.05 G 0.75 min. Temperature measurement and compensation B574**V5 SMD NTC thermistors for automotive, case size 0805 (2012) Automotive Page 7 of 19Please read Cautions and warnings and Important notes at the end of this document.

3) Chip thickness depends on the resistance value.

1.3 Reel packing

ness3) 8-mm tape Reel dimensions Packing units mm mm pcs./reel Blister Card- board A Tol. W1 Tol. W2 180-mm reel 330-mm reel Temperature measurement and compensation B574**V5 SMD NTC thermistors for automotive, case size 0805 (2012) Automotive Page 8 of 19Please read Cautions and warnings and Important notes at the end of this document.

1 Soldering

1.1 SMD NTC thermistors

SMD NTC thermistors can be provided with a nickel barrier termination or on special request with silver-palladium termination. The usage of mild, non-activated fluxes for soldering is recommend- ed as well as a proper cleaning of the PCB. Nickel barrier termination The nickel barrier layer of the silver/nickel/tin termination (see figure 1) prevents leaching of the silver base metalization layer. This allows great flexibility in the selection of soldering parameters. The tin prevents the nickel layer from oxidizing and thus ensures better wetting by the solder. The nickel barrier termination is suitable for all commonly-used soldering methods. Figure 1 SMD NTC thermistors, structure of nickel barrier termination

1.1.1 Solderability (test to IEC 60068-2-58)

Preconditioning: Immersion into flux F-SW 32. Evaluation criterion: Wetting of soldering areas ≥95%. Solder Bath temperature (°C) Dwell time (s) SnPb 60/40 215 ±3 3

1.1.2 Resistance to soldering heat (test to IEC 60068-2-58)

Preconditioning: Immersion into flux F-SW 32. Evaluation criterion: Leaching of side edges ≤1/3. Solder Bath temperature (°C) Dwell time (s) SnPb 60/40 260 5 10 Temperature measurement and compensation B574**V5 SMD NTC thermistors for automotive, case size 0805 (2012) Automotive Page 9 of 19Please read Cautions and warnings and Important notes at the end of this document.

Temperature characteristic at component terminal with dual wave soldering Solder joint profiles for silver/nickel/tin terminations Temperature measurement and compensation B574**V5 SMD NTC thermistors for automotive, case size 0805 (2012) Automotive Page 10 of 19Please read Cautions and warnings and Important notes at the end of this document.

Recommended temperature characteristic for reflow soldering following J-STD-020C Profile feature Sn-Pb eutectic assembly Pb-free assembly Average ramp-up rate (TSmax to Tp) 3 °C/ second max. 3 °C/ second max. Preheat - Temperature min (TSmin) 100 °C 150 °C - Temperature max (TSmax) 150 °C 200 °C Time maintained above: - Temperature min (TL) 183 °C 217 °C Peak/ classification Time within 5 °C of actual Ramp-down rate 6 °C/ second max. 6 °C/ second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package, measured on the package body surface. Temperature measurement and compensation B574**V5 SMD NTC thermistors for automotive, case size 0805 (2012) Automotive Page 11 of 19Please read Cautions and warnings and Important notes at the end of this document.

Solder joint profiles for silver/nickel/tin terminations

1.1.3 Recommended geometry of solder pads

Recommended maximum dimensions (mm) Case size inch/mm A B C 0402/1005 0.6 0.6 1.7 0603/1608 1.0 1.0 3.0 0805/2012 1.3 1.2 3.4

1.1.4 Notes

Iron soldering should be avoided, hot air methods are recommended for repair purposes. Temperature measurement and compensation B574**V5 SMD NTC thermistors for automotive, case size 0805 (2012) Automotive Page 12 of 19Please read Cautions and warnings and Important notes at the end of this document.

2 Conductive adhesion

An alternative to soldering is the gluing of thermistors with conductive adhesives. The benefit of this method is that it involves no thermal stress. The adhesives used must be chemically inert.

3 Sealing and potting

When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused by thermal expansion during the production process (curing / overmolding process) and during later operation. The upper category temperature of the thermistor must not be exceeded. Ensure that the materials used (sealing / potting compound and plastic material) are chemically neutral.

4 Cleaning

If cleaning is necessary, mild cleaning agents such as ethyl alcohol and cleaning gasoline are recommended. Cleaning agents based on water are not allowed. Ultrasonic cleaning methods are permissible.

