MKP-B32774778 TDK | Alldatasheet

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Metallized Polypropylene Film Capacitors (MKP) Series/Type: B32774 ... B32778 Date: October 2014 © EPCOS AG 2014. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.

Industrial and high-end power supplies Solar inverters Climatic Max. operating temperature: 105 °C (case) Climatic category (IEC 60068-1): 40/105/56 Construction Dielectric: Polypropylene (MKP) Plastic case (UL 94 V-0) Epoxy resin sealing (UL 94 V-0)

Features

Capacitance values up to 480 µF High CV product, compact Good self-healing properties Over-voltage capability Low losses with high current capability High reliability Long useful life RoHS-compatible Terminals Parallel wire leads, lead-free tinned 2-pin, 4-pin and 12-pin versions Standard lead lengths: 6 1 mm Marking Manufacturer's logo and lot number, date code, rated capacitance (coded), capacitance tolerance (code letter) and rated DC voltage Delivery mode Bulk (untaped) Metallized polypropylene film capacitors (MKP) B32774 ... B32778 MKP DC link high density series up to 480 µF Page 2 of 43Please read Cautions and warnings and Important notes at the end of this document.

Number of wires Lead spacing ±0.4 Lead diameter d1 ±0.05 Type 2-pin 27.5 0.8 B32774D 2-pin 37.5 1.0 B32776E 2-pin 37.5 1.0 B32776T 4-pin 37.5 1.2 B32776G 4-pin 37.5 1.2 B32776T 4-pin 52.5 1.2 B32778T 4-pin 52.5 1.2 B32778G 12-pin 52.5 1.2 B32778J Dimensional drawings 2-pin versions B32774D, B32776E B32774D B32776E Lead spacing ±0.4: 27.5 37.5 Lead diameter d1: 0.8 1.0 (Dimensions in mm) B32776T (low profile) Lead spacing ±0.4: 37.5 Lead diameter d1: 1.0 (Dimensions in mm) B32774 ... B32778 MKP DC link high density series up to 480 µF Page 3 of 43Please read Cautions and warnings and Important notes at the end of this document.

Dimensional drawings 4-pin versions B32776G, B32778G B32776G B32778G Lead spacing ±0.4: 37.5 52.5 Lead diameter d1: 1.2 1.2 (Dimensions in mm) B32776T, B32778T (low profile) B32776T B32778T Lead spacing ±0.4: 37.5 52.5 Lead diameter d1: 1.2 1.2 (Dimensions in mm) Dimensional drawing 12-pin version B32778J Lead spacing ±0.4: 52.5 Lead diameter d1: 1.2 (Dimensions in mm) B32774 ... B32778 MKP DC link high density series up to 480 µF Page 4 of 43Please read Cautions and warnings and Important notes at the end of this document.

Overview of available types Lead spacing 27.5 mm 37.5 mm Type B32774 B32776 Page 7 8 VR (V DC) 450 800 1100 1300 450 575 800 900 1100 1300 CR (µF) 1.5 2.0 2.7 3.0 3.3 3.5 3.9 5.0 6.8 7.0 7.5 8.0 8.5 9.0 B32774 ... B32778 MKP DC link high density series up to 480 µF Page 5 of 43Please read Cautions and warnings and Important notes at the end of this document.

Lead spacing 52.5 mm Type B32778 Page 11 VR (V DC) 450 575 800 900 1100 1300 CR (µF) 100 110 120 130 150 170 180 200 210 270 360 480 B32774 ... B32778 MKP DC link high density series up to 480 µF Page 6 of 43Please read Cautions and warnings and Important notes at the end of this document.

1) Capacitance value measured at 1 kHz 2) Max ripple current I RMS at 70 °C, 10 kHz for ΔT ≤ 20 °C at ΔESRtyp ≤ ±5% 3) Typical ESL value measured at resonance frequency (see specific graphs of Z vs freq) Ordering codes and packing units (lead spacing 27.5 mm) CR1) µF Max. dimensions w × h × l mm mm Ordering code (composition see below) IRMS,max2) 70 °C 10 kHz A ESRtyp 70 °C 10 kHz mΩ ESLtyp3) 70 °C 10 kHz nH tan δ 1 kHz 10-3 tan δ 10 kHz 10-3 pcs. MOQ MOQ = Minimum Order Quantity, consisting of 4 packing units. Intermediate capacitance values are available on request. Composition of ordering code + = Capacitance tolerance code: J = ±5% K = ±10% VR,70 °C = 450 V DC, V op,85 °C = 450 V DC VR,70 °C = 800 V DC, V op,85 °C = 700 V DC VR,70 °C = 1100 V DC, Vop,85 °C = 920 V DC VR,70 °C = 1300 V DC, Vop,85 °C = 1100 V DC B32774 MKP DC link high density series up to 480 µF Page 7 of 43Please read Cautions and warnings and Important notes at the end of this document.

