B57354V5104H160 EPCOS | Alldatasheet
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Technical content
NTC thermistors for temperature measurement SMD NTC thermistors for automotive applications Series/Type: Automotive series Ordering code: B57*V5 Date: 2023-10-23 Version: 2 TDK Electronics AG 2023. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without TDK Electronics' prior express consent is prohibited. Content of header bars 1 and 2 of data sheet will be automatically entered in headers and footers! Please fill in the table and then change the color to "white". This ensures that the table disappears (invisible) for the customer PDF. Don't change formatting when entering or pasting text in the table and don't add any cell or line in and to it! Identification/Classification 1 (header 1 + top left header bar): NTC thermistors for temperature measurement Identification/Classification 2 (header 2 + bottom left header bar): SMD NTC thermistors for automotive applications Ordering code: (top right header bar) B57*V5 Series/Type: (top right header bar) Automotive series Preliminary data (optional): Department: PPD ML PD Date: 2023-10-23 Version: 2 Prepared by: Hofrichter Release signed PD: Dr. Pecina Release signed IE Mr. Mijocevic Release signed QS: Dr. Rom Modifications/Remarks: Hinzufügen 0805 5k und 10k, B57358* bei high temperature exposure reliability drift 1% .
NTC thermistors for temperature measurement B57*V5 SMD NTC thermistors for automotive applications Automotive series PPD ML PD 2023-10-23 Please read Cautions and warnings and Page 2 of 13 Important notes at the end of this document.
Applications
Temperature measurement and compensation in various automotive circuits such as charging and temperature control of battery packs and battery management systems (BMS) electronic control units (ECUs), e.g. motor management, HVAC, electronic power steering (EPS), gearbox controls, ABS systems temperature sensor for air-conditioning LED lighting DC/DC converter, inverters, on-board charger (OBC) thermal protection of semiconductors (GaN / SiC) in power modules
Features
Qualification based on AEC-Q200 Multilayer SMD NTC thermistor with nickel barrier termination (AgNiSn) Accurate temperature measurement from -40 °C to 150°C Excellent long-term aging stability in high temperature and high humidity environment Tight R and B tolerances Short response time High mechanical robustness (selected types also available with soft termination) 100% Pb free, RoHS UL approval, file number E69802 Dimensional drawing Recommended solder pad layout Case size EIA/mm l w h k Case size EIA/mm A mm B mm C mm 0402/1005 0.6 0.6 1.7 0603/1608 1.0 1.0 3.0 0805/2012 1.3 1.2 3.4
NTC thermistors for temperature measurement B57*V5 SMD NTC thermistors for automotive applications Automotive series PPD ML PD 2023-10-23 Please read Cautions and warnings and Page 3 of 13 Important notes at the end of this document. General technical data, case size 0402 (1005) 1) Depends on mounting situation Electrical specifications and ordering codes, case size 0402 (1005) R25 kΩ ∆RR/RR B25/50 K B25/85 K B25/100 K Ordering code 4.7 k ±5 3940 3980 4000 ±3% B57251V5472J060 10 k ±0.5, ±1, ±3, ±5 3380 3435 3455 ±1% B57232V5103+360 10 k ±5 3940 3980 4000 ±3% B57251V5103J060 47 k ±1, ±3, ±5 4050 4108 4131 ±1% B57259V5473+360 *) 100 k ±1, ±3, ±5 4250 4311 4334 ±1% B57254V5104+360 + = Resistance tolerance D = ±0.5%, F = ±1%, H = ±3%, J = ±5% *) extended temperature range -45°C – 150 °C Operating temperature Top -40 ... 150 °C Maximum power (at 25 °C, on PCB) P251) 150 mW Rated temperature TR 25 °C Dissipation factor (on PCB) δth1) approx. 2.5 mW/K Thermal cooling time constant (on PCB) τc1) approx. 3 s Heat capacity Cth1) approx. 7.5 mJ/K Weight of component approx. 2 mg
