B37923K5030B960

DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 22

Technical content

Multilayer ceramic capacitors Chip, HQF Series/Type: Chip Date: February 2009 The following products presented in this data sheet are being withdrawn. Substitute Products: See www.epcos.com/withdrawal_mlcc © EPCOS AG 2009. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. Ordering Code Substitute Product Date of Withdrawal Deadline Last Orders Last Shipments B37923K5100J070 2009-06-26 2010-06-30 2010-12-31 B37923K5120J060 2009-06-26 2010-06-30 2010-12-31 B37923K5120J070 2009-06-26 2010-06-30 2010-12-31

Ordering Code Substitute Product Date of Withdrawal Deadline Last Orders Last Shipments B37933K5000B460 2009-06-26 2010-06-30 2010-12-31 B37923K5150J060 2009-06-26 2010-06-30 2010-12-31 B37933K5000B470 2009-06-26 2010-06-30 2010-12-31 B37923K5150J070 2009-06-26 2010-06-30 2010-12-31 B37933K5000B560 2009-06-26 2010-06-30 2010-12-31 B37923K5180J060 2009-06-26 2010-06-30 2010-12-31 B37933K5000B570 2009-06-26 2010-06-30 2010-12-31 B37923K5180J070 2009-06-26 2010-06-30 2010-12-31 B37933K5000B660 2009-06-26 2010-06-30 2010-12-31 B37923K5220J060 2009-06-26 2010-06-30 2010-12-31 B37933K5000B670 2009-06-26 2010-06-30 2010-12-31 B37923K5220J070 2009-06-26 2010-06-30 2010-12-31 B37933K5000B760 2009-06-26 2010-06-30 2010-12-31 B37933K5000B770 2009-06-26 2010-06-30 2010-12-31 B37933K5000B860 2009-06-26 2010-06-30 2010-12-31 B37933K5000B870 2009-06-26 2010-06-30 2010-12-31 B37933K5000B960 2009-06-26 2010-06-30 2010-12-31 B37933K5000B970 2009-06-26 2010-06-30 2010-12-31 B37933K5010B060 2009-06-26 2010-06-30 2010-12-31 B37933K5010B070 2009-06-26 2010-06-30 2010-12-31 B37933K5010B260 2009-06-26 2010-06-30 2010-12-31 B37933K5010B270 2009-06-26 2010-06-30 2010-12-31 B37933K5010B560 2009-06-26 2010-06-30 2010-12-31 B37933K5010B570 2009-06-26 2010-06-30 2010-12-31 B37933K5010B860 2009-06-26 2010-06-30 2010-12-31 B37933K5010B870 2009-06-26 2010-06-30 2010-12-31 B37933K5020B260 2009-06-26 2010-06-30 2010-12-31 B37933K5020B270 2009-06-26 2010-06-30 2010-12-31 B37933K5020B760 2009-06-26 2010-06-30 2010-12-31 B37933K5020B770 2009-06-26 2010-06-30 2010-12-31 B37933K5030B360 2009-06-26 2010-06-30 2010-12-31 B37933K5030B370 2009-06-26 2010-06-30 2010-12-31 B37933K5030B960 2009-06-26 2010-06-30 2010-12-31 B37933K5030B970 2009-06-26 2010-06-30 2010-12-31 B37933K5040C760 2009-06-26 2010-06-30 2010-12-31 B37933K5040C770 2009-06-26 2010-06-30 2010-12-31 B37933K5050C660 2009-06-26 2010-06-30 2010-12-31 B37933K5050C670 2009-06-26 2010-06-30 2010-12-31

