B4CA4.5Z

FTR-B4 FUJITSU | Alldatasheet

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FTR-B4 C A 4.5 Z - B 05 [Example] (a) (b) (c) (d) (e) (f) (g) FTR-B4 Series ULTRA MINIATURE RELAY SLIM SIGNAL RELAY n FEATURES l Ultra miniature slim type relay for surface mounting Height: 9.3 mm maximum (THT) 10 mm maximum (SMT) Weight: Approximately 1.0 g l UL/CSA recognized l Conforms to Bellcore & FCC part 68, and Telcordia & FCC part 68 l Conforms to UL1950 / CSA 950, IEC 950 / EN60950 spacing and high breakdown voltage Clearance: 1.0mm Creepage: 1.6mm Basic insulation, 150V working voltage, pollution degree 2 l HIGH RELIABILITY Bifurcated contacts l Low power consumption 140 mV (standard), 100 mW (latching) l RoHS compliant since date code: 0430B8 Please see page 8 for more information )a( emaNseireS seireS4B-RTF )b( epytlanimreT epytelohhguorhT:C epyttnuomecafrus:G aeragnitnuomdecuder-epyttnuomecafrus:S )c( noitcnufnoitarepO epytdradnats:A epytgnihctal:B )d( rebmuNlioC egatlovlanimoN )e( lairetamtcatnoC yollarevlisdetalpdlog:Z )f( *noitceridgnisolcneyaleR noitceridgnisolcnedradnats:B )g( *leerrepsyalerforebmuN )dradnats(005:50 Remarks: Actual marking on relay would not carry code FTR and be as below: Ordering code Actual marking FTR-B4CA4.5Z → B4CA4.5ZNotes: * - Only surface mount types (G and S) are applicable - All relays are packaged in tubes unles P/N ends with -B05 RoHS compliant

• Pulse driven Note: All values in the table are measured at 20˚C. Latching type (1 coil) * Pulse driven Note: All values in the table are measured at 20˚C. + V LEDOM liocdetaR egatlov ecnatsiserlioC )%01±( gnitarepO egatlov esaeleR *egatlov rewopdetaR noitpmusnoc Z300A)(4B-RTF CDV3 3.46 Ω V52.2+ V3.0+ Wm041 Z5.4A)(4B-RTF CDV5.4 541 Ω V83.3+ V54.0+ Wm041 Z600A)(4B-RTF CDV6 752 Ω V5.4+ V6.0+ Wm041 Z900A)(4B-RTF CDV9 975 Ω V57.6+ V9.0+ Wm041 Z210A)(4B-RTF CDV21 820,1 Ω V0.9+ V2.1+ Wm041 Z420A)(4B-RTF CDV42 405,2 Ω V0.81+ V4.2+ Wm032 Ω LEDOM liocdetaR egatlov ecnatsiserlioC )%01±( teS egatlov esaeleR egatlov rewopdetaR noitpmusnoc Z300B)(4B-RTF CDV3 09 Ω V52.2+ V52.2- Wm001 Z5.4B)(4B-RTF CDV5.4 302 Ω V83.3+ V83.3- Wm001 Z600B)(4B-RTF CDV6 063 Ω V5.4+ V5.4- Wm001 Z900B)(4B-RTF CDV9 018 Ω V57.6+ V57.6- Wm001 Z210B)(4B-RTF CDV21 044,1 Ω V0.9+ V0.9- Wm001 Z420B)(4B-RTF CDV42 008,4 Ω V0.81+ V0.81- Wm021