1) Capacitance value measured at 1 kHz 2) Max ripple current I RMS at 70 °C, 10 kHz for ΔT ≤ 20 °C at ΔESRtyp ≤ ±5% 3) Typical ESL value measured at resonance frequency (see specific graphs of Z vs freq) Ordering codes and packing units (lead spacing 37.5 mm) CR1) µF Max. dimensions w × h × l mm mm Ordering code (composition see below) IRMS,max2) 70 °C 10 kHz A ESRtyp 70 °C 10 kHz mΩ ESLtyp3) 70 °C 10 kHz nH tan δ 1 kHz 10-3 tan δ 10 kHz 10-3 pcs. MOQ MOQ = Minimum Order Quantity, consisting of 4 packing units. Intermediate capacitance values are available on request. Composition of ordering code + = Capacitance tolerance code: J = ±5% K = ±10% VR,70 °C = 450 V DC, V op,85 °C = 450 V DC VR,70 °C = 575 V DC, V op,85 °C = 500 V DC B32776 MKP DC link high density series up to 480 µF Page 8 of 43Please read Cautions and warnings and Important notes at the end of this document.

1) Capacitance value measured at 1 kHz 2) Max ripple current I RMS at 70 °C, 10 kHz for ΔT ≤ 20 °C at ΔESRtyp ≤ ±5% 3) Typical ESL value measured at resonance frequency (see specific graphs of Z vs freq) Ordering codes and packing units (lead spacing 37.5 mm) CR1) µF Max. dimensions w × h × l mm mm Ordering code (composition see below) IRMS,max2) 70 °C 10 kHz A ESRtyp 70 °C 10 kHz mΩ ESLtyp3) 70 °C 10 kHz nH tan δ 1 kHz 10-3 tan δ 10 kHz 10-3 pcs. MOQ MOQ = Minimum Order Quantity, consisting of 4 packing units. Intermediate capacitance values are available on request. Composition of ordering code + = Capacitance tolerance code: J = ±5% K = ±10% VR,70 °C = 800 V DC, V op,85 °C = 700 V DC VR,70 °C = 900 V DC, V op,85 °C = 800 V DC B32776 MKP DC link high density series up to 480 µF Page 9 of 43Please read Cautions and warnings and Important notes at the end of this document.

1) Capacitance value measured at 1 kHz 2) Max ripple current I RMS at 70 °C, 10 kHz for ΔT ≤ 20 °C at ΔESRtyp ≤ ±5% 3) Typical ESL value measured at resonance frequency (see specific graphs of Z vs freq) Ordering codes and packing units (lead spacing 37.5 mm) CR1) µF Max. dimensions w × h × l mm mm Ordering code (composition see below) IRMS,max2) 70 °C 10 kHz A ESRtyp 70 °C 10 kHz mΩ ESLtyp3) 70 °C 10 kHz nH tan δ 1 kHz 10-3 tan δ 10 kHz 10-3 pcs. MOQ MOQ = Minimum Order Quantity, consisting of 4 packing units. Intermediate capacitance values are available on request. Composition of ordering code + = Capacitance tolerance code: J = ±5% K = ±10% VR,70 °C = 1100 V DC, Vop,85 °C = 920 V DC VR,70 °C = 1300 V DC, Vop,85 °C = 1100 V DC B32776 MKP DC link high density series up to 480 µF Page 10 of 43Please read Cautions and warnings and Important notes at the end of this document.

1) Capacitance value measured at 1 kHz 2) Max ripple current I RMS at 70 °C, 10 kHz for ΔT ≤ 20 °C at ΔESRtyp ≤ ±5% 3) Typical ESL value measured at resonance frequency (see specific graphs of Z vs freq) Ordering codes and packing units (lead spacing 52.5 mm, P1 = 20.3 mm) CR1) µF Max. dimensions w × h × l mm Ordering code (composition see below) IRMS,max2) 70 °C 10 kHz A ESRtyp 70 °C 10 kHz mΩ ESLtyp3) 70 °C 10 kHz nH tan δ 1 kHz 10-3 tan δ 10 kHz 10-3 pcs. MOQ MOQ = Minimum Order Quantity, consisting of 4 packing units. Intermediate capacitance values are available on request. Composition of ordering code + = Capacitance tolerance code: J = ±5% K = ±10% VR,70 °C = 450 V DC, V op,85 °C = 450 V DC VR,70 °C = 575 V DC, V op,85 °C = 500 V DC VR,70 °C = 800 V DC, V op,85 °C = 700 V DC B32778 MKP DC link high density series up to 480 µF Page 11 of 43Please read Cautions and warnings and Important notes at the end of this document.