5 Storage

In order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere. Humidity, temperature and container materials are critical factors. Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing ma- terial may be deformed or SMDs may stick together, causing problems during mounting. After opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible. The components should be left in the original packing. Touching the metallization of unsoldered thermistors may change their soldering properties. Storage temperature: 25 °C up to 45 °C Relative humidity (without condensation): ≤75% annual mean <95%, maximum 30 days per annum Solder the thermistors listed in this data book after shipment from EPCOS within the time speci- fied: SMDs: 12 months Leaded components: 24 months Temperature measurement and compensation B574**V5 SMD NTC thermistors for automotive, case size 0805 (2012) Automotive Page 13 of 19Please read Cautions and warnings and Important notes at the end of this document.

6 Placement and orientation of SMD NTC thermistors on PCB

a) Component placement It is recommended that the PC board should be held by means of some adequate supporting pins such as shown left to prevent the SMDs from being damaged or cracked. b) Cracks When placing a component near an area which is apt to bend or a grid groove on the PC board, it is advisable to have both electrodes subjected to uniform stress, or to position the component's electrodes at right angles to the grid groove or bending line (see c) Component orientation). c) Component orientation Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board. Temperature measurement and compensation B574**V5 SMD NTC thermistors for automotive, case size 0805 (2012) Automotive Page 14 of 19Please read Cautions and warnings and Important notes at the end of this document.

Cautions and warnings General See "Important notes" at the end of this document. Storage Store thermistors only in original packaging. Do not open the package prior to storage. Storage conditions in original packaging: storage temperature 25 °C ... +45°C, relative humidity≤75% annual mean, <95% maximum 30 days per annum, dew precipitation is inadmissible. Do not store thermistors where they are exposed to heat or direct sunlight. Otherwise, the packing material may be deformed or components may stick together, causing problems during mounting. Avoid contamination of thermistor surface during storage, handling and processing. Avoid storage of thermistors in harmful environments like corrosive gases (SOx, Cl etc). Use the components as soon as possible after opening the factory seals, i.e. the polyvinyl-sealed packages. Solder thermistors within the time specified after shipment from EPCOS. For leaded components this is 24 months, for SMDs 12 months. Handling NTC thermistors must not be dropped. Chip-offs or any other damage must not be caused during handling of NTCs. Do not touch components with bare hands. Gloves are recommended. Avoid contamination of thermistor surface during handling. Bending / twisting leads A lead (wire) may be bent at a minimum distance of twice the wire’s diameter plus 4 mm from the component head or housing. When bending ensure the wire is mechanically relieved at the component head or housing. The bending radius should be at least 0.75 mm. Twisting (torsion) by 180° of a lead bent by 90° is permissible at 6 mm from the bottom of the thermistor body. Soldering Use resin-type flux or non-activated flux. Insufficient preheating may cause ceramic cracks. Rapid cooling by dipping in solvent is not recommended. Complete removal of flux is recommended. Temperature measurement and compensation B574**V5 SMD NTC thermistors for automotive, case size 0805 (2012) Automotive Page 15 of 19Please read Cautions and warnings and Important notes at the end of this document.

Ensure that no thermo-mechanical stress occurs due to production processes (curing or overmolding processes) when thermistors are sealed, potted or overmolded or during their subsequent operation. The maximum temperature of the thermistor must not be exceeded. Ensure that the materials used (sealing/potting compound and plastic material) are chemically neutral. Electrodes/contacts must not be scratched or damaged before/during/after the mounting process. Contacts and housing used for assembly with the thermistor must be clean before mounting. Ensure that adjacent materials are designed for operation at temperatures comparable to the surface temperature of the thermistor. Be sure that surrounding parts and materials can withstand the temperature. Avoid contamination of the thermistor surface during processing. The connections of sensors (e.g. cable end, wire end, plug terminal) may only be exposed to an environment with normal atmospheric conditions. Tensile forces on cables or leads must be avoided during mounting and operation. Bending or twisting of cables or leads directly on the thermistor body is not permissible. Avoid using chemical substances as mounting aids. It must be ensured that no water or other liquids enter the NTC thermistors (e.g. through plug terminals). In particular, water based substances (e.g. soap suds) must not be used as mounting aids for sensors. Operation Use thermistors only within the specified operating temperature range. Use thermistors only within the specified power range. Environmental conditions must not harm the thermistors. Only use the thermistors under normal atmospheric conditions or within the specified conditions. Contact of NTC thermistors with any liquids and solvents should be prevented. It must be ensured that no water enters the NTC thermistors (e.g. through plug terminals). For measurement purposes (checking the specified resistance vs. temperature), the component must not be immersed in water but in suitable liquids (e.g. Galden). Avoid dewing and condensation unless thermistor is specified for these conditions. Bending or twisting of cables and/or wires is not permissible during operation of the sensor in the application. Be sure to provide an appropriate fail-safe function to prevent secondary product damage caused by malfunction. This listing does not claim to be complete, but merely reflects the experience of EPCOS AG. Temperature measurement and compensation B574**V5 SMD NTC thermistors for automotive, case size 0805 (2012) Automotive Page 16 of 19Please read Cautions and warnings and Important notes at the end of this document.