NTC thermistors for temperature measurement B57*V5 SMD NTC thermistors for automotive applications Automotive series PPD ML PD 2023-10-23 Please read Cautions and warnings and Page 4 of 13 Important notes at the end of this document. General technical data, case size 0603 (1608) 1) Depends on mounting situation Electrical specifications and ordering codes, case size 0603 (1608) R25 kΩ ∆RR/RR B25/50 K B25/85 K B25/100 K Ordering code 10 k ±1 3366 3419 3439 ±0.5% B57333V5103F460 10 k ±0.5 3380 3435 3455 ±0.7% B57332V5103D560 10 k ±1, ±3, ±5 3380 3435 3455 ±1% B57332V5103+360 ) 10 k ±1, ±3, ±5 3568 3610 3624 ±1% B57343V5103+360 10 k ±3, ±5 3590 3635 3650 ±3% B57342V5103+060 ) 10 k ±1, ±3, ±5 3940 3980 4000 ±1% B57358V5103+360 10 k ±3, ±5 3940 3980 4000 ±3% B57351V5103+060 10 k ±3, ±5 4386 4455 4480 ±3% B57352V5103+060 22 k ±3, ±5 3940 3980 4000 ±3% B57351V5223+060 22 k ±3, ±5 4386 4455 4480 ±3% B57352V5223+060 47 k ±1, ±3, ±5 4050 4108 4131 ±1.5% B57359V5473+260 *) **) 47 k ±3, ±5 4050 4108 4131 ±2% B57359V5473+160 *) 47 k ±3, ±5 4386 4455 4480 ±3% B57352V5473+060 100 k ±1, ±3, ±5 4200 4260 4282 ±1% B57355V5104+360 100 k ±3, ±5 4250 4311 4334 ±2% B57354V5104+160 100 k ±1, ±3, ±5 4386 4455 4131 ±1.5% B57359V5104+260 100 k ±1, ±3, ±5 4386 4455 4480 ±1% B57352V5104+360 100 k ±3, ±5 4386 4455 4480 ±3% B57352V5104+060 + = Resistance tolerance F = ±1%, G = ±2%, H = ±3%, J = ±5% *) extended temperature range -45°C – 150 °C **) also available in soft termination. For further information, please contact your local sales organization. Operating temperature Top -40 ... 150 °C Maximum power (at 25 °C, on PCB) P251) 180 mW Rated temperature TR 25 °C Dissipation factor (on PCB) δth1) approx. 3 mW/K Thermal cooling time constant (on PCB) τc1) approx. 4 s Heat capacity Cth1) approx. 12 mJ/K Weight of component approx. 6 mg
NTC thermistors for temperature measurement B57*V5 SMD NTC thermistors for automotive applications Automotive series PPD ML PD 2023-10-23 Please read Cautions and warnings and Page 5 of 13 Important notes at the end of this document. General technical data, case size 0805 (2012) 1) Depends on mounting situation Electrical specifications and ordering codes, case size 0805 (2012) R25 kΩ ∆RR/RR B25/50 K B25/85 K B25/100 K Ordering code 4.7 k ±3, ±5 3590 3635 3650 ±3% B57442V5472+062 4.7 k ±3, ±5 4386 4455 4480 ±3% B57452V5472+062 5 k ±1, ±3, ±5 3380 3435 3455 ±1% B57432V5502+362 10 k ±1, ±3, ±5 3380 3435 3455 ±1% B57432V5103+362 10 k ±3, ±5 3590 3635 3650 ±3% B57442V5103+062 10 k ±3, ±5 3940 3980 4000 ±3% B57451V5103+062 10 k ±3, ±5 4386 4455 4480 ±3% B57452V5103+062 33 k ±3, ±5 3940 3980 4000 ±3% B57451V5333+062 47 k ±3, ±5 3940 3980 4000 ±3% B57451V5473+062 47 k ±1, ±3, ±5 4050 4108 4131 ±1.5% B57459V5473+262 100 k ±3, ±5 4386 4455 4480 ±3% B57452V5104+062 + = Resistance tolerance F = ±1%, G = ±2%, H = ±3%, J = ±5% Operating temperature Top -40 ... 150 °C Maximum power (at 25 °C, on PCB) P251) 210 mW Rated temperature TR 25 °C Dissipation factor (on PCB) δth1) approx. 3.5 mW/K Thermal cooling time constant (on PCB) τc1) approx. 10 s Heat capacity Cth1) approx. 35 mJ/K Weight of component approx. 13 mg
NTC thermistors for temperature measurement B57*V5 SMD NTC thermistors for automotive applications Automotive series PPD ML PD 2023-10-23 Please read Cautions and warnings and Page 6 of 13 Important notes at the end of this document. Reliability data Tests of SMD NTC thermistors are based on AEC-Q200. The parts are mounted on standardized PCB. Test Standard Test conditions ∆R25 / R25 (typical) Remarks Pre- and post-stress electrical test Resistance at: 25 °C and 100 °C - High temperature exposure (storage) MIL-STD-202, method 108 Test temperature: 150 °C Duration: 1000 h Unpowered < 5% Except B57*32V5*, B57*58V5* and B57*59V5* B57*54V5* and B57*55V5* <1% <2% Temperature cycling JESD22, method JA-104 Lower test temperature: Top min Upper test temperature: Top max Number of cycles: 1000 Transfer time: < 10 s Dwell time: 15 min Air – Air < 5% Temperature cycling is performed acc. MIL-STD-202, method 107. No warrant will be assumed for the reliability of solder joint. Biased humidity MIL-STD-202, method 103 Test temperature: 85 °C Rel. humidity of air: 85% Duration: 1000 h Test voltage: VNTC = 0.3 V DC < 5% Operational life MIL-STD-202, method 108 Test temperature: 150 °C Pmax = 0.35 mW Duration: 1000 h < 5% External visual MIL-STD-883E, method 2009 Visual inspection Physical dimensions JESD22, method JB-100 Measured with callipers Within the specified values Resistance to solvents MIL-STD-202, method 215 Not applicable for SMD NTC thermistors (component has no marking. color coding or coating) Mechanical shock MIL-STD-202, method 213 Peak value: 1500 g Half sine Condition F < 5%