1) Capacitance value measured at 1 kHz 2) Max ripple current I RMS at 70 °C, 10 kHz for ΔT ≤ 20 °C at ΔESRtyp ≤ ±5% 3) Typical ESL value measured at resonance frequency (see specific graphs of Z vs freq) Ordering codes and packing units (lead spacing 52.5 mm, P1 = 20.3 mm) CR1) µF Max. dimensions w × h × l mm Ordering code (composition see below) IRMS,max2) 70 °C 10 kHz A ESRtyp 70 °C 10 kHz mΩ ESLtyp3) 70 °C 10 kHz nH tan δ 1 kHz 10-3 tan δ 10 kHz 10-3 pcs. MOQ MOQ = Minimum Order Quantity, consisting of 4 packing units. Intermediate capacitance values are available on request. Composition of ordering code + = Capacitance tolerance code: J = ±5% K = ±10% VR,70 °C = 900 V DC, V op,85 °C = 800 V DC VR,70 °C = 1100 V DC, Vop,85 °C = 920 V DC VR,70 °C = 1300 V DC, Vop,85 °C = 1100 V DC B32778 MKP DC link high density series up to 480 µF Page 12 of 43Please read Cautions and warnings and Important notes at the end of this document.

Reference standard: IEC 61071. All data given at T = 20 °C, unless otherwise specified. Operating temperature range (case) Max. operating temperature, Top,max Upper category temperature Tmax Lower category temperature Tmin +105 °C +105 °C –40 °C Insulation Resistance Rins given as time constant τ = CR Rins, rel. humidity ≤ 65% (minimum as-delivered values) τ > 10 000 s (after 1 min.) For VR ≥ 500 V measured at 500 V For VR < 500 V measured at VR DC test voltage between terminals (10 s) 1.5 VR Voltage test terminal to case (10 s) 2110 V AC, 50 Hz Pulse Handling Capability (V/µs) IP (A) / C (µF) Reliability: Failure rate λ 10 fit (≤ 1 10-9/h) at 0.5 VR, 40 °C For conversion to other operating conditions, refer to chapter "Quality assurance", data book 2009 "Film capacitors", page 442. Service life tSL 100 000 h at VR and 70 °C VR (V DC) 450 575 800 900 1100 1300 Continuous operation voltage Vop (V DC) at 70 °C 450 575 800 900 1100 1300 Continuous operation voltage Vop (V DC) at 85 °C 450 500 700 800 920 1100 For temperatures between 85 °C and 105 °C 1.33%/°C of Vop derating compared to Vop at 85 °C Typical waveforms Restrictions: VR: Maximum operating peak voltage of either polarity but of a non-reversing waveform, for which the capacitor has been designed for continuous operation. AC ≤ 0.2 VR B32774 ... B32778 MKP DC link high density series up to 480 µF Page 13 of 43Please read Cautions and warnings and Important notes at the end of this document.

Overvoltage Maximum duration within one day Observation 1.1 VR 1.15 VR 1.2 VR 1.3 VR 30% of on-load duration 30 min. 5 min. 1 min. System regulation System regulation System regulation System regulation NOTE 1 An overvoltage equal to 1.5 VR for 30 ms is permitted 1000 times during the life of the capacitor. The amplitudes of the overvoltages that may be tolerated without significant reduction in the life time of the capacitor depend on their duration, the number of application and the capacitor temperature. In addition these values assume that the overvoltages may appear when the internal temperature of the capacitor is less than 0 °C but within the temperature category. NOTE 2 The average applied voltage must not be higher than the specified voltage. Pulse handling capability "dV/dt" represents the maximum permissible voltage change per unit of time for non-sinusoidal voltages, expressed in V/µs. Note: The values of dV/dt provided below must not be exceeded in order to avoid damaging the capacitor. dV/dt values Lead spacing 27.5 mm 37.5 mm Type B32774 B32776 VR (V DC) 450 800 1100 1300 450 575 800 900 1100 1300 dV/dt in V/µs 30 40 75 100 21 22 22 35 54 73 Lead spacing 52.5 mm Type B32778 VR (V DC) 450 575 800 900 1100 1300 dV/dt in V/µs 14 14 15 22 35 50 B32774 ... B32778 MKP DC link high density series up to 480 µF Page 14 of 43Please read Cautions and warnings and Important notes at the end of this document.

Additional technical information can be found under "Design support" on www.epcos.com Impedance Z versus frequency f (typical values) ESR versus frequency f (typical values) Lead spacing 27.5 mm / B32774D4* Lead spacing 27.5 mm / B32774D4* Impedance Z versus frequency f (typical values) ESR versus frequency f (typical values) Lead spacing 27.5 mm / B32774D8* Lead spacing 27.5 mm / B32774D8* B32774 MKP DC link high density series up to 480 µF Page 15 of 43Please read Cautions and warnings and Important notes at the end of this document.