A Area Fläche AWG American Wire Gauge Amerikanische Norm für Drahtquerschnitte B B value B-Wert B25/100 B value determined by resistance measurement at 25 °C and 100 °C B-Wert, ermittelt durch Widerstands- messungen bei 25 °C und 100 °C Cth Heat capacitance Wärmekapazität I Current Strom N Number (integer) Anzahl (ganzzahliger Wert) P25 Maximum power at 25 °C Maximale Leistung bei 25 °C Pdiss Power dissipation Verlustleistung Pel Electrical power Elektrische Leistung Pmax Maximum power within stated temperature range Maximale Leistung im angegebenenTemperaturbereich ΔRB/RB Resistance tolerance caused by spread of B value Widerstandstoleranz, die durch die Streuung des B-Wertes verursacht wird Rins Insulation resistance Isolationswiderstand RP Parallel resistance Parallelwiderstand RR Rated resistance Nennwiderstand ΔRR/RR Resistance tolerance Widerstandstoleranz RS Series resistance Serienwiderstand RT Resistance at temperature T (e.g. R25 = resistance at 25 °C) Widerstand bei Temperatur T (z.B. R25 = Widerstand bei 25 °C) T Temperature Temperatur ΔT Temperature tolerance Temperaturtoleranz t Time Zeit TA Ambient temperature Umgebungstemperatur Tmax Upper category temperature Obere Grenztemperatur (Kategorietemperatur) Tmin Lower category temperature Untere Grenztemperatur (Kategorietemperatur) Top Operating temperature Betriebstemperatur TR Rated temperature Nenntemperatur Tsurf Surface temperature Oberflächentemperatur V Voltage Spannung Vins Insulation test voltage Isolationsprüfspannung Vop Operating voltage Betriebsspannung Vtest Test voltage Prüfspannung Temperature measurement and compensation B574**V5 SMD NTC thermistors for automotive, case size 0805 (2012) Automotive Page 17 of 19Please read Cautions and warnings and Important notes at the end of this document.

α Temperature coefficient Temperaturkoeffizient Δ Tolerance, change Toleranz, Änderung δth Dissipation factor Wärmeleitwert τc Thermal cooling time constant Thermische Abkühlzeitkonstante τa Thermal time constant Thermische Zeitkonstante Abbreviations / Notes Symbol English German Surface-mounted devices Oberflächenmontierbares Bauelement * To be replaced by a number in ordering codes, type designations etc. Platzhalter für Zahl im Bestellnummern- code oder für die Typenbezeichnung. + To be replaced by a letter. Platzhalter für einen Buchstaben. All dimensions are given in mm. Alle Maße sind in mm angegeben. The commas used in numerical values denote decimal points. Verwendete Kommas in Zahlenwerten bezeichnen Dezimalpunkte. Temperature measurement and compensation B574**V5 SMD NTC thermistors for automotive, case size 0805 (2012) Automotive Page 18 of 19Please read Cautions and warnings and Important notes at the end of this document.

The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application . These statements are based on our knowledge of typical re- quirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application . As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incum- bent on the customer to check and decide whether an EPCOS product with the properties de- scribed in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified . In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Ma- terial Data Sheets on the Internet (www.epcos.com/material). Should you have any more de- tailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time . The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products . Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the fore- going for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to the current ver- sion of the "General Terms of Delivery for Products and Services in the Electrical In- dustry" published by the German Electrical and Electronics Industry Association (ZVEI). 7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CSMP, CSSP, CTVS, DSSP, MiniBlue, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.epcos.com/trademarks. Important notes Page 19 of 19