*1 Minimum switching loads mentioned above are reference values. Please perform the confirmation test with the actual load before production since reference values may vary according to switching frequencies, envir onmental conditions and expected reliability levels. Standard Type Latching Type FTR-B4-CA ( ) Z FTR-B4-GA ( ) Z FTR-B4-SA ( ) Z FTR-B4-CB ( ) Z FTR-B4-GB ( ) Z FTR-B4-SB ( ) Z Contact Arrangement 2Form C Contact material Gold overlay silver alloy Contact type Bifurcated contact (cross-bar) Contact resistance (initial value) 100mΩ maximum at 6VDC 1 Contact rating 30 VDC 1A, 125 VAC 0.3 A (resistive) Maximum carrying current 1A Maximum switching power 62.5 VA / 30W Maximum switching voltage 250 VAC. 220 VDC Maximum switching current 1A Maximum switching load* 10m VDC, 0.01mA* Capacitance Approximately 0.7 pF (between open contacts) Approximately 0.7 pF (adjacent contacts) Approximately 1.0 pF (between coil and contacts) Coil Nominal power (at 20°C) 140 mW up to 230 mW 100 mW up to 130 mW Operate power (at 20°C) 80 mW up to 130 mW 57 mW up to 68 mW Operating temperature (no frost) -40°C to +85°C Time value Operate (at nominal voltage, without bounce) 3ms maximum 3ms maximum (set) Release (at nominal voltage, without bounce) 3ms maximum 3ms maximum (reset) Insulation Resistance Minimum 1,000MΩ Dielectric strength between open contacts 1,000 VAC 1 minute between adjacent contacts 1,000 VAC 1 minute between coil and contacts 1,500 VAC 1 minute Surge strength between open contacts 1,500 V (at 10 x 160µs) [FCC Part 68] between adjacent contacts 1,500 V (at 10 x 160µs) [FCC Part 68] between coil and contacts 1,500 V (at 10 x 160µs) [FCC Part 68] 2,500 V (at 2 x 10µs) [Bellcore] Life Mechanical 50 x 10 operations (at 3 Hz) Electrical (resistive load) 100 x 10 ops. min. at 1A, 30 VDC (at 0.5 Hz) 100 x 10 ops. min. at 0.3A, 30 VDC (at 0.5 Hz) Vibration resistance Misoperation 10 to 55 Hz at double amplitude of 3 mm Endurance 10 to 55 Hz at double amplitude of 5 mm Shock resistance Misoperation Min. 750 m/s2 Endurance Min. 1,000 m/s2 Weight Approximately 1.0 g

0 0.1 0.2 0.3 Operation (return time characteristics) Time (ms) Release Operation time Coil Power (W) 0 0.1 0.2 0.3 Set, reset time characteristics Time (ms) Set time Reset time Coil Power (W) 100 0 10 20 30 40 50 60 70 80 Distribution of Operate and Release Voltage Distribution (%) Nominal Voltage Multiplying Factor (%) FTR-B4GB4.5Z n=100 Operate Release 0 0.1 0.2 0.3 Coil Temperature Rise Coil Temperature Rise (oC) Coil Power (W) Contact carrying current: 1A Contact carrying current: 0 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0 20 40 60 80 100 Ambient Temperature (maximum applied voltage, operating voltage characteristics) Nominal Voltage Multiplying Factor (%)Ambient Temperature (oC) Standard type Contact carrying current: 0 Contact carrying current: 1A Operating voltage (hot coil) Operating voltage (cool coil) 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0 20 40 60 80 100 Ambient Temperature (maximum applied voltage, operating voltage characteristics) Nominal Voltage Multiplying Factor Ambient Temperature (oC) Contact carrying current: 1A Contact carrying current: 1A Latching Type Operating Voltage (hot coil) Operating Voltage (cool coil) 0.5 0.3 0.2 0.1 1 2 5 10 20 30 50 100 200 Maximum Switching Power Contact Current (A) Contact Voltage (V) AC Resistive DC Resistive 100 Life Curve Operation (x104) Contact Current (A)