Impedance Z versus frequency f (typical values) ESR versus frequency f (typical values) Lead spacing 27.5 mm / B32774D0* Lead spacing 27.5 mm / B32774D0* Impedance Z versus frequency f (typical values) ESR versus frequency f (typical values) Lead spacing 27.5 mm / B32774D1* Lead spacing 27.5 mm / B32774D1* B32774 MKP DC link high density series up to 480 µF Page 16 of 43Please read Cautions and warnings and Important notes at the end of this document.

Impedance Z versus frequency f (typical values) ESR versus frequency f (typical values) Lead spacing 37.5 mm / B32776-E4x Lead spacing 37.5 mm / B32776-E4x Impedance Z versus frequency f (typical values) ESR versus frequency f (typical values) Lead spacing 37.5 mm / B32776-G4x Lead spacing 37.5 mm / B32776-G4x B32776 MKP DC link high density series up to 480 µF Page 17 of 43Please read Cautions and warnings and Important notes at the end of this document.

Impedance Z versus frequency f (typical values) ESR versus frequency f (typical values) Lead spacing 37.5 mm / B32776-E5x Lead spacing 37.5 mm / B32776-E5x Impedance Z versus frequency f (typical values) ESR versus frequency f (typical values) Lead spacing 37.5 mm / B32776-G5x Lead spacing 37.5 mm / B32776-G5x B32776 MKP DC link high density series up to 480 µF Page 18 of 43Please read Cautions and warnings and Important notes at the end of this document.

Impedance Z versus frequency f (typical values) ESR versus frequency f (typical values) Lead spacing 37.5 mm / B32776-E8x Lead spacing 37.5 mm / B32776-E8x Impedance Z versus frequency f (typical values) ESR versus frequency f (typical values) Lead spacing 37.5 mm / B32776-G8x Lead spacing 37.5 mm / B32776-G8x B32776 MKP DC link high density series up to 480 µF Page 19 of 43Please read Cautions and warnings and Important notes at the end of this document.

Impedance Z versus frequency f (typical values) ESR versus frequency f (typical values) Lead spacing 37.5 mm / B32776-E9x Lead spacing 37.5 mm / B32776-E9x Impedance Z versus frequency f (typical values) ESR versus frequency f (typical values) Lead spacing 37.5 mm / B32776-G9x Lead spacing 37.5 mm / B32776-G9x B32776 MKP DC link high density series up to 480 µF Page 20 of 43Please read Cautions and warnings and Important notes at the end of this document.

Impedance Z versus frequency f (typical values) ESR versus frequency f (typical values) Lead spacing 37.5 mm / B32776-E0x Lead spacing 37.5 mm / B32776-E0x Impedance Z versus frequency f (typical values) ESR versus frequency f (typical values) Lead spacing 37.5 mm / B32776-G0x Lead spacing 37.5 mm / B32776-G0x B32776 MKP DC link high density series up to 480 µF Page 21 of 43Please read Cautions and warnings and Important notes at the end of this document.

Impedance Z versus frequency f (typical values) ESR versus frequency f (typical values) Lead spacing 37.5 mm / B32776-E1x Lead spacing 37.5 mm / B32776-E1x Impedance Z versus frequency f (typical values) ESR versus frequency f (typical values) Lead spacing 37.5 mm / B32776-G1x Lead spacing 37.5 mm / B32776-G1x B32776 MKP DC link high density series up to 480 µF Page 22 of 43Please read Cautions and warnings and Important notes at the end of this document.

Impedance Z versus frequency f (typical values) ESR versus frequency f (typical values) Lead spacing 37.5 mm / B32776-Tx / 2-pins Lead spacing 37.5 mm / B32776-Tx / 2-pins Impedance Z versus frequency f (typical values) ESR versus frequency f (typical values) Lead spacing 37.5 mm / B32776-Tx / 4-pins Lead spacing 37.5 mm / B32776-Tx / 4-pins B32776 MKP DC link high density series up to 480 µF Page 23 of 43Please read Cautions and warnings and Important notes at the end of this document.

Impedance Z versus frequency f (typical values) ESR versus frequency f (typical values) Lead spacing 52.5 mm / B32778-G4x Lead spacing 52.5 mm / B32778-G4x Impedance Z versus frequency f (typical values) ESR versus frequency f (typical values) Lead spacing 52.5 mm / B32778-G5x Lead spacing 52.5 mm / B32778-G5x B32778 MKP DC link high density series up to 480 µF Page 24 of 43Please read Cautions and warnings and Important notes at the end of this document.