Ordering Code Substitute Product Date of Withdrawal Deadline Last Orders Last Shipments B37933K5060C860 2009-06-26 2010-06-30 2010-12-31 B37933K5060C870 2009-06-26 2010-06-30 2010-12-31 B37933K5080C260 2009-06-26 2010-06-30 2010-12-31 B37933K5080C270 2009-06-26 2010-06-30 2010-12-31 B37933K5100J060 2009-06-26 2010-06-30 2010-12-31 B37933K5100J070 2009-06-26 2010-06-30 2010-12-31 B37933K5120J060 2009-06-26 2010-06-30 2010-12-31 B37933K5120J070 2009-06-26 2010-06-30 2010-12-31 B37933K5150J060 2009-06-26 2010-06-30 2010-12-31 B37933K5150J070 2009-06-26 2010-06-30 2010-12-31 B37933K5180J060 2009-06-26 2010-06-30 2010-12-31 B37933K5180J070 2009-06-26 2010-06-30 2010-12-31 B37933K5220J060 2009-06-26 2010-06-30 2010-12-31 B37933K5220J070 2009-06-26 2010-06-30 2010-12-31 B37933K5270J060 2009-06-26 2010-06-30 2010-12-31 B37933K5270J070 2009-06-26 2010-06-30 2010-12-31 B37933K5820J060 2009-06-26 2010-06-30 2010-12-31 B37933K5820J070 2009-06-26 2010-06-30 2010-12-31 B37923K5000B360 2009-06-26 2010-06-30 2010-12-31 B37923K5000B370 2009-06-26 2010-06-30 2010-12-31 B37923K5000B460 2009-06-26 2010-06-30 2010-12-31 B37923K5000B470 2009-06-26 2010-06-30 2010-12-31 B37923K5000B560 2009-06-26 2010-06-30 2010-12-31 B37923K5000B570 2009-06-26 2010-06-30 2010-12-31 B37923K5000B660 2009-06-26 2010-06-30 2010-12-31 B37923K5000B670 2009-06-26 2010-06-30 2010-12-31 B37923K5000B760 2009-06-26 2010-06-30 2010-12-31 B37923K5000B770 2009-06-26 2010-06-30 2010-12-31 B37923K5000B860 2009-06-26 2010-06-30 2010-12-31 B37923K5000B870 2009-06-26 2010-06-30 2010-12-31 B37923K5000B960 2009-06-26 2010-06-30 2010-12-31 B37923K5000B970 2009-06-26 2010-06-30 2010-12-31 B37923K5010B060 2009-06-26 2010-06-30 2010-12-31 B37923K5010B070 2009-06-26 2010-06-30 2010-12-31 B37923K5010B260 2009-06-26 2010-06-30 2010-12-31 B37923K5010B270 2009-06-26 2010-06-30 2010-12-31 B37923K5010B560 2009-06-26 2010-06-30 2010-12-31 B37923K5010B570 2009-06-26 2010-06-30 2010-12-31

Ordering Code Substitute Product Date of Withdrawal Deadline Last Orders Last Shipments B37923K5010B860 2009-06-26 2010-06-30 2010-12-31 B37923K5010B870 2009-06-26 2010-06-30 2010-12-31 B37923K5020B260 2009-06-26 2010-06-30 2010-12-31 B37923K5020B270 2009-06-26 2010-06-30 2010-12-31 B37923K5020B760 2009-06-26 2010-06-30 2010-12-31 B37923K5020B770 2009-06-26 2010-06-30 2010-12-31 B37923K5030B360 2009-06-26 2010-06-30 2010-12-31 B37923K5030B370 2009-06-26 2010-06-30 2010-12-31 B37923K5030B960 2009-06-26 2010-06-30 2010-12-31 B37923K5030B970 2009-06-26 2010-06-30 2010-12-31 B37923K5040C760 2009-06-26 2010-06-30 2010-12-31 B37923K5040C770 2009-06-26 2010-06-30 2010-12-31 B37923K5050C660 2009-06-26 2010-06-30 2010-12-31 B37923K5050C670 2009-06-26 2010-06-30 2010-12-31 B37923K5060C860 2009-06-26 2010-06-30 2010-12-31 B37923K5060C870 2009-06-26 2010-06-30 2010-12-31 B37923K5080C260 2009-06-26 2010-06-30 2010-12-31 B37923K5080C270 2009-06-26 2010-06-30 2010-12-31 B37923K5100J060 2009-06-26 2010-06-30 2010-12-31 For further information please contact your nearest EPCOS sales office, which will also support you in selecting a suitable substitute. The addresses of our worldwide sales network are presented at www.epcos.com/sales.

