X8R EPCOS | Alldatasheet

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Multilayer ceramic capacitors Date: October 2006 /g227/g32EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet and the information contained therein without EPCOS’ prior express consent is prohibited. Chip capacitors, X8R

Please read Cautions and warnings and Important notes at the end of this document. Ordering code system Capacitance, coded (example) 102 10 · 102 pF = 1 nF 103 10 · 103 pF = 10 nF B37541 K 5 102 K 0 60 Packaging 60 cardboard tape, 180-mm reel 62 blister tape, 180-mm reel 70 cardboard tape, 330-mm reel 72 blister tape, 330-mm reel Internal coding Capacitance tolerance J /g177 5% K /g177 10% (standard) M ± 20% Rated voltage Rated voltage [VDC] Code Termination Type and size Chip size (inch / mm) Temperature characteristic X8R B37540 B37541 B37472 B37550 Standard: On request: K nickel barrier fo r all case sizes J silver-palladium for conductive adhesion for all case sizes Chip X8R Multilayer ceramic capacitors

Please read Cautions and warnings and Important notes at the end of this document.

Features

■ Max. relative capacitance change up to 150 /g176C is /g17715% ■ Non-linear capacitance change ■ High insulation resistance ■ High pulse strength ■ To AEC-Q200

Applications

■ Automotive ■ Blocking ■ Coupling ■ Decoupling ■ Interference suppression Termination ■ For soldering: Nickel barrier terminations (Ni) Options ■ Alternative capacitance tolerances available on request Delivery mode ■ Cardboard and blister tape (blister tape for chip thickness /g1791.2 /g1770.1 mm and case size/g321210) 180-mm and 330-mm reel available Electrical data Temperature characteristic X8R Max. relative capacitance change within –55 /g176C to +150 /g176C /g68C/C /g17715 % Climatic category (IEC 60068-1) 55/150/56 Standard EIA Dielectric Class 2 Rated voltage 1) VR 50 VDC Test voltage V test 2.5 · V R/5 s VDC Capacitance range / E series C R 100 pF … 150 nF (E6) Dissipation factor (limit value) tan /g100 <25 · 10 –3 Insulation resistance2) at + 25 /g176CR ins >10 5 M/g87 Insulation resistance2) at +125 /g176CR ins >10 4 M/g87 Time constant2) at + 25 /g176C /g116 >1000 s Time constant2) at +125 /g176C /g116 >100 s Operating temperature range T op –55 … +150 /g176C Ageing3) yes 1) Note: No operation on AC line. 2) For C R >10 nF the time constant /g116 = C · R ins is given. 3) Refer to chapter “General technical information”, “Ageing”. Chip X8R Multilayer ceramic capacitors

Please read Cautions and warnings and Important notes at the end of this document. Multilayer ceramic capacitorsX8R Capacitance tolerances Dimensional drawing Dimensions (mm) Tolerances to CECC 32101-801 Code letter J K (standard) M Tolerance /g1775% /g17710% /g17720% Case size (inch) (mm) 0603 1608 0805 2012 1206 3216 1210 3225 KKE0329-N k s b k X8R

Please read Cautions and warnings and Important notes at the end of this document. X8RMultilayer ceramic capacitors Recommended solder pad Recommended dimensions (mm) for reflow soldering Recommended dimensions (mm) for wave soldering Termination Case size (inch/mm) Type A C D Case size (inch/mm) Type A C D KKE0308-1 D A C External electrode Intermediate electrode Substrate electrode KKE0484-W Ni Sn Ag Inner electrode AgPd Termination (nickel barrier) Ceramic body X8R

Please read Cautions and warnings and Important notes at the end of this document. Multilayer ceramic capacitorsX8R Product range chip capacitors, X8R Size1) inch mm 0603 1608 0805 2012 1206 3216 1210 3225 Type B37540 B37541 B37472 B37550 50 50 50 50 100 pF 150 pF 220 pF 330 pF 470 pF 680 pF 1.0 nF 1.5 nF 2.2 nF 3.3 nF 4.7 nF 6.8 nF 10 nF 15 nF 22 nF 33 nF 47 nF 68 nF 100 nF 150 nF 1) l /g180 b (inch) / l /g180 b (mm) VR (VDC) CR X8R