Impedance Z versus frequency f (typical values) ESR versus frequency f (typical values) Lead spacing 52.5 mm / B32778-G8x Lead spacing 52.5 mm / B32778-G8x Impedance Z versus frequency f (typical values) ESR versus frequency f (typical values) Lead spacing 52.5 mm / B32778-G9x Lead spacing 52.5 mm / B32778-G9x B32778 MKP DC link high density series up to 480 µF Page 25 of 43Please read Cautions and warnings and Important notes at the end of this document.

Impedance Z versus frequency f (typical values) ESR versus frequency f (typical values) Lead spacing 52.5 mm / B32778-G0x Lead spacing 52.5 mm / B32778-G0x Impedance Z versus frequency f (typical values) ESR versus frequency f (typical values) Lead spacing 52.5 mm / B32778-G1x Lead spacing 52.5 mm / B32778-G1x B32778 MKP DC link high density series up to 480 µF Page 26 of 43Please read Cautions and warnings and Important notes at the end of this document.

Impedance Z versus frequency f (typical values) ESR versus frequency f (typical values) Lead spacing 52.5 mm / B32778-Tx Lead spacing 52.5 mm / B32778-Tx Impedance Z versus frequency f (typical values) ESR versus frequency f (typical values) Lead spacing 52.5 mm / B32778-Jx Lead spacing 52.5 mm / B32778-Jx B32778 MKP DC link high density series up to 480 µF Page 27 of 43Please read Cautions and warnings and Important notes at the end of this document.

Permissible current IRMS versus frequency f at 70 °C Lead spacing 27.5 mm B32774-Dx B32774 MKP DC link high density series up to 480 µF Page 28 of 43Please read Cautions and warnings and Important notes at the end of this document.

Permissible current IRMS versus frequency f at 70 °C Lead spacing 37.5 mm B32776-Ex B32776-Gx B32776 MKP DC link high density series up to 480 µF Page 29 of 43Please read Cautions and warnings and Important notes at the end of this document.

Permissible current IRMS versus frequency f at 70 °C Lead spacing 37.5 mm B32776-Tx B32776 MKP DC link high density series up to 480 µF Page 30 of 43Please read Cautions and warnings and Important notes at the end of this document.

Permissible current IRMS versus frequency f at 70 ° C Lead spacing 52.5 mm B32778-Gx, 4 pins B32778-Tx, 4 pins B32778 MKP DC link high density series up to 480 µF Page 31 of 43Please read Cautions and warnings and Important notes at the end of this document.

Permissible current IRMS versus frequency f at 70 ° C Lead spacing 52.5 mm B32778-Jx, 12 pins B32778 MKP DC link high density series up to 480 µF Page 32 of 43Please read Cautions and warnings and Important notes at the end of this document.

Curves Characteristics (Irms derating vs temperature) Maximum IRMS current as function of the ambient temperature: IRMS (Tamb) = Factor x IRMS (70 ºC) B32774 ... B32778 MKP DC link high density series up to 480 µF Page 33 of 43Please read Cautions and warnings and Important notes at the end of this document.

Heat transference for self heating calculation Figure 1 BOX DIMENSIONS EQUIVALENT HEAT COEFFICIENT w (mm) h (mm) l (mm) G (mW/°C) 11.0 19.0 31.5 25 11.0 21.0 31.5 28 12.5 21.5 31.5 30 13.5 23.0 31.5 32 14.0 24.5 31.5 35 15.0 24.5 31.5 36 16.0 32.0 31.5 45 18.0 27.5 31.5 44 18.0 33.0 31.5 48 19.0 30.0 31.5 48 20.0 11.0 31.5 65 21.0 31.0 31.5 51 22.0 36.5 31.5 58 12.0 22.0 41.5 70 14.0 25.0 41.5 43 16.0 28.5 41.5 50 18.0 32.5 41.5 59 20.0 39.5 41.5 72 24.0 19.0 41.5 50 24.0 15.0 41.5 44 28.0 37.0 42.0 83 28.0 42.5 41.5 90 30.0 45.0 42.0 100 33.0 48.0 42.0 100 43.0 22.0 41.5 80 30.0 45.0 57.5 125 35.0 50.0 57.5 145 43.0 22.0 57.5 103 45.0 57.0 57.5 185 60.0 45.0 57.5 192 130.0 22.0 57.5 200 130.0 58.0 57.5 300 The equivalent heat coefficient "G (mW/ºC)" is given for measuring the temperature on the lateral surface of the plastic box as figure 1 shows. By using a thermocouple and avoiding effect of radiation and convection the temperature measured during operation conditions should be a result of the dissipated power divided by the equivalent heat coefficient. B32774 ... B32778 MKP DC link high density series up to 480 µF Page 34 of 43Please read Cautions and warnings and Important notes at the end of this document.