Chip size (inch/mm) = Temperature characteristic HQF 0402/1005 B37923 0603/1608 B37933 Termination Standard: K nickel barrier for all case sizes Rated voltage 5 (Code) 50 VDC Capacitance, coded (example) 100 10 100 pF = 10 pF Capacitance tolerance CR < 10 pF: B ±0.1 pF (standard for capacitance values ≤ 3.9 pF) C ±0.25 pF (standard for capacitance values ≤ 8.2 pF) D ±0.5 pF CR ≥ 10 pF: F ±1% G ±2% J ±5% (standard) K ±10% Decimal place for cap. values < 10 pF, otherwise not used Packaging 60 cardboard tape, 180-mm reel 70 cardboard tape, 330-mm reel Multilayer ceramic capacitors Chip HQF Page 2 of 19Please read Cautions and warnings and Important notes at the end of this document.

1) For C R >10 nF the time constant τ = C Rins is given.

Features

Ultra-low ESR and high Q factor Tight capacitance tolerances High stability with respect to time, temperature (TCC: 0 ± 60 ppm/°C), frequency and voltage Class 1 characteristic with copper inner electrodes Excellent attenuation High self-resonant frequency Lower power dissipation / Less energy absorption Based on AEC-Q200 Rev-C

Applications

High-frequency applications Matching circuits Cellular communication, Bluetooth, DECT Cable TV, satellite TV (LNB), GPS, satellite radio Filters, RF amplifiers, VCOs Termination Nickel barrier terminations (Ni) for lead-free soldering Options Alternative capacitance values and tolerances available on request Delivery mode Cardboard tape, 180-mm and 330-mm reel available Electrical data Temperature characteristic C0H Climatic category (IEC 60068-1) 55/125/56 Standard EIA Dielectric Class 1 Rated voltage VR 50 VDC Test voltage Vtest 2.5 VR/5 s VDC Capacitance range CR 0.3 pF ... 82 pF Temperature coefficient 0 ±60 10-6/K Dissipation factor (limit value) tan δ < 1.0 10-3 Insulation resistance1) (at +25 °C) Rins > 105 MΩ Insulation resistance1) (at +125 °C) Rins > 104 MΩ Time constant1) (at +25 °C) τ > 1000 s Time constant1) (at +125 °C) τ > 100 s Operating temperature range Top 55 ... +125 °C Ageing none Multilayer ceramic capacitors HQF Page 3 of 19Please read Cautions and warnings and Important notes at the end of this document.

CR CR ≤ 3.9 pF 4.7 pF ≤ CR ≤ 8.2 pF Code letter B (standard) C B C (standard) D CR CR ≥ 10 pF Code letter F G J (standard) K Tolerance ±1% ±2% ±5% ±10% Dimensional drawing Dimensions (mm) Case size (inch) (mm) 0402 1005 0603 1608 k 0.1 0.40 0.1 0.40 Tolerances to CECC 32101-801 Multilayer ceramic capacitors HQF Page 4 of 19Please read Cautions and warnings and Important notes at the end of this document.

Recommended dimensions (mm) for reflow soldering Case size (inch/mm) Type A C D Recommended dimensions (mm) for wave soldering Case size (inch/mm) Type A C D Termination Multilayer ceramic capacitors HQF Page 5 of 19Please read Cautions and warnings and Important notes at the end of this document.