Please read Cautions and warnings and Important notes at the end of this document. X8RMultilayer ceramic capacitors Ordering codes and packing for X8R, 50 VDC, nickel barrier terminations Chip thickness Cardboard tape, /g198 180-mm reel Cardboard tape, /g198 330-mm reel 60 70 CR1) Ordering code2) mm pcs/reel pcs/reel Case size 0603, 50 VDC 100. pF B37540K5101K0 0.8 /g177 0.1 4000 16000 150. pF B37540K5151K0 0.8 /g177 0.1 4000 16000 220. pF B37540K5221K0 0.8 /g177 0.1 4000 16000 330. pF B37540K5331K0 0.8 /g177 0.1 4000 16000 470. pF B37540K5471K0 0.8 /g177 0.1 4000 16000 680. pF B37540K5681K0 0.8 /g177 0.1 4000 16000 1.0 nF B37540K5102K0 0.8 /g177 0.1 4000 16000 1.5 nF B37540K5152K0 0.8 /g177 0.1 4000 16000 2.2 nF B37540K5222K0 0.8 /g177 0.1 4000 16000 3.3 nF B37540K5332K0 0.8 /g177 0.1 4000 16000 4.7 nF B37540K5472K0 0.8 /g177 0.1 4000 16000 Case size 0805, 50 VDC 470. pF B37541K5471K0 0.6 /g177 0.1 5000 20000 680. pF B37541K5681K0 0.6 /g177 0.1 5000 20000 1.0 nF B37541K5102K0 0.6 /g177 0.1 5000 20000 1.5 nF B37541K5152K0 0.6 /g177 0.1 5000 20000 2.2 nF B37541K5222K0 0.6 /g177 0.1 5000 20000 3.3 nF B37541K5332K0 0.6 /g177 0.1 5000 20000 4.7 nF B37541K5472K0 0.6 /g177 0.1 5000 20000 6.8 nF B37541K5682K0 0.6 /g177 0.1 5000 20000 10. nF B37541K5103K0 0.6 /g177 0.1 5000 20000 15. nF B37541K5153K0 0.6 /g177 0.1 5000 20000 22. nF B37541K5223K0 0.6 /g177 0.1 5000 20000 1) Other capacitance values on request. 2) The table contains the ordering codes for the standard capacitance tolerance. For other available capacitance tolerances see page 4. ^ ^ X8R; 0603 and 0805

Please read Cautions and warnings and Important notes at the end of this document. Multilayer ceramic capacitorsX8R Ordering codes and packing for X8R, 50 VDC, nickel barrier terminations Chip thickness Cardboard tape, /g198 180-mm reel Cardboard tape, /g198 330-mm reel 60 70 CR1) Ordering code2) mm pcs/reel pcs/reel Case size 1206, 50 VDC 1.0 nF B37472K5102K0 0.8 /g177 0.1 4000 16000 1.5 nF B37472K5152K0 0.8 /g177 0.1 4000 16000 2.2 nF B37472K5222K0 0.8 /g177 0.1 4000 16000 3.3 nF B37472K5332K0 0.8 /g177 0.1 4000 16000 4.7 nF B37472K5472K0 0.8 /g177 0.1 4000 16000 6.8 nF B37472K5682K0 0.8 /g177 0.1 4000 16000 10. nF B37472K5103K0 0.8 /g177 0.1 4000 16000 15. nF B37472K5153K0 0.8 /g177 0.1 4000 16000 22. nF B37472K5223K0 0.8 /g177 0.1 4000 16000 33. nF B37472K5333K0 0.8 /g177 0.1 4000 16000 47. nF B37472K5473K0 0.8 /g177 0.1 4000 16000 68. nF B37472K5683K0 1.2 /g177 0.1 3000 3) 120004) 100. nF B37472K5104K0 1.2 /g177 0.1 3000 3) 120004) Blister tape, /g198 180-mm reel Blister tape, /g198 330-mm reel 62 72 pcs/reel pcs/reel Case size 1210, 50 VDC 10. nF B37550K5103K0 0.8 /g177 0.1 4000 16000 15. nF B37550K5153K0 0.8 /g177 0.1 4000 16000 22. nF B37550K5223K0 0.8 /g177 0.1 4000 16000 33. nF B37550K5333K0 0.8 /g177 0.1 4000 16000 47. nF B37550K5473K0 0.8 /g177 0.1 4000 16000 68. nF B37550K5683K0 0.8 /g177 0.1 4000 16000 100. nF B37550K5104K0 0.8 /g177 0.1 4000 16000 150. nF B37550K5154K0 1.2 /g177 0.1 3000 12000 1) Other capacitance values on request. 2) The table contains the ordering codes for the standard capacitance tolerance. For other available capacitance tolerances see page 4. 3) Blister tape, 180-mm reel, ordering code 62 4) Blister tape, 330-mm reel, ordering code ** 72 ^ ^ ^ ^ X8R; 1206 and 1210

Please read Cautions and warnings and Important notes at the end of this document. X8RMultilayer ceramic capacitors Typical characteristics1) Capacitance change /g68C/C25 versus temperature T Capacitance change /g68C/C0 versus superimposed DC voltage V Impedance |Z| versus frequency f Dissipation factor tan /g100 versus temperature T 1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance. KKE0417-6 T 60_ C˚ 50_ 45_ 40_ 35_ 30_ 25_ 20_ 15_ 10_ 40_ 20_ 0 20 40 60 80 100 120 160 C25 C KKE0489-3 V 10_ 15_ 20_ 25_ 30_ 35_ 100 nF/50 V/size 1206 501005 3 0 2015 25 40 35 45 V KKE0264-6 100 101 102 Ω Z 100 101 10102 MHz 3 f 100 nF 10 nF 1 nF 110 Case size 1206 KKE0265-D tan T δ 310 060_ 40_ 20_ 1206020 40 80 100 ˚C 160 X8R