Self Heating by power dissipation & equivalent heat coefficient The IRMS and consequently the power dissipation must be limited during operation in order to not exceed the maximum limit of ΔT allowed for this series. ΔTmax given for this series is equal or lower than 20 °C at rated temperature (70 °C), for higher ambient temperatures ΔTmax (T) will have the same derating factor than IRMS vs temperature and then an equivalent derating as per: ΔTmax (T) = (Factor)2 x ΔT (70 °C). For any particular IRMS the ΔT may be calculated by: ΔT (°C) = Pdis (mW) / G(mW/°C) Where ΔT (°C) is the difference between the temperature measured on the box (see figure 1) and the ambient temperature when capacitor is working during normal operation; ΔT (°C) = Top(°C) Tamb (°C). It represents the increasing of temperature provoked by the IRMS during operation. G (mW/°C) is the equivalent heat coefficient described above and Pdis (mW) is the dissipated power defined by: Pdis (mW) = ESRtyp (mΩ ) x Irms 2 (ARMS). Example for thermal calculation: We will take as reference B32778G0306K (30 µF/1100 V) type for thermal calculation. Considering the following load and capacitor characteristics: IRMS : 12 ARMS at 20 kHz T amb: 85 °C 30 x 45 x 57.5 box G (mW/°C): 125 Then we have to find the ESRtyp at 20 kHz what is approx . 8.2 mΩ . So according to: Pdis (mW) = ESRtyp(mΩ ) x Irms 2(ARMS) we have the following: Pdis (mW) = 8.2 mΩ x 12 ARMS2 = 1181 mW and as per: ΔT (°C) = Pdis (mW) / G (mW/°C) we have the following: What is below of the ΔTmax (85 °C) = (Factor)2 x ΔT (70 °C) = (0.7) 2 x 20 °C = 9.8 °C On the other hand we may confirm that max IRMS at 20 kHz at 70 °C = 17.5 ARMS And then max IRMS for 85 °C of ambient temperature is defined as follows: IRMS (85 °C) = Factor x IRMS (70 °C) = 0.7 x 17.5 ARMS = 12.25 ARMS What confirms once again that IRMS (12 ARMS at 20 kHz) is below the max specified for such frequency and ambient temperature. B32774 ... B32778 MKP DC link high density series up to 480 µF Page 35 of 43Please read Cautions and warnings and Important notes at the end of this document.

Life time expectancy - typical curve (450 V DC / B3277x-X4 Life time expectancy - typical curve (575 V DC / 800 V DC / 900 V DC / 1100 V DC /

1300 V DC / B3277X-5/8/9/0/1)

Note: Confidence level of 95% B32774 ... B32778 MKP DC link high density series up to 480 µF Page 36 of 43Please read Cautions and warnings and Important notes at the end of this document.

Test Reference Conditions of test Performance requirements Electrical Parameters (Routine test) IEC 61071-11 Voltage between terminals,

1.5 VR, during 10 s

Insulation resistance, RINS at VR if VR < 500 V or 500 V if VR ≥ 500 V Capacitance, C at 1 kHz (room temperature) Dissipation factor, tan δ at 1/10 kHz (room temperature) Within specified limits Robustness of terminations (Type test) IEC 60068-2-21 Tensile strength (test Ua1) Capacitance and tan δ within specified limitsWire diameter Tensile force 0.5 < d1 ≤ 0.8 mm 0.8 < d1 ≤ 1.25 mm 10 N 20 N Resistance to soldering heat (Type test) IEC 60068-2-20, test Tb, method 1A Solder bath temperature at 260 ± 5 °C, immersion for 10 seconds ΔC/C0 ≤ 2% IΔ tan δ l ≤ 0.002 Rapid change of temperature (Type test) IEC 60384-16 TA = lower category temperature TB = upper category temperature Five cycles, duration t = 30 min. IΔC/C0 I ≤ 2% IΔ tan δ I ≤ 0.002 RINS ≥ 50% of initial limit Vibration (Type test) IEC 60384-16 Test FC: vibration sinusoidal Displacement: 0.75 mm Accleration: 98 m/s2 Frequency: 10 Hz ... 500 Hz Test duration: 3 orthogonal axes, 2 hours each axe No visible damage Bump (Type test) IEC 60384-16 Test Eb: Total 4000 bumps with 390 m/s2 mounted on PCB 6 ms duration No visible damage IΔC/C0 I ≤ 2% IΔ tan δ I ≤ 0.002 RINS ≥ 50% of initial limit Climatic sequence (Type test) IEC 60384-16 Dry heat Tb / 16 h. Damp heat cyclic, 1st cycle Cold Ta / 2h Damp heat cyclic, 5 cycles No visible damage IΔC/C0 I ≤ 3% IΔ tan δ I ≤ 0.001 RINS ≥ 50% of initial limit Damp Heat Steady State (Type test) IEC 60384-16 Test Ca 40 °C / 93% RH / 56 days No visible damage IΔC/C0 I ≤ 5% IΔ tan δ I ≤ 0.005 RINS ≥ 50% of initial limit B32774 ... B32778 MKP DC link high density series up to 480 µF Page 37 of 43Please read Cautions and warnings and Important notes at the end of this document.