NTC thermistors for temperature measurement B57*V5 SMD NTC thermistors for automotive applications Automotive series PPD ML PD 2023-10-23 Please read Cautions and warnings and Page 7 of 13 Important notes at the end of this document. Test Standard Test conditions ∆R25 / R25 (typical) Remarks Vibration MIL-STD-202, method 204 Acceleration: 5 g Sweep time: 20 min Frequency range:10 … 2000 Hz 3 x 12 cycles Except B574*V5* < 1% < 5% Resistance to soldering heat MIL-STD-202, method 210 Dip: 260°C; 10 s 1 heat cycle Except B57*32V5* and B57*59V5* B57*54V5* and B57*55V5* < 3% < 1% < 1% ESD AEC-Q200-002, method -002 Discharge capacitance: 150 pF Discharge resistance: 2 kΩ Charging voltage: 6 kV Contact discharge 2 pulses in each polarity < 5% Solderability J-STD-002 a) Dip: 235 °C; 5 s: aging 4 h @ 155 °C b) Dip: 215 °C; 5 s: steam aging 8 h @ 92 °C c) Dip: 260 °C; 7 s: steam aging 8 h @ 92 °C 95% of termination wetted Electrical characterization Within the specified values Flammability UL-94;V-0 or V-1 Not applicable for SMD NTC thermistors (component is not coated or encapsulated with plastic materials) Board flex AEC-Q200-005, method -005 B572*V5* Max. bending 1mm B573*V5* Max. bending 2mm B574*V5* Max. bending 2mm Duration @ max. bending: 60 s < 2% < 2% < 5% Terminal strength AEC-Q200-006, method -006 B572*V5* Max. F: 5 N B573*V5* Max. F: 10 N B574*V5* Max. F: 17 N < 2% < 2% < 5% Resistance drift after soldering Reflow soldering profile < 1%
NTC thermistors for temperature measurement B57*V5 SMD NTC thermistors for automotive applications Automotive series PPD ML PD 2023-10-23 Please read Cautions and warnings and Page 8 of 13 Important notes at the end of this document. Recommended soldering profiles Reflow soldering Temperature ranges for reflow soldering acc. To IEC 60068-2-58 recommendations. Profile feature Sn-Pb eutectic assembly Pb-free assembly Preheat and soak - Temperature min - Temperature max - Time Tsmin Tsmax ts 100 °C 150 °C 60 … 120 s 150 °C 200 °C 60 … 120 s Average ramp-up rate Tsmax to Tp 3 °C/ s max. 3 °C/ s max. Liquidous temperature Time at liquidous TL tL 183 °C 40 … 150 s 217 °C 40 … 150 s Peak package body temperature Tp1) 215 °C … 260 °C 235 °C … 260 °C Time (tp) above (Tp -5 °C) tp 10 ... 40 s 10 … 40 s Average ramp-down rate Tp to Tsmax 6 °C/ s max. 6 °C/ s max. Time 25 °C to peak temperature max. 8 minutes max. 8 minutes 1) Depending on package thickness. Note: All temperatures refer to topside of the package, measured on the package body surface. Number of reflow cycles: 3 Iron soldering should be avoided hot air methods are recommended for repair purposes. Recommended solder
NTC thermistors for temperature measurement B57*V5 SMD NTC thermistors for automotive applications Automotive series PPD ML PD 2023-10-23 Please read Cautions and warnings and Page 9 of 13 Important notes at the end of this document. Taping and packing Tape and reel packing according to IEC 60286-3 8-mm tape Definition Symbol 180-mm reel 330-mm reel Reel diameter A 180 +0/-3 330 +0/-2.0 Reel width (inside) W1 8.4 +1.5/-0 8.4 +1.5/-0 Reel width (outside) W2 14.4 max. 14.4 max. Packing units for discrete chip Case size inch/mm Chip thickness class Cardboard tape W Blister tape W ∅ 180-mm reel pcs. ∅ 330-mm reel pcs. 0402/1005 0.5 mm 8 mm - 10000 50000 0603/1608 0.8 mm 8 mm - 4000 16000 0805/2012 0.8 mm - 8 mm 4000*) 16000 1.2 mm - 8 mm 3000 12000 *) Except B57442V5103* 3000 pcs. / reel Packing codes The last two digits of the complete ordering code state the packing mode. 60 ≙ cardboard tape, 180-mm reel 62 ≙ blister tape, 180-mm reel 70 ≙ cardboard tape, 330-mm reel 72 ≙ blister tape, 330-mm reel Reel dimensions and tolerances