30 VDC Resistive

125 VDC Resistive

Distribution (%) Nominal Voltage Multiplying Factor (%) FTR-B4GA4.5Z n=100 Operate Release 100 0 10 20 30 40 50 60 70 80 Distribution of Operate and Release Voltage Distribution (%) Nominal Voltage Multiplying Factor (%) FTR-B4GB4.5Z n=100 Operate Release 100 0 1 2 3 4 5 Distribution of Operate and Release Time Distribution (%) Time (ms) FTR-B4GA4.5Z n=100 Operate Release 100 0 1 2 3 4 5 Distribution of Bounce Time Distribution (%) FTR-B4GA4.5Z N=100 Operate Release Time (ms) 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0 20 40 60 80 100 Ambient Temperature (maximum applied voltage, operating voltage characteristics) Nominal Voltage Multiplying Factor (%)Ambient Temperature (oC) Standard type Contact carrying current: 0 Contact carrying current: 1A Operating voltage (hot coil) Operating voltage (cool coil) 100 500 100 100 500 1000 2000 3000 5000 Mechanical Life Test Contact Resistance (mΩ) Operation (x104) Operating Voltage Release Voltage Make Break FBR-B4GA4.5Z n=8 1200 operations/min. Initial 0.5 0.3 0.2 0.1 1 2 5 10 20 30 50 100 200 Maximum Switching Power Contact Current (A) Contact Voltage (V) AC Resistive DC Resistive 100 500 100 1 10 Electrical Life Test Contact Resistance (mΩ) Operation (x104) Operating Voltage Release Voltage Make Break Initial Nominal Voltage Multiplying Factor (%)FTR-B4GA4.5Z n=8 30 operations/min.

30 VAC 1A

(resistive load) -10 -20 -10 -20 0 2 4 6 8 10 Magnetic Interference Distance between relays I (mm) Operating Voltage Release Voltage When coil is ON When coil is OFF Nominal Voltage Multiplying Factor (%) FTR-B4GA4.5Z n=4 Nominal Voltage Multiplying Factor (%) Standard type -10 -20 -10 -20 0 2 4 6 8 10 Magnetic Interference Distance between relays I (mm) Operating Voltage Release Voltage When coil is ON When coil is OFF Nominal Voltage Multiplying Factor (%) FTR-B4GA4.5Z n=4 Nominal Voltage Multiplying Factor (%) Standard type 150 100 1 3 5 7 10 30 50 70 100 300 500 700 1000 High Frequency Characteristics Frequency (MHz) FTR-B4GA4.5Z n=2 Isolation (dB) 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 1 10 30 50 703 5 7 1000100 300 500700 High Frequency Characteristics Frequency (MHz) FTR-B4GA4.5Z n=2 Insertion Loss (dB)

n DIMENSIONS AND SCHEMATICS 2 3 4 1 (+) 7 6 5(-) 10.6±0.3 5.7±0.3 1.5±0.2 3.2±0.2 2.2±0.22.2±0.2 0.4±0.1 3.54±0.3 0.5±0.1 9±0.3 7.6 3.2 2.2 8-O 0.85 3.2 0.2±0.05 3.2±0.2 2 3 4 1 (+) 7 6 5 (-) 10.6±0.3 5.7±0.3 0.5 9±0.3 1.5±0.2 3.2±0.2 2.2±0.22.2±0.2 0.4±0.1 0.2±0.05 7.6 3.2 2.2 3.13.1 5.3 0.8 1.2 9.7±0.3 3.2±0.3 7.4±0.3 Through hole type Surface mount type (standard) Recommended mounting pad (Tolerance: ±0.1mm) Terminal designations (Top view de-energized position) Terminal designations (Top view de-energized position) Recommended mounting pad (Tolerance: ±0.1mm)