Test Reference Conditions of test Performance requirements Endurance (Type test) IEC 60384-16 70 °C / 1.25 VR / 1000 hours or 85 °C / 1.25 Vop / 1000 hours or 100 °C / 1.25 Vop / 1000 hours No visible damage IΔC/C0 I ≤ 5% at 1 kHz IΔ tan δ I ≤ 0.005 RINS ≥ 50% of initial limit Cautions and warnings Do not exceed the upper category temperature (UCT). Do not apply any mechanical stress to the capacitor terminals. Avoid any compressive, tensile or flexural stress. Do not move the capacitor after it has been soldered to the PC board. Do not pick up the PC board by the soldered capacitor. Do not place the capacitor on a PC board whose PTH hole spacing differs from the specified lead spacing. Do not exceed the specified time or temperature limits during soldering. Avoid external energy inputs, such as fire or electricity. Avoid overload of the capacitors. The table below summarizes the safety instructions that must always be observed. A detailed de- scription can be found in the relevant sections of the chapters "General technical information" and "Mounting guidelines". Topic Safety information Reference chapter "General technical information" Storage conditions Make sure that capacitors are stored within the specified range of time, temperature and humidity conditions. 4.5 "Storage conditions" Flammability Avoid external energy, such as fire or electricity (passive flammability), avoid overload of the capacitors (active flammability) and consider the flammability of materials. 5.3 "Flammability" B32774 ... B32778 MKP DC link high density series up to 480 µF Page 38 of 43Please read Cautions and warnings and Important notes at the end of this document.

Topic Safety information Reference chapter "Mounting guidelines" Resistance to vibration Do not exceed the tested ability to withstand vibration. The capacitors are tested to IEC 60068-2-6. EPCOS offers film capacitors specially designed for operation under more severe vibration regimes such as those found in automotive applications. Consult our catalog "Film Capacitors for Automotive Electronics". 5.2 "Resistance to vibration" Soldering Do not exceed the specified time or temperature limits during soldering. 1 "Soldering" Cleaning Use only suitable solvents for cleaning capacitors. 2 "Cleaning" Embedding of capacitors in finished assemblies When embedding finished circuit assemblies in plastic resins, chemical and thermal influences must be taken into account. Caution: Consult us first, if you also wish to embed other uncoated component types! 3 "Embedding of capacitors in finished assemblies" Display of ordering codes for EPCOS products The ordering code for one and the same product can be represented differently in data sheets, data books, other publications and the website of EPCOS, or in order-related documents such as shipping notes, order confirmations and product labels. The varying representations of the ordering codes are due to different processes employed and do not affect the specifications of the respective products. Detailed information can be found on the Internet under www.epcos.com/orderingcodes. B32774 ... B32778 MKP DC link high density series up to 480 µF Page 39 of 43Please read Cautions and warnings and Important notes at the end of this document.

α Heat transfer coefficient Wärmeübergangszahl α C Temperature coefficient of capacitance Temperaturkoeffizient der Kapazität A Capacitor surface area Kondensatoroberfläche βC Humidity coefficient of capacitance Feuchtekoeffizient der Kapazität C Capacitance Kapazität CR Rated capacitance Nennkapazität ΔC Absolute capacitance change Absolute Kapazitätsänderung ΔC/C Relative capacitance change (relative deviation of actual value) Relative Kapazitätsänderung (relative Abweichung vom Ist-Wert) ΔC/CR Capacitance tolerance (relative deviation from rated capacitance) Kapazitätstoleranz (relative Abweichung vom Nennwert) dt Time differential Differentielle Zeit Δt Time interval Zeitintervall ΔT Absolute temperature change (self-heating) Absolute Temperaturänderung (Selbsterwärmung) Δtan δ Absolute change of dissipation factor Absolute Änderung des Verlustfaktors ΔV Absolute voltage change Absolute Spannungsänderung dV/dt Time differential of voltage function (rate of voltage rise) Differentielle Spannungsänderung (Spannungsflankensteilheit) ΔV/Δt Voltage change per time interval Spannungsänderung pro Zeitintervall E Activation energy for diffusion Aktivierungsenergie zur Diffusion ESL Self-inductance Eigeninduktivität ESR Equivalent series resistance Ersatz-Serienwiderstand f Frequency Frequenz f1 Frequency limit for reducing permissible AC voltage due to thermal limits Grenzfrequenz für thermisch bedingte Reduzierung der zulässigen Wechselspannung f2 Frequency limit for reducing permissible AC voltage due to current limit Grenzfrequenz für strombedingte Reduzierung der zulässigen Wechselspannung fr Resonant frequency Resonanzfrequenz FD Thermal acceleration factor for diffusion Therm. Beschleunigungsfaktor zur Diffusion FT Derating factor Deratingfaktor i Current (peak) Stromspitze IC Category current (max. continuous current) Kategoriestrom (max. Dauerstrom) B32774 ... B32778 MKP DC link high density series up to 480 µF Page 40 of 43Please read Cautions and warnings and Important notes at the end of this document.

