B32778G406K EPCOS | Alldatasheet
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Metallized Polypropylene Film Capacitors (MKP) Series/Type: B32774 ... B32778 Date: December 2012 © EPCOS AG 2012. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.
For compact design of: Frequency converters Industrial and high-end power supplies Solar inverters Climatic Max. operating temperature: 105 °C (case) Climatic category (IEC 60068-1): 40/85/56 Construction Dielectric: polypropylene (MKP) Plastic case (UL 94 V-0) Epoxy resin sealing (UL 94 V-0)
Features
Capacitance values up to 110 µF High CV product, compact Excellent self-healing properties Overvoltage capability Low losses with high current capability High reliability Long useful life RoHS-compatible Terminals Parallel wire leads, lead-free tinned 2-pin and 4-pin versions Standard lead lengths: 6 1 mm Special lead lengths are available on request Marking Manufacturer's logo, lot number, date code, rated capacitance (coded), capacitance tolerance (code letter), rated DC voltage Delivery mode Bulk (untaped, lead length 6 1 mm) Dimensional drawings 2-pin version 4-pin version Dimensions in mm Version Lead spacing ±0.4 Lead diameter Type 2-pin 27.5 0.8 B32774D 2-pin 37.5 1.0 B32776E/T 4-pin 37.5 1.2 B32776G 4-pin 52.5 1.2 B32778G Metallized polypropylene film capacitors (MKP) B32774 ... B32778 MKP DC link high density series Page 2 of 21Please read Cautions and warnings and Important notes at the end of this document.
Overview of available types Lead spacing 27.5 mm 37.5 mm Type B32774 B32776 Page 5 6 VR (V DC) 450 800 1100 1300 450 575 800 900 1100 1300 CR (µF) 1.5 2.0 2.7 3.0 3.5 3.9 5.0 6.8 7.0 7.5 8.0 8.5 B32774 ... B32778 MKP DC link high density series Page 3 of 21Please read Cautions and warnings and Important notes at the end of this document.
Lead spacing 52.5 mm Type B32778 Page 9 VR (V DC) 450 575 800 900 1100 1300 CR (µF) 100 110 B32774 ... B32778 MKP DC link high density series Page 4 of 21Please read Cautions and warnings and Important notes at the end of this document.
Ordering codes and packing units (lead spacing 27.5 mm) CR µF Max. dimensions w × h × l mm mm Ordering code (composition see below) IRMS,max 70 °C 10 kHz A IRMS,max 70 °C 20 kHz A ESRtyp 70 °C 10 kHz mΩ Untaped pcs./MOQ MOQ = Minimum Order Quantity, consisting of 4 packing units. Further E series and intermediate capacitance values on request. Composition of ordering code + = Capacitance tolerance code: K = ±10% J = ±5% VR,70 °C = 450 V DC, V op,85 °C = 450 V DC VR,70 °C = 800 V DC, V op,85 °C = 700 V DC VR,70 °C = 1100 V DC, Vop,85 °C = 920 V DC VR,70 °C = 1300 V DC, Vop,85 °C = 1100 V DC B32774 MKP DC link high density series Page 5 of 21Please read Cautions and warnings and Important notes at the end of this document.
Ordering codes and packing units (lead spacing 37.5 mm) CR µF Max. dimensions w × h × l mm mm Ordering code (composition see below) IRMS,max 70 °C 10 kHz A IRMS,max 70 °C 20 kHz A ESRtyp 70 °C 10 kHz mΩ Untaped pcs./MOQ MOQ = Minimum Order Quantity, consisting of 4 packing units. Further E series and intermediate capacitance values on request. Composition of ordering code + = Capacitance tolerance code: K = ±10% J = ±5% VR,70 °C = 450 V DC, V op,85 °C = 450 V DC VR,70 °C = 575 V DC, V op,85 °C = 500 V DC B32776 MKP DC link high density series Page 6 of 21Please read Cautions and warnings and Important notes at the end of this document.