NTC thermistors for temperature measurement B57*V5 SMD NTC thermistors for automotive applications Automotive series PPD ML PD 2023-10-23 Please read Cautions and warnings and Page 10 of 13 Important notes at the end of this document. Cautions and warnings Storage Store thermistors only in original packaging. Do not open the package before storage. Storage conditions in original packaging: storage temperature –25 °C to +45 °C, relative humidity ≤ 75% annual mean, 95% on max. 30 days in a year, dew precipitation and wetness are inadmissible. Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing material may be deformed or SMDs may stick together, causing problems during mounting. Avoid contamination of thermistors surface during storage, handling and processing. Touching the metallization of unsoldered thermistors may change their soldering properties. Avoid storage of thermistor in harmful environments like corrosive gases (SOx, Cl etc.) After opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible. Solder thermistors after shipment from TDK Electronics within the time specified: SMD NTC thermistors with nickel-barrier termination: 12 months Handling NTC thermistors must not be dropped. Chip-offs must not be caused during handling of NTCs. Components must not be touched with bare hands. Gloves are recommended. Avoid contamination of thermistor surface during handling. Washing processes may damage the product due to the possible static or cyclic mechanical loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts, which might lead to reduced reliability or lifetime. Soldering Use resin-type flux or non-activated flux. Insufficient preheating may cause ceramic cracks. Rapid cooling by dipping in solvent is not recommended. Complete removal of flux is recommended. Mounting When NTC thermistors are encapsulated with sealing material or over molded with plastic material, there must be no mechanical stress caused by thermal expansion during the production process (curing / over molding process) and during later operation. The upper category temperature of the thermistor must not be exceeded. Ensure that the materials used (sealing compound and plastic material) are chemically neutral. Electrode must not be scratched before/during/after the mounting process. Contacts and housing used for assembly with thermistor have to be clean before mounting. Ensure that adjacent materials are designed for operation at temperatures comparable to the surface temperature of the thermistor. Be sure that surrounding parts and materials can withstand the temperature. Avoid contamination of thermistor surface during processing. Operation Use thermistors only within the specified operating temperature range. Environmental conditions must not harm the thermistors. Use thermistors only in normal atmospheric conditions.
NTC thermistors for temperature measurement B57*V5 SMD NTC thermistors for automotive applications Automotive series PPD ML PD 2023-10-23 Please read Cautions and warnings and Page 11 of 13 Important notes at the end of this document. Contact of NTC thermistors with any liquids and solvents should be prevented. It must be ensured that no water enters the NTC thermistors (e.g. through plug terminals). For measurement purposes (checking the specified resistance vs. temperature), the component must not be immersed in water but in suitable liquids (e.g. Galden). Avoid dewing and condensation. Be sure to provide an appropriate fail-safe function to prevent secondary product damage caused by malfunction (e.g. use VDR for limitation of overvoltage condition). This listing does not claim to be complete, but merely reflects the experience of TDK Electronics AG. Display of ordering codes for TDK Electronics products The ordering code for one and the same product can be represented differently in data sheets, data books, other publications, on the company website, or in order -related documents such as shipping notes, order confirmations and product labels. The varying representations of the ordering codes are due to different processes employed and do not affect the specifications of the respective products. Detailed information can be found on the Internet under www.tdk-electronics.tdk.com/orderingcodes.
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- The trade names EPCOS, CarXield, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS, DeltaCap, DigiSiMic, FilterCap, FormFit, InsuGate, LeaXield, MediPlas, MiniBlue, MiniCell, MKD, MKK, ModCap, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PiezoBrush, PlasmaBrush, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap, XieldCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.tdk-electronics.tdk.com/trademarks. Release 2023-08