Product range for HQF chip capacitors Size inch (l x w) mm (l x w) 0402 1005 0603 1608 Type B37923 B37933 CR \\ VR (VDC) 50 50 0.3 pF 0.4 pF 0.5 pF 0.6 pF 0.7 pF 0.8 pF 0.9 pF 1.0 pF 1.2 pF 1.5 pF 1.8 pF 2.2 pF 2.7 pF 3.3 pF 3.9 pF 4.7 pF 5.6 pF 6.8 pF 8.2 pF 10 pF 12 pF 15 pF 18 pF 22 pF 27 pF 82 pF Multilayer ceramic capacitors HQF Page 6 of 19Please read Cautions and warnings and Important notes at the end of this document.

Ordering codes and packing for HQF, 50 VDC, nickel barrier terminations Chip thickness Cardboard tape, ∅ 180-mm reel Cardboard tape, ∅ 330-mm reel 60 70 Case size 0402, 50 VDC 0.3 pF B37923K5000B3 0.5 ±0.05 10000 50000 0.4 pF B37923K5000B4 0.5 ±0.05 10000 50000 0.5 pF B37923K5000B5 0.5 ±0.05 10000 50000 0.6 pF B37923K5000B6 0.5 ±0.05 10000 50000 0.7 pF B37923K5000B7 0.5 ±0.05 10000 50000 0.8 pF B37923K5000B8 0.5 ±0.05 10000 50000 0.9 pF B37923K5000B9 0.5 ±0.05 10000 50000 1.0 pF B37923K5010B0 0.5 ±0.05 10000 50000 1.2 pF B37923K5010B2 0.5 ±0.05 10000 50000 1.5 pF B37923K5010B5 0.5 ±0.05 10000 50000 1.8 pF B37923K5010B8 0.5 ±0.05 10000 50000 2.2 pF B37923K5020B2 0.5 ±0.05 10000 50000 2.7 pF B37923K5020B7 0.5 ±0.05 10000 50000 3.3 pF B37923K5030B3 0.5 ±0.05 10000 50000 3.9 pF B37923K5030B9 0.5 ±0.05 10000 50000 4.7 pF B37923K5040C7 0.5 ±0.05 10000 50000 5.6 pF B37923K5050C6 0.5 ±0.05 10000 50000 6.8 pF B37923K5060C8 0.5 ±0.05 10000 50000 8.2 pF B37923K5080C2 0.5 ±0.05 10000 50000 10 pF B37923K5100J0 0.5 ±0.05 10000 50000 12 pF B37923K5120J0 0.5 ±0.05 10000 50000 15 pF B37923K5150J0 0.5 ±0.05 10000 50000 18 pF B37923K5180J0 0.5 ±0.05 10000 50000 22 pF B37923K5220J0 0.5 ±0.05 10000 50000 Multilayer ceramic capacitors HQF Page 7 of 19Please read Cautions and warnings and Important notes at the end of this document.