Ordering codes and packing units (lead spacing 37.5 mm) CR µF Max. dimensions w × h × l mm mm Ordering code (composition see below) IRMS,max 70 °C 10 kHz A IRMS,max 70 °C 20 kHz A ESRtyp 70 °C 10 kHz mΩ Untaped pcs./MOQ MOQ = Minimum Order Quantity, consisting of 4 packing units. Further E series and intermediate capacitance values on request. Composition of ordering code + = Capacitance tolerance code: K = ±10% J = ±5% VR,70 °C = 800 V DC, V op,85 °C = 700 V DC VR,70 °C = 900 V DC, V op,85 °C = 800 V DC B32776 MKP DC link high density series Page 7 of 21Please read Cautions and warnings and Important notes at the end of this document.
Ordering codes and packing units (lead spacing 37.5 mm) CR µF Max. dimensions w × h × l mm mm Ordering code (composition see below) IRMS,max 70 °C 10 kHz A IRMS,max 70 °C 20 kHz A ESRtyp 70 °C 10 kHz mΩ Untaped pcs./MOQ MOQ = Minimum Order Quantity, consisting of 4 packing units. Further E series and intermediate capacitance values on request. Composition of ordering code + = Capacitance tolerance code: K = ±10% J = ±5% VR,70 °C = 1100 V DC, Vop,85 °C = 920 V DC VR,70 °C = 1300 V DC, Vop,85 °C = 1100 V DC B32776 MKP DC link high density series Page 8 of 21Please read Cautions and warnings and Important notes at the end of this document.
Ordering codes and packing units (lead spacing 52.5 mm) CR µF Max. dimensions w × h × l mm mm Ordering code (composition see below) IRMS,max 70 °C 10 kHz A IRMS,max 70 °C 20 kHz A ESRtyp 70 °C 10 kHz mΩ Untaped pcs./MOQ MOQ = Minimum Order Quantity, consisting of 4 packing units. Further E series and intermediate capacitance values on request. Composition of ordering code + = Capacitance tolerance code: K = ±10% J = ±5% VR,70 °C = 450 V DC, V op,85 °C = 450 V DC VR,70 °C = 575 V DC, V op,85 °C = 500 V DC VR,70 °C = 800 V DC, V op,85 °C = 700 V DC VR,70 °C = 900 V DC, V op,85 °C = 800 V DC VR,70 °C = 1100 V DC, Vop,85 °C = 920 V DC VR,70 °C = 1300 V DC, Vop,85 °C = 1100 V DC B32778 MKP DC link high density series Page 9 of 21Please read Cautions and warnings and Important notes at the end of this document.
Reference standard: IEC 61071. All data given at T = 20 °C, unless otherwise specified. Operating temperature range (case) Max. operating temperature, Top,max Upper category temperature Tmax Lower category temperature Tmin +105 °C +85 °C –40 °C ESR (at 10 kHz) LS 27.5 LS 37.5 LS 52.5 < 3.0 ESRtyp < 2.5 ESRtyp < 2.0 ESRtyp Insulation Resistance Rins given as time constant τ = CR Rins, rel. humidity ≤ 65% (minimum as-delivered values) 30 000 s DC test voltage between terminals (10 s) 1.5 VR DC test voltage terminal to case (10 s) 2110 V AC, 50 Hz Maximum peak current (A) Damp heat test Limit values after damp heat test 56 days/40 °C/93% relative humidity Capacitance change | ΔC/C | ≤ 5% Dissipation factor change Δ tan δ ≤ 1.5 · 10-3 (at 1 kHz) Insulation resistance Rins ≥ 50% of minimum as-delivered values Reliability: Failure rate λ 50 fit (≤ 1 10-9/h) at 0.5 VR, 40 °C Service life tSL 100 000 h at VR and 70 °C For conversion to other operating conditions, refer to chapter "Quality, 2 Reliability". VR (V DC) 450 575 800 900 1100 1300 450 575 800 900 1100 1300 450 500 700 800 920 1100 Continuous operation voltage Vop (V DC) at 70 °C Continuous operation voltage Vop (V DC) at 85 °C For temperatures between 70 °C and 85 °C 1%/°C of derating respect Vop at 70 °C (no derating at 450 V DC series) B32774 ... B32778 MKP DC link high density series Page 10 of 21Please read Cautions and warnings and Important notes at the end of this document.