n DIMENSIONS AND SCHEMATICS Reduced mounting area Terminal designations (Top view de-energized position) Recommended mounting pad (Tolerance: ±0.1mm) 2 3 4 1 (+) 7 6 5 (-) 10.6±0.3 5.7±0.3 0.5 9±0.3 1.5±0.2 3.2±0.2 2.2±0.22.2±0.2 0.4±0.1 0.2±0.05 7.6 3.2 2.2 2.252.25 4.45 0.8 1.2 9.7±0.3 3.2±0.3 5.7±0.3 n RECOMMENDED SOLDERING CONDITIONS (TEMPERATURE PROFILE) Note: 1.Temperature profiles show the tempera ture of PC board surface. 2. Please perform soldering test with your actual PC board before mass produc tion, since the temperatures of PC board surfaces vary according to the size of PC board, status of parts mount ing and heating method. IRS (Infrared Reflow Soldering) T 3 T 2 T 1 T 3 = 245C max. T 2 = 200C max. T 1 = 165C max. Temperature (C) soldering preheating cooling 120 sec maximum 30 sec Max. n PRECAUTIONS - For details on general precautions, refer to the section on technical descriptions. - Since this is a polar relay, follow the instructions of the internal wiring diagram for the +- connections of the coil. - Note that the terminal array and internal wiring of the surface mount relay are a top view.

RoHS Compliance and Lead Free Relay Information Reflow Solder condtion 3. Moisture Sensitivity l Moisture Sensitivity Level standard is not applicable to electromechanical realys. 4. Tin Whisker l SnAgCu and SnCuNi solder is known as low risk of tin whisker. No considerable length whisker was found by our in-house test. We highly recommend that you confirm your actual solder conditions Flow Solder condtion: Pre-heating: maximum 120˚C Soldering: dip within 5 sec. at 260˚C soler bath Solder by Soldering Iron: Soldering Iron Temperature: maximum 360˚C Duration: maximum 3 sec. 1. General Information l Relays produced after the specific date code that is indicated on each data sheet are lead-free now. Most of our signal and power relays are lead-free. Please refer to Lead-Free Status Info. (http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf) l Lead free solder paste currently used in relays is Sn-3.0Ag-0.5Cu. From February 2005 forward Sn-3.0CU-Ni will be used for the FTR-B3 and FTR-B4 series relays. l All signal and most power relays also comply with RoHS. Please refer to individual data sheets. Relays that are RoHS compliant do not contain the 5 hazardous materials that are restricted by RoHS directive (lead, mercury, chromium IV, PBB, PBDE). l It has been verified that using lead-free relays in leaded assembly process will not cause any problems (compatible). l “LF” is marked on each outer and inner carton. (No marking on individual relays). l To avoid leaded relays (for lead-free sample, etc.) please consult with area sales office. l We will ship leaded relays as long as the leaded relay inventory exists. Note: Cadmium was exempted from RoHS on October 21, 2005. (Amendment to Directive 2002/95/EC) 2. Recommended Lead Free Solder Profile l Recommended solder paste Sn-3.0Ag-0.5Cu amd Sm-3.0 Cu-Ni (only FTR-B3 and FTR-B4 from February 2005. max. 120 sec. 90~120 sec. 20~30 sec. (duration) CoolingPre-heating Soldering Peak T emp.: max. 250 C 250 220 130 130 170 T emperature ( C)

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Tel: (31-23) 5560910 Fax: (31-23) 5560950 Email: info@fceu.fujitsu.com Web: emea.fujitsu.com/components/ Asia Pacific Fujitsu Components Asia Ltd. 102E Pasir Panjang Road #01-01 Citilink Warehouse Complex Singapore 118529 Tel: (65) 6375-8560 Fax: (65) 6273-3021 Email: fcal@fcal.fujitsu.com Web: http://www.fujitsu.com/sg/services/micro/components/ Fujitsu Components International Headquarter Offices ©2007 Fujitsu Components America, Inc. All rights reserved. All trademarks or registered trademarks are the property of their respective owners. Fujitsu Components America or its affiliates do not warrant that the content of datasheet is error free. In a continuing effort to improve our products Fujitsu Components America, Inc. or its affiliates reserve the right to change specifications/datasheets without prior notice. Rev. February 19, 2007