Ordering codes and packing for HQF, 50 VDC, nickel barrier terminations Chip thickness Cardboard tape, ∅ 180-mm reel Cardboard tape, ∅ 330-mm reel 60 70 Case size 0603, 50 VDC 0.4 pF B37933K5000B4 0.8 ±0.1 4000 16000 0.5 pF B37933K5000B5 0.8 ±0.1 4000 16000 0.6 pF B37933K5000B6 0.8 ±0.1 4000 16000 0.7 pF B37933K5000B7 0.8 ±0.1 4000 16000 0.8 pF B37933K5000B8 0.8 ±0.1 4000 16000 0.9 pF B37933K5000B9 0.8 ±0.1 4000 16000 1.0 pF B37933K5010B0 0.8 ±0.1 4000 16000 1.2 pF B37933K5010B2 0.8 ±0.1 4000 16000 1.5 pF B37933K5010B5 0.8 ±0.1 4000 16000 1.8 pF B37933K5010B8 0.8 ±0.1 4000 16000 2.2 pF B37933K5020B2 0.8 ±0.1 4000 16000 2.7 pF B37933K5020B7 0.8 ±0.1 4000 16000 3.3 pF B37933K5030B3 0.8 ±0.1 4000 16000 3.9 pF B37933K5030B9 0.8 ±0.1 4000 16000 4.7 pF B37933K5040C7 0.8 ±0.1 4000 16000 5.6 pF B37933K5050C6 0.8 ±0.1 4000 16000 6.8 pF B37933K5060C8 0.8 ±0.1 4000 16000 8.2 pF B37933K5080C2 0.8 ±0.1 4000 16000 10 pF B37933K5100J0 0.8 ±0.1 4000 16000 12 pF B37933K5120J0 0.8 ±0.1 4000 16000 15 pF B37933K5150J0 0.8 ±0.1 4000 16000 18 pF B37933K5180J0 0.8 ±0.1 4000 16000 22 pF B37933K5220J0 0.8 ±0.1 4000 16000 27 pF B37933K5270J0 0.8 ±0.1 4000 16000 82 pF B37933K5820J0** 0.8 ±0.1 4000 16000 Multilayer ceramic capacitors HQF Page 8 of 19Please read Cautions and warnings and Important notes at the end of this document.

1) Measured with impedance analyser E4991 A, parts not soldered. 2) Measured with network analyser HP 8753D, parts soldered. Typical RF performance for HQF capacitors, case size 0402, 50 VDC Capacitance pF fres1) MHz ESR @ 1 GHz2) mΩ Q @ 1 GHz2) ESR @ fres2) mΩ 0.3 23400 560 920 710 0.4 20350 490 805 605 0.5 19700 440 720 535 0.6 17400 405 650 485 0.7 15100 375 600 445 0.8 14450 355 560 415 0.9 12600 335 520 385 1.0 12000 320 490 365 1.2 10600 295 440 330 1.5 8900 265 390 290 1.8 7100 245 350 265 2.2 6400 225 310 235 2.7 6000 205 275 210 3.3 5500 185 245 190 3.9 5350 170 225 175 4.7 4650 155 200 155 5.6 3950 145 175 140 6.8 4100 130 155 125 8.2 3650 120 140 115 10 3350 110 120 105 12 3350 102 104 94 15 2600 92 88 82 18 2300 84 70 74 22 2200 78 56 66 Multilayer ceramic capacitors HQF Page 9 of 19Please read Cautions and warnings and Important notes at the end of this document.

3) Measured with impedance analyser E4991 A, parts not soldered. 4) Measured with network analyser HP 8753D, parts soldered. Typical RF performance for HQF capacitors, case size 0603, 50 VDC Capacitance pF fres3) MHz ESR @ 1 GHz4) mΩ Q @ 1 GHz4) ESR @ fres4) mΩ 0.4 17800 445 860 595 0.5 17100 400 805 540 0.6 13600 385 755 510 0.7 12200 345 635 440 0.8 11400 325 595 410 0.9 10600 315 560 390 1.0 9600 300 525 365 1.2 8800 275 455 335 1.5 7900 250 395 300 1.8 6900 240 360 285 2.2 5750 215 305 250 2.7 5100 200 270 235 3.3 4700 185 235 210 3.9 4150 175 210 200 4.7 3550 165 185 185 5.6 3130 150 160 170 6.8 2850 140 135 155 8.2 2730 130 115 140 10 2580 120 96 130 12 2400 110 76 118 15 2150 102 62 108 18 2050 96 50 100 22 1870 88 34 90 27 1780 80 26 82 Capacitance pF fres3) MHz ESR @ 1 GHz4) mΩ Q @ 1 GHz4) ESR @ fres4) mΩ 82 930 52 105 52 Multilayer ceramic capacitors HQF Page 10 of 19Please read Cautions and warnings and Important notes at the end of this document.