"dV/dt" represents the maximum permissible voltage change per unit of time for non-sinusoidal voltages, expressed in V/µs. Note: The values of dV/dt provided below must not be exceeded in order to avoid damaging the capacitor. dV/dt values Lead spacing 27.5 mm 37.5 mm Type B32774 B32776 VR (V DC) 450 800 1100 1300 450 575 800 900 1100 1300 dV/dt in V/µs 30 40 75 100 21 22 22 32 54 73 Lead spacing 52.5 mm Type B32778 VR (V DC) 450 575 800 900 1100 1300 dV/dt in V/µs 14 15 15 25 35 50 B32774 ... B32778 MKP DC link high density series Page 11 of 21Please read Cautions and warnings and Important notes at the end of this document.
Restrictions: VR: Maximum operating peak voltage of either polarity but of a non-reversing waveform, for which the capacitor has been designed for continuous operation. AC ≤ 0.2 VR VP,max: Maximum permissible recurrent voltage that may appear for 2% of the period. B32774 ... B32778 MKP DC link high density series Page 12 of 21Please read Cautions and warnings and Important notes at the end of this document.
1 Soldering
1.1 Solderability of leads
The solderability of terminal leads is tested to IEC 60068-2-20, test Ta, method 1. Before a solderability test is carried out, terminals are subjected to accelerated ageing (to IEC 60068-2-2, test Ba: 4 h exposure to dry heat at 155 °C). Since the ageing temperature is far higher than the upper category temperature of the capacitors, the terminal wires should be cut off from the capacitor before the ageing procedure to prevent the solderability being impaired by the products of any capacitor decomposition that might occur. Solder bath temperature 235 ±5 °C Soldering time 2.0 ±0.5 s Immersion depth 2.0 +0/ 0.5 mm from capacitor body or seating plane Evaluation criteria: Visual inspection Wetting of wire surface by new solder ≥90%, free-flowing solder
1.2 Resistance to soldering heat
Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1A. Conditions: Series Solder bath temperature Soldering time MKT boxed (except 2.5 × 6.5 × 7.2 mm) coated uncoated (lead spacing > 10 mm) 260 ±5 °C 10 ±1 s MFP MKP (lead spacing > 7.5 mm) MKT boxed (case 2.5 × 6.5 × 7.2 mm) 5 ±1 s MKP MKT (lead spacing ≤ 7.5 mm) uncoated (lead spacing ≤ 10 mm) insulated (B32559) < 4 s recommended soldering profile for MKT uncoated (lead spacing ≤ 10 mm) and insulated (B32559) B32774 ... B32778 MKP DC link high density series Page 13 of 21Please read Cautions and warnings and Important notes at the end of this document.
Immersion depth 2.0 +0/ 0.5 mm from capacitor body or seating plane Shield Heat-absorbing board, (1.5 ±0.5) mm thick, between capacitor body and liquid solder Evaluation criteria: Visual inspection No visible damage ΔC/C0 2% for MKT/MKP/MFP 5% for EMI suppression capacitors tan δ As specified in sectional specification B32774 ... B32778 MKP DC link high density series Page 14 of 21Please read Cautions and warnings and Important notes at the end of this document.
1.3 General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate- gory temperature T max. Long exposure to temperatures above this type-related temperature limit can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical characteristics. For short exposures (as in practical soldering processes) the heat load (and thus the possible effects on a capacitor) will also depend on other factors like: Pre-heating temperature and time Forced cooling immediately after soldering Terminal characteristics: diameter, length, thermal resistance, special configurations (e.g. crimping) Height of capacitor above solder bath Shadowing by neighboring components Additional heating due to heat dissipation by neighboring components Use of solder-resist coatings The overheating associated with some of these factors can usually be reduced by suitable coun- termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced cooling process may possibly have to be included. EPCOS recommends the following conditions: Pre-heating with a maximum temperature of 110 °C Temperature inside the capacitor should not exceed the following limits: MKP/MFP 110 °C MKT 160 °C When SMD components are used together with leaded ones, the leaded film capacitors should not pass into the SMD adhesive curing oven. The leaded components should be assembled af- ter the SMD curing step. Leaded film capacitors are not suitable for reflow soldering. Uncoated capacitors For uncoated MKT capacitors with lead spacings ≤10 mm (B32560/B32561) the following mea- sures are recommended: pre-heating to not more than 110 °C in the preheater phase rapid cooling after soldering B32774 ... B32778 MKP DC link high density series Page 15 of 21Please read Cautions and warnings and Important notes at the end of this document.