Please read Cautions and warnings and Important notes at the end of this document. Multilayer ceramic capacitorsX8R Typical characteristics1) Insulation resistance Rins versus temperature T Capacitance change /g68C/C1 versus time t 1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance. KKE0266-L T 107 insR MΩ 106 105 104 103 102 20 60 100 16020_60_ C˚ KKE0394-X 5__ 10__ 15__ 20__ t h010 110 210 10 3 1045 10 X8R

Multilayer ceramic capacitors Cautions and warnings Notes on the selection of ceramic capacitors In the selection of ceramic capacitors, the following criteria must be considered: 1. Depending on the application, ceramic capacitors used to meet high quality requirements should at least satisfy the specifications to AEC-Q200. They must meet quality requirements going beyond this level in terms of ruggedness (e.g. mechanical, thermal or electrical) in the case of critical circuit configurations and applications (e.g. in safety-relevant applications such as ABS and airbag equipment or durable industrial goods). 2. At the connection to the battery or power supply (e.g. clamp 15 or 30 in the automobile) and at positions with stranding potential, to reduce the probability of short circuits following a fracture, two ceramic capacitors must be connected in series and/or a ceramic capacitor with integrated series circuit should be used. The MLSC from EPCOS contains such a series circuit in a single component. 3. Ceramic capacitors with the temperature characteristics Z5U and Y5V do not satisfy the require- ments to AEC-Q200 and are mechanically and electrically less rugged than C0G or X7R/X8R ceramic capacitors. In applications that must satisfy high quality requirements, therefore, these capacitors should not be used as discrete components (see the chapter “Effects on mechanical, thermal and electrical stress”, point 1.4). 4. For ESD protection, preference should be given to the use of multilayer varistors (MLV) (see the chapter “Effects on mechanical, thermal and electrical stress”, point 1.4). 5. An application-specific derating or continuous operating voltage must be considered in order to cushion (unexpected) additional stresses (see the chapter “Reliability”). The following should be considered in circuit board design 1. If technically feasible in the application, preference should be given to components having an optimal geometrical design. 2. At least FR4 circuit board material should be used. 3. Geometrically optimal circuit boards should be used, ideally those that cannot be deformed. 4. Ceramic capacitors must always be placed a su fficient minimum distance from the edge of the circuit board. High bending forces may be exerted there when the panels are separated and dur- ing further processing of the board (such as when incorporating it into a housing). 5. Ceramic capacitors should always be placed paral lel to the possible bending axis of the circuit board. 6. No screw connections should be used to fix the board or to connect several boards. Compo- nents should not be placed near screw holes. If screw connections are unavoidable, they must be cushioned (for instance by rubber pads).

Multilayer ceramic capacitors Cautions and warnings The following should be considered in the placement process 1. Ensure correct positioning of the ceramic capacitor on the solder pad. 2. Caution when using casting, injection-mo lded and molding compounds and cleaning agents, as these may damage the capacitor. 3. Support the circuit board and reduce the placement forces. 4. A board should not be straightened (manually) if it has been distorted by soldering. 5. Separate panels with a peripheral saw, or bet ter with a milling head (no dicing or breaking). 6. Caution in the subsequent placement of heavy or leaded components (e.g. transformers or snap-in components): danger of bending and fracture. 7. When testing, transporting, packing or incor porating the board, avoid any deformation of the board not to damage the components. 8. Avoid the use of excessive force when plu gging a connector into a device soldered onto the board. 9. Ceramic capacitors must be soldered only by th e mode (reflow or wave soldering) permissible for them (see the chapter “Soldering directions”). 10. When soldering the most gentle solder profile feasible should be selected (heating time, peak temperature, cooling time) in order to avoid thermal stresses and damage. 11. Ensure the correct solder meniscus height and solder quantity. 12. Ensure correct dosing of the cement quantity. 13. Ceramic capacitors with an AgPd external termination are not suited for the lead-free solder process: they were developed only for conductive adhesion technology. This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.

Multilayer ceramic capacitors Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application . These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of passive electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of a passive electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of a passive electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as “hazardous”) . Useful information on this will be found in our Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time . The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products . Consequently, we cannot guarantee that all products named in this publication will always be available. 6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms of Delivery for Products and Services in the Electrical Industry” published by the German Electrical and Electronics Industry Association (ZVEI). 7. The trade names EPCOS, EPCOS-JONES, Baoke, CeraDiode, CSSP, MLSC, PhaseCap, PhaseMod, SIFERRIT, SIFI, SIKOREL, SilverC ap, SIMID, SIOV, SIP5D, SIP5K, UltraCap, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.epcos.com/trademarks.