1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance. Typical characteristics for case size 04021) ESR versus capacitance C (for not soldered parts) ESR versus capacitance C at self-resonant frequency (for soldered parts) ESR versus frequency f Self-resonant frequency f res versus capacitance C Multilayer ceramic capacitors HQF Page 11 of 19Please read Cautions and warnings and Important notes at the end of this document.

1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance. Typical characteristics for case size 04021) Q factor versus capacitance C Q factor versus frequency f Multilayer ceramic capacitors HQF Page 12 of 19Please read Cautions and warnings and Important notes at the end of this document.

1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance. Typical characteristics for case size 06031) ESR versus capacitance C (for not soldered parts) ESR versus capacitance C at self-resonant frequency (for soldered parts) ESR versus frequency f Self-resonant frequency f res versus capacitance C Multilayer ceramic capacitors HQF Page 13 of 19Please read Cautions and warnings and Important notes at the end of this document.

1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance. Typical characteristics for case size 06031) Q factor versus capacitance C Q factor versus frequency f Multilayer ceramic capacitors HQF Page 14 of 19Please read Cautions and warnings and Important notes at the end of this document.

How to select ceramic capacitors Remember the following when selecting ceramic capacitors: 1. Ceramic capacitors that must fulfill high quality requirements must be qualified based on AEC-Q200 Rev-C. 2. When ceramic capacitors are used at the connection to a battery or power supply (e.g. clamp 15 or 30 in an automobile) or for safety-relevant applications, two single ceramic capacitors should be connected in series. Alternatively a ceramic capacitor with integrated series circuits should be used in order to reduce the possibility of a short circuit caused by a fracture. The MLSC from EPCOS contains such a series circuit in a single component. 3. The use of multilayer varistors (MLVs) is recommended for ESD protection (see chapter “Effects on mechanical, thermal and electrical stress”, section 1.4). 4. Additional stress factors such as continuous operating voltage or application-specific derating must be taken into account in the selection of components (refer to chapter “Reliability”). Recommendations for the circuit board design 1. Components with an optimized geometrical design are preferable where permitted by the application. 2. Use at least FR4 circuit board material. 3. Geometrically optimized circuit boards are preferable, especially those that cannot be deformed. 4. Ceramic capacitors should be placed with a sufficient minimum distance from the edge of a circuit board. High bending forces may be exerted there when boards are separated and during further processing of a board (e.g. when incorporating it in a housing). 5. Ceramic capacitors should always be placed parallel to the possible bending axis of a circuit board. 6. Screw connections should not be used to fix a board or connect several boards. Components should not be placed near screw holes. If screw connections are unavoidable, they should be cushioned, for instance using rubber pads. Multilayer ceramic capacitors HQF Page 15 of 19Please read Cautions and warnings and Important notes at the end of this document.

Recommendations for processing 1. Ensure correct positioning of a ceramic capacitor on the solder pad. 2. Be careful when using casting, injection-molded and molding compounds and cleaning agents. They can damage a capacitor. 3. Support a circuit board and reduce placement forces. 4. Do not straighten a board (manually) if it is distorted by soldering. 5. Separate boards with a peripheral saw, or preferably with a milling head (no dicing or breaking). 6. Be careful when subsequently placing heavy or leaded components (e.g. transformers or snap-in components) because of the danger of bending and fracture. 7. When testing, transporting, packing or inserting a board, avoid any deformation of it so that components are not damaged. 8. Avoid excessive force when plugging a connector into a device soldered onto a board. 9. Only mount ceramic capacitors using the soldering process (reflow or wave) that is permissible for them (see chapter “Soldering directions”). 10. When soldering, select the softest solder profile possible (heating time, peak temperature, cooling time) to avoid thermal stress and damage. 11. Ensure the correct solder meniscus height and solder quantity. 12. Ensure correct dosing of the cement. 13. Ceramic capacitors with external silver-palladium terminations are intended for conductive adhesion - they are not suited for lead-free soldering processes. This listing does not claim to be complete, but merely reflects the experience of EPCOS AG. Multilayer ceramic capacitors HQF Page 16 of 19Please read Cautions and warnings and Important notes at the end of this document.