Do not exceed the upper category temperature (UCT). Do not apply any mechanical stress to the capacitor terminals. Avoid any compressive, tensile or flexural stress. Do not move the capacitor after it has been soldered to the PC board. Do not pick up the PC board by the soldered capacitor. Do not place the capacitor on a PC board whose PTH hole spacing differs from the specified lead spacing. Do not exceed the specified time or temperature limits during soldering. Avoid external energy inputs, such as fire or electricity. Avoid overload of the capacitors. The table below summarizes the safety instructions that must always be observed. A detailed de- scription can be found in the relevant sections of the chapters "General technical information" and "Mounting guidelines". Topic Safety information Reference chapter "General technical information" Storage conditions Make sure that capacitors are stored within the specified range of time, temperature and humidity conditions. 4.5 "Storage conditions" Flammability Avoid external energy, such as fire or electricity (passive flammability), avoid overload of the capacitors (active flammability) and consider the flammability of materials. 5.3 "Flammability" Resistance to vibration Do not exceed the tested ability to withstand vibration. The capacitors are tested to IEC 60068-2-6. EPCOS offers film capacitors specially designed for operation under more severe vibration regimes such as those found in automotive applications. Consult our catalog "Film Capacitors for Automotive Electronics". 5.2 "Resistance to vibration" B32774 ... B32778 MKP DC link high density series Page 16 of 21Please read Cautions and warnings and Important notes at the end of this document.
Topic Safety information Reference chapter "Mounting guidelines" Soldering Do not exceed the specified time or temperature limits during soldering. 1 "Soldering" Cleaning Use only suitable solvents for cleaning capacitors. 2 "Cleaning" Embedding of capacitors in finished assemblies When embedding finished circuit assemblies in plastic resins, chemical and thermal influences must be taken into account. Caution: Consult us first, if you also wish to embed other uncoated component types! 3 "Embedding of capacitors in finished assemblies" B32774 ... B32778 MKP DC link high density series Page 17 of 21Please read Cautions and warnings and Important notes at the end of this document.
α Heat transfer coefficient Wärmeübergangszahl α C Temperature coefficient of capacitance Temperaturkoeffizient der Kapazität A Capacitor surface area Kondensatoroberfläche βC Humidity coefficient of capacitance Feuchtekoeffizient der Kapazität C Capacitance Kapazität CR Rated capacitance Nennkapazität ΔC Absolute capacitance change Absolute Kapazitätsänderung ΔC/C Relative capacitance change (relative deviation of actual value) Relative Kapazitätsänderung (relative Abweichung vom Ist-Wert) ΔC/CR Capacitance tolerance (relative deviation from rated capacitance) Kapazitätstoleranz (relative Abweichung vom Nennwert) dt Time differential Differentielle Zeit Δt Time interval Zeitintervall ΔT Absolute temperature change (self-heating) Absolute Temperaturänderung (Selbsterwärmung) Δtan δ Absolute change of dissipation factor Absolute Änderung des Verlustfaktors ΔV Absolute voltage change Absolute Spannungsänderung dV/dt Time differential of voltage function (rate of voltage rise) Differentielle Spannungsänderung (Spannungsflankensteilheit) ΔV/Δt Voltage change per time interval Spannungsänderung pro Zeitintervall E Activation energy for diffusion Aktivierungsenergie zur Diffusion ESL Self-inductance Eigeninduktivität ESR Equivalent series resistance Ersatz-Serienwiderstand f Frequency Frequenz f1 Frequency limit for reducing permissible AC voltage due to thermal limits Grenzfrequenz für thermisch bedingte Reduzierung der zulässigen Wechselspannung f2 Frequency limit for reducing permissible AC voltage due to current limit Grenzfrequenz für strombedingte Reduzierung der zulässigen Wechselspannung fr Resonant frequency Resonanzfrequenz FD Thermal acceleration factor for diffusion Therm. Beschleunigungsfaktor zur Diffusion FT Derating factor Deratingfaktor i Current (peak) Stromspitze IC Category current (max. continuous current) Kategoriestrom (max. Dauerstrom) B32774 ... B32778 MKP DC link high density series Page 18 of 21Please read Cautions and warnings and Important notes at the end of this document.
