B3Q420 BENCENT | Alldatasheet
Document overview
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Technical content
Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications www .bencent.com.cn Order Code: B3Q420 Gas Discharge Tube Version: A0 2013-09-02 Surface Mounting Design 6.8×3.5×3.5mm Current Current Handling Capability 2,000A @ 8/20μs Low Capacitance and Insertion Loss Fast Response and Long Service Life Reliable to Protect Electrostatic Surge Moisture sensitivity level：Level 1 Electrical Parameter ESD protection xDSL Schematic Symbol
Application information
i Package (Top View) Features Exterior SMD 1 2 Agency Approvals DC Breakdown Voltage 1)2) 100V/s 360- 560 V Impulse Spark-over Voltage At 1kV/μs for 99 % of measured values ≤ 950 V At 1kV/μs Typical values of distribution ≤ 850 V Impulse Discharge Voltage 3) 10/700μs 6 ,000 V Impulse Discharge Current 3) 8/20μs 2 ,000 A Arc Voltage At 1A ~ 20 V Insulation Resistance DC=100V ≥1 G Ω C(1MHz) V DC=0.5V ≤1.0 pF Weight ~0.33 g Operating And Storage Temperature - 40-90 ℃ Marking Without 1) At delivery AQL 0.65 level II GB/T 2828.1-2003 2) In ionized mode 3) Terms and waveforms in accordance with ITU-T Rec. K. 12; IEC 61643-21 Icon Description Compliance with 2011/65/EU Compliance with IEC61249-2-21:2003 Mean lead free 1 2
Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications www .bencent.com.cn Order Code: B3Q420 Gas Discharge Tube Version: A0 2013-09-02 B3Q 420 (1) (2) (1) Bencent 3-Electrode SMD Gas Discharge Tube (2) DC Breakdown Voltage, e.g., 420=420V Part Numbering System Recommended Soldering Pad Product Dimensions Environmental Reliability Characteristics Lead Material Copper Body Material C eramics Terminal Finish 100% Matte- Tin Plated Product Characteristics Testing items Technical standards High Temperature Storage Test Temperature: 85℃ Time:2H Low Temperature Storage Test Temperature: -40℃ Time:2H Vibration Frequency：10-500Hz Amplitude：0.15mm Time：45mins Resistance of soldering heat Temperature: 260±5℃ Time of dip soldering：10s，1time REF mm inch A 8.10 0.217 B 1.75 0.138 C 1.40 0.055 D 1.80 0.071 E 4.20 0.165 Note: Up-screen program can be specified by customer’s request via contacting Bencent service Solderability Test Solderability Solder Pot Temperature: 245℃±5℃ Solder Dwell Time: 4-6 seconds REF mm inch E B C A B D C
Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications www .bencent.com.cn Order Code: B3Q420 Gas Discharge Tube Version: A0 2013-09-02 Reflow Condition Pb-Free assembly Pre Heat Temperature Min 150°C Temperature Max 200°C Time ˄min to max˅ 60 – 180 secs Average ramp up rate˄Liquids˅Tamp ˄TL 3°C/second max ˅ to peal TS(max) to TL 3°C/second max - Ramp-up Rate Reflow - Temperature (TL 217°C (Liquids) - Temperature (TL 60 – 150 seconds ) Peak Temperature (TP 260+0/-5 °C ) Time within 5°C of actual peak Temperature (tp) 8 – 20 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP 8 minutes Max. ) Do not exceed 260°C REF mm inch D Φ330.0 Φ13.0 D1 Φ50Min Φ1.97Min D2 Φ13±0.15 Φ0.512±0.006 W1 20.8±2.0 0. 819±0.079 Package R eel Information Reflow Profile OUTLINE REEL (PCS) PER CARTON (PCS) REEL DIAMETERS (mm) CARTON SIZE(mm) L W H TAPING 2,000 32,000 330 360 360 380 tP Ramp-down TP TL TS(max) TS(min) time to peak temper ature Time Temperature Critical Zone TL to TP TL Preheat Ramp-up tS