A Area Fläche C Capacitance Kapazität C0 Initial (original) capacitance Anfangskapazität C1 Capacitance value after one hour's use Kapazitätswert nach einer Stunde CR Rated capacitance Nennkapazität C20 Capacitance at 20 °C Kapazität bei 20 °C C25 Capacitance at 25 °C Kapazität bei 25 °C ΔC Capacitance change Kapazitätsänderung D Bending displacement Durchbiegung Ea Activation energy Aktivierungsenergie ESR Equivalent series resistance Ersatzserienwiderstand F Force Kraft f Frequency Frequenz fmeas Measuring frequency Messfrequenz fres Self-resonant frequency Eigenresonanzfrequenz Itest Test current Prüfstrom k Ageing constant Alterungskonstante L Inductance Induktivität N Quantity (integer values) Anzahl (ganzzahliger Wert) Ploss Power dissipation or loss Verlustleistung Qel Electrical charge Elektrische Ladung Q Quality Güte Rins Insulation resistance Isolationswiderstand RP Parallel resistance Parallelwiderstand RS Series resistance (circuit resistance) Serienwiderstand SV Rate of rise of a voltage pulse Flankensteilheit eines Spannungsimpulses T Temperature Temperatur Tmeas Measuring temperature Messtemperatur Top Operating temperature Betriebstemperatur Tref Reference temperature Bezugstemperatur Ttest Test temperature Prüftemperatur t Time Zeit tr Rise time of a voltage pulse Anstiegszeit eines Spannungsimpulses ttest Test duration Prüfdauer tan δ Dissipation factor Verlustfaktor Multilayer ceramic capacitors HQF Page 17 of 19Please read Cautions and warnings and Important notes at the end of this document.

V0 Initial (original) voltage (basic voltage level) Anfangsspannung (Spannungsgrundpegel) Vmeas Measuring voltage Messspannung VR Rated voltage Nennspannung VS Amplitude of a voltage pulse Hub des Spannungsimpulses VRMS Measuring (root-mean-square or effective) AC voltage Effektivspannung Vtest Test voltage Prüfspannung |Z| Magnitude of impedance (AC resistance) Betrag der Impedanz (Wechselstromwiderstand) α Temperature coefficient Temperaturkoeffizient ε0 Absolute dielectric constant Absolute Dielektrizitätskonstante εr Relative dielectric constant Relative Dielektrizitätskonstante λ Failure rate Ausfallrate τ Time constant Zeitkonstante Abbreviations / Notes Symbol English German Lead spacing (in mm) Rastermaß (in mm) Surface-mounted devices Oberflächenmontierbares Bauelement * To be replaced by a number in ordering codes, type designations etc. Platzhalter für Zahl im Bestellnummern- code oder für die Typenbezeichnung. + To be replaced by a letter. Platzhalter für einen Buchstaben. All dimensions are given in mm. Alle Maße sind in mm angegeben. The commas used in numerical values denote decimal points. Verwendete Kommas in Zahlenwerten bezeichnen Dezimalpunkte. Multilayer ceramic capacitors HQF Page 18 of 19Please read Cautions and warnings and Important notes at the end of this document.

The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application . These statements are based on our knowledge of typical re- quirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application . As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incum- bent on the customer to check and decide whether an EPCOS product with the properties de- scribed in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified . In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Ma- terial Data Sheets on the Internet (www.epcos.com/material). Should you have any more de- tailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time . The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products . Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the fore- going for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to the current ver- sion of the "General Terms of Delivery for Products and Services in the Electrical In- dustry" published by the German Electrical and Electronics Industry Association (ZVEI). 7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CSMP, CSSP, CTVS, DSSP, MiniBlue, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.epcos.com/trademarks. Important notes Page 19 of 19