IRMS (Sinusoidal) alternating current, root-mean-square value (Sinusförmiger) Wechselstrom iz Capacitance drift Inkonstanz der Kapazität k0 Pulse characteristic Impulskennwert LS Series inductance Serieninduktivität λ Failure rate Ausfallrate λ0 Constant failure rate during useful service life Konstante Ausfallrate in der Nutzungsphase λtest Failure rate, determined by tests Experimentell ermittelte Ausfallrate Pdiss Dissipated power Abgegebene Verlustleistung Pgen Generated power Erzeugte Verlustleistung Q Heat energy Wärmeenergie ρ Density of water vapor in air Dichte von Wasserdampf in Luft R Universal molar constant for gases Allg. Molarkonstante für Gas R Ohmic resistance of discharge circuit Ohmscher Widerstand des Entladekreises Ri Internal resistance Innenwiderstand Rins Insulation resistance Isolationswiderstand RP Parallel resistance Parallelwiderstand RS Series resistance Serienwiderstand S severity (humidity test) Schärfegrad (Feuchtetest) t Time Zeit T Temperature Temperatur τ Time constant Zeitkonstante tan δ Dissipation factor Verlustfaktor tan δD Dielectric component of dissipation factor Dielektrischer Anteil des Verlustfaktors tan δP Parallel component of dissipation factor Parallelanteil des Verlfustfaktors tan δS Series component of dissipation factor Serienanteil des Verlustfaktors TA Ambient temperature Umgebungstemperatur Tmax Upper category temperature Obere Kategorietemperatur Tmin Lower category temperature Untere Kategorietemperatur tOL Operating life at operating temperature and voltage Betriebszeit bei Betriebstemperatur und -spannung Top Operating temperature Beriebstemperatur TR Rated temperature Nenntemperatur Tref Reference temperature Referenztemperatur tSL Reference service life Referenz-Lebensdauer VAC AC voltage Wechselspannung B32774 ... B32778 MKP DC link high density series Page 19 of 21Please read Cautions and warnings and Important notes at the end of this document.
VC Category voltage Kategoriespannung VC,RMS Category AC voltage (Sinusförmige) Kategorie-Wechselspannung VCD Corona-discharge onset voltage Teilentlade-Einsatzspannung Vch Charging voltage Ladespannung VDC DC voltage Gleichspannung VFB Fly-back capacitor voltage Spannung (Flyback) Vi Input voltage Eingangsspannung Vo Output voltage Ausgangssspannung Vop Operating voltage Betriebsspannung Vp Peak pulse voltage Impuls-Spitzenspannung Vpp Peak-to-peak voltage Impedance Spannungshub VR Rated voltage Nennspannung R Amplitude of rated AC voltage Amplitude der Nenn-Wechselspannung VRMS (Sinusoidal) alternating voltage, root-mean-square value (Sinusförmige) Wechselspannung VSC S-correction voltage Spannung bei Anwendung "S-correction" Vsn Snubber capacitor voltage Spannung bei Anwendung "Beschaltung" Z Impedance Scheinwiderstand Lead spacing Rastermaß B32774 ... B32778 MKP DC link high density series Page 20 of 21Please read Cautions and warnings and Important notes at the end of this document.
The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application . These statements are based on our knowledge of typical re- quirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application . As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incum- bent on the customer to check and decide whether an EPCOS product with the properties de- scribed in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified . In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Ma- terial Data Sheets on the Internet (www.epcos.com/material). Should you have any more de- tailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time . The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products . Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the fore- going for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to the current ver- sion of the "General Terms of Delivery for Products and Services in the Electrical In- dustry" published by the German Electrical and Electronics Industry Association (ZVEI). 7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CeraLink, CSMP, CSSP, CTVS, DeltaCap, DigiSiMic, DSSP, FilterCap, FormFit, MiniBlue, MiniCell, MKD, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.epcos.com/trademarks. Important notes Page 21 of 21