IRMS (Sinusoidal) alternating current, root-mean-square value (Sinusförmiger) Wechselstrom iz Capacitance drift Inkonstanz der Kapazität k0 Pulse characteristic Impulskennwert LS Series inductance Serieninduktivität λ Failure rate Ausfallrate λ0 Constant failure rate during useful service life Konstante Ausfallrate in der Nutzungsphase λtest Failure rate, determined by tests Experimentell ermittelte Ausfallrate Pdiss Dissipated power Abgegebene Verlustleistung Pgen Generated power Erzeugte Verlustleistung Q Heat energy Wärmeenergie ρ Density of water vapor in air Dichte von Wasserdampf in Luft R Universal molar constant for gases Allg. Molarkonstante für Gas R Ohmic resistance of discharge circuit Ohmscher Widerstand des Entladekreises Ri Internal resistance Innenwiderstand Rins Insulation resistance Isolationswiderstand RP Parallel resistance Parallelwiderstand RS Series resistance Serienwiderstand S severity (humidity test) Schärfegrad (Feuchtetest) t Time Zeit T Temperature Temperatur τ Time constant Zeitkonstante tan δ Dissipation factor Verlustfaktor tan δD Dielectric component of dissipation factor Dielektrischer Anteil des Verlustfaktors tan δP Parallel component of dissipation factor Parallelanteil des Verlfustfaktors tan δS Series component of dissipation factor Serienanteil des Verlustfaktors TA Temperature of the air surrounding the component Temperatur der Luft, die das Bauteil umgibt Tmax Upper category temperature Obere Kategorietemperatur Tmin Lower category temperature Untere Kategorietemperatur tOL Operating life at operating temperature and voltage Betriebszeit bei Betriebstemperatur und -spannung Top Operating temperature Beriebstemperatur TR Rated temperature Nenntemperatur Tref Reference temperature Referenztemperatur tSL Reference service life Referenz-Lebensdauer B32774 ... B32778 MKP DC link high density series up to 480 µF Page 41 of 43Please read Cautions and warnings and Important notes at the end of this document.

VAC AC voltage Wechselspannung VC Category voltage Kategoriespannung VC,RMS Category AC voltage (Sinusförmige) Kategorie-Wechselspannung VCD Corona-discharge onset voltage Teilentlade-Einsatzspannung Vch Charging voltage Ladespannung VDC DC voltage Gleichspannung VFB Fly-back capacitor voltage Spannung (Flyback) Vi Input voltage Eingangsspannung Vo Output voltage Ausgangssspannung Vop Operating voltage Betriebsspannung Vp Peak pulse voltage Impuls-Spitzenspannung Vpp Peak-to-peak voltage Impedance Spannungshub VR Rated voltage Nennspannung R Amplitude of rated AC voltage Amplitude der Nenn-Wechselspannung VRMS (Sinusoidal) alternating voltage, root-mean-square value (Sinusförmige) Wechselspannung VSC S-correction voltage Spannung bei Anwendung "S-correction" Vsn Snubber capacitor voltage Spannung bei Anwendung "Beschaltung" Z Impedance Scheinwiderstand Lead spacing Rastermaß B32774 ... B32778 MKP DC link high density series up to 480 µF Page 42 of 43Please read Cautions and warnings and Important notes at the end of this document.

The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application . These statements are based on our knowledge of typical re- quirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application . As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incum- bent on the customer to check and decide whether an EPCOS product with the properties de- scribed in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified . In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Ma- terial Data Sheets on the Internet (www.epcos.com/material). Should you have any more de- tailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time . The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products . Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the fore- going for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to the current ver- sion of the "General Terms of Delivery for Products and Services in the Electrical In- dustry" published by the German Electrical and Electronics Industry Association (ZVEI). 7. The trade names EPCOS, Alu-X, CeraDiode, CeraLink, CeraPlas, CSMP, CSSP, CTVS, DeltaCap, DigiSiMic, DSSP, FilterCap, FormFit, MiniBlue, MiniCell, MKD, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PQSine, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, SIP5D, SIP5K, TFAP, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other coun- tries. Further information will be found on the Internet at www.epcos.com/trademarks. Important notes Page 43 of 43