B330B-13-F MULTICOMP | Alldatasheet
Document overview
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- PDF pages: 3
Technical content
Page <1> V1.011/09/19 Schottky Barrier Rectifier Newark.com/multicomp-pro Farnell.com/multicomp-pro Element14.com/multicomp-pro Features:
- For Surface Mounted Applications
- Low Profile Package
- Built-In Strain Relief
- Metal Silicon Junction, Majority Carrier Conduction
- High Surge Capability
- Low Power Loss, High Efficiency
- For Use In Low Voltage High Frequency Inverters, Free Wheeling And Polarity Protection Applications
- Guard Ring For Over Voltage Protection
- High Temperature Soldering Guaranteed : 250°C/10 Seconds At Terminals Mechanical Data
- Case: JEDEC SMB, molded plastic over passivated chip
- Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
- Polarity: Colour band denotes cathode end
- Weight: 0.003oz, 0.093g Maximum Ratings and Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified Notes: (1) Pulse test: 300μS pulse width,1%duty cycle. (2) PCB mounted with 0.55ʺ × 0.55ʺ (14 × 14mm2) copper pad areas. Characteristic Symbol B330B-13-F B340B-13-F B360B-13-F Units Maximum repetitive peak reverse voltage VRRM 30 40 60 V Maximum RMS voltage VRWS 21 28 42 V Maximum DC blocking voltage V DC 30 40 50 V Maximum average forward rectified current at TL=See Fig. 2 (Note 2) IF(AV) 3 A Peak forward surge current 8.3ms single half-sine-wave IFSM 50 A Maximum instantaneous forward voltage at 3A (Note 1) VF 0.5 0.7 V Maximum DC reverse current at TA = 25°C at rated DC blocking voltage at TA = 100°C (Note 1) IR 0.5 20 mA Typical thermal resistance (Note 2) RθJA RθJL 20 °C/W Operating junction and storage temperature range TJ, TSTG -55 to +125 °C
Page <2> V1.011/09/19 Schottky Barrier Rectifier Newark.com/multicomp-pro Farnell.com/multicomp-pro Element14.com/multicomp-pro
Page <3> V1.011/09/19 Schottky Barrier Rectifier Newark.com/multicomp-pro Farnell.com/multicomp-pro Element14.com/multicomp-pro SMB Dim. Min. Max. A 4.3 4.7 B 3.3 3.7 C 2 2.3 D 5.05 5.55 E 0.2 Typ. F 0.95 1.55 G 0.2 Max. H 2.1 2.5 I 1.85 2.15 Dimensions : Millimetres Dimensions : Millimetres Package Outline Dimensions Soldering Footprint Device Package Shipping B330B -13-F B340B -13-F B360B -13-F DO-214AA(SMB) 3,000 / Tape & Reel
Package Information
Schottky Barrier Rectifier B330B-13-F B340B-13-F B360B-13-F Part Number Table Important Notice : This data sheet and its contents (the “Information”) belong to the members of the AVNET group of companies (the “Group”) or are licensed to it. No licence is granted for the use of it other than for information purposes in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change without notice and replaces all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any error in or omission from it or for any use made of it. Users of this data sheet should check for themselves the Information and the suitability of the products for their purpose and not make any assumptions based on information included or omitted. Liability for loss or damage resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the Group was aware of the possibility of such loss or damage arising) is excluded. This will not operate to limit or restrict the Group’s liability for death or personal injury resulting from its negligence. Multicomp Pro is the registered trademark of Premier Farnell Limited 2019.