B3L30LP

Document overview

  • Manufacturer or author: Diodes Incorporated
  • PDF pages: 5

Technical content

Features

  • Guard Ring Die Constructi on for Transient Protection
  • Low Power Loss, High Efficiency
  • Low Forward Voltage Drop
  • For Use in Low Voltage, High Frequency Inverters, Free Wheeling, and Polarity Protection Applications
  • High Forward Surge Current Capability
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3) Mechanical Data
  • Case: U-DFN3030-8
  • Case Material: Molded Plasti c, “Green” Molding Compound. UL Flammability Classification Rating 94V-0
  • Moisture Sensitivity: Level 1 per J-STD-020
  • Terminals: Finish - NiPd Au over Copper lead frame. Solderable per MIL-STD-202, Method 208
  • Polarity: See Diagram
  • Weight: 0.0172 grams (approximate) Ordering Information (Note 4) Part Number Case Packaging B3L30LP-7 U-DFN3030-8 3000/Tape & Reel Notes: 1. No purposely added lead. Fully EU Directiv e 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more in formation about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. Marking Information Bottom View Top View Schematic and Pin Configuration U-DFN3030-8 S33 = Product marking code YYWW = Date code marking YY = Last digit of year (ex: 13 for 2013) WW = Week code (01 ~ 53)

Document number: DS30915 Rev. 11 - 2 2 of 5 www.diodes.com March 2014 © Diodes Incorporated B3L30LP Maximum Ratings (@TA = +25°C, unless otherwise specified.) Single phase, half wave, 60Hz, resistive or inductive load. For capacitance load, derate current by 20%. Characteristic Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 30 V RMS Reverse Voltage VR(RMS) 21 V Average Rectified Output Current IO 3.0 A Non-Repetitive Peak Forward Surge Current 8.3ms Single half sine-wave Superimposed on Rated Load IFSM 30 A Thermal Characteristics Characteristic Symbol Typ Max Unit Thermal Resistance Junction to Soldering Point RθJS ⎯ 3 °C/W Thermal Resistance Junction to Ambient Air (Note 5) RθJA 130 ⎯ °C/W Power Dissipation (Note 6) (Note 7) (Note 8) P D 2.5 4.0 4.5 W Operating and Storage Temperature Range TJ, TSTG -65 to +150 °C Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition Reverse Breakdown Voltage (Note 9) V(BR)R 30 ⎯ ⎯ V IR = 5.0mA Forward Voltage VF ⎯ 0.28 ⎯ V IF = 0.5A, TJ = +25°C Reverse Current (Note 9) IR ⎯ 0.27 1.0 mA TJ = +25°C, VR = 30V ⎯ 55 90 mA TJ = +100°C, VR = 30V 6. Device mounted on FR-4 PCB, 25mm2 pad area. 7. Device mounted on FR-4 PCB, 75mm2 pad area. 8. Aluminum PCB with copper mounting pad area of 75mm2. 9. Short duration pulse test used to minimize self-heating effect.

Document number: DS30915 Rev. 11 - 2 3 of 5 www.diodes.com March 2014 © Diodes Incorporated B3L30LP I, I NSTANTANEOUS FORWARD CURRENT (A)F V , INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 1 Typical Forward Characteristics F 0.2 0.4 0.6 0.8 1 T = 150°CA T = 125°CA T = 100°CA T = -55°CA T = 0 ° CA T = 2 5 ° CA T = 8 5 ° CA 0.01 0.1 100 0.001 01 0 20 30 V , INSTANTANEOUS REVERSE VOLTAGE (V) Fig. 2 Typical Reverse Characteristics R I, I NSTANTANEOUS REVERSE CURRENT (mA)R 0.01 0.1 100 0.0001 0.001 T = 100°CA T = -55°CA T = 0 ° CA T = 2 5 ° CA T = 8 5 ° CA C , TOTAL CAPACITANCE (pF)T V , DC REVERSE VOLTAGE (V) Fig. 3 Total Capacitance vs. Reverse Voltage R 200 400 600 800 0 5 10 15 20 25 30 f = 1.0 MHz 165 150 135 120 105 01 0 2 0 30 T , DERATED AMBIENT TEMPERATURE (°C)A V , DC REVERSE VOLTAGE (V) Fig. 4 Operating Temperature Derating R

Document number: DS30915 Rev. 11 - 2 4 of 5 www.diodes.com March 2014 © Diodes Incorporated B3L30LP Package Outline Dimensions Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version. Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. U-DFN3030-8 Dim Min Max Typ A 0.57 0.63 0.60 A1 0 0.05 0.02 A3 - - 0.15 b 0.29 0.39 0.34 D 2.90 3.10 3.00 D2 2.19 2.39 2.29 e - - 0.65 E 2.90 3.10 3.00 E2 1.64 1.84 1.74 L 0.30 0.60 0.45 All Dimensions in mm Dimensions Value (in mm) Z 2.59 G 0.11 X1 2.49 X2 0.65 Y 0.39 C 0.65 D E e b L A A1 A3 ︵Pi n #1 I D︶ Seati ng Pl ane R0.200 Z G YC

Document number: DS30915 Rev. 11 - 2 5 of 5 www.diodes.com March 2014 © Diodes Incorporated B3L30LP IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries rese rve the right to make modifications, enhanc ements, improvements, corrections or ot her changes without further notice to this document and any product descri bed herein. Diodes Incorporated does not assume any liability ari sing out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applica tions shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Inco rporated products for any unintended or una uthorized application, Customers shall i ndemnify and hold Diodes Incorporated and its representativ es harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of t his document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical com ponents in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when proper ly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifi cations of their life support dev ices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or s ystems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporate d and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2014, Diodes Incorporated www.diodes.com