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- Manufacturer or author: TDK Electronics AG
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TDK Electronics AG 2021. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without TDK Electronics’ prior express consent is prohibited. Film capacitors Metallized polypropylene film capacitors (MKP) Series/Type: B32774 ... B32778 Date: December 2021
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32774 ... B32778 MKP DC link – high density series up to 480 μF Typical applications Frequency converters Industrial and high-end power supplies Solar inverters Climatic Max. operating temperature: 105 °C (case) Climatic category (IEC 60068-1:2013): 40/105/56 Construction Dielectric: polypropylene (MKP) Plastic case (UL 94 V-0) Epoxy resin sealing (UL 94 V-0)
Features
Capacitance values up to 480 μF High CV product, compact Good self-healing properties Over-voltage capability Low losses with high current capability High reliability Long useful life RoHS-compatible Terminals Parallel wire leads, lead-free tinned 2-pin, 4-pin and 12-pin versions Standard lead lengths: 6 –1 mm Marking Manufacturer's logo and lot number, date code, rated capacitance (coded), capacitance tolerance (code letter) and rated DC voltage Delivery mode Bulk (untaped)
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32774 ... B32778 MKP DC link – high density series up to 480 μF Dimensional drawings Dimensional drawings 2-pin versions Number of wires Lead spacing ±0.4 Lead diameter d 1 ±0.05 Type 2-pin 27.5 0.8 B32774D 2-pin 37.5 1.0 B32776E 2-pin 37.5 1.0 B32776T 4-pin 37.5 1.2 B32776G 4-pin 37.5 1.2 B32776T 4-pin 52.5 1.2 B32778T 4-pin 52.5 1.2 B32778G 12-pin 52.5 1.2 B32778J Dimensions in mm B32774D, B32776E B32774D B32776E Lead spacing ±0.4: Lead diameter d 27.5 0.8 37.5 1.0 Dimensions in mm B32776T (low profile) Lead spacing ±0.4: 37.5 Lead diameter d1:1 . 0 Dimensions in mm e e e
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32774 ... B32778 MKP DC link – high density series up to 480 μF Dimensional drawings 4-pin versions B32776G, B32778G B32776G B32778G Lead spacing ±0.4: Lead diameter d1: 37.5 1.2 52.5 1.2 Dimensions in mm B32776T, B32778T (low profile) B32776T B32778T Lead spacing ±0.4: Lead diameter d1: 37.5 1.2 52.5 1.2 Dimensions in mm Dimensional drawing 12-pin version B32778J Lead spacing ±0.4: 52.5 Lead diameter d1:1 . 2 Dimensions in mm e e e
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32774 ... B32778 MKP DC link – high density series up to 480 μF Overview of available types Lead spacing 27.5 mm 37.5 mm Type B32774 B32776 Page 78 VR (V DC) 450 800 1100 1300 450 575 800 900 1100 1300 CR (µF) 1.5 2.0 2.7 3.0 3.3 3.5 3.9 5.0 6.8 7.0 7.5 8.0 8.5 9.0
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32774 ... B32778 MKP DC link – high density series up to 480 μF Overview of available types Lead spacing 52.5 mm Type B32778 Page 11 VR (V DC) 450 575 800 900 1100 1300 CR (µF) 100 110 120 130 150 170 180 200 210 270 360 480
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32774 MKP DC link – high density series up to 480 μF Ordering codes and packing units (lead spacing 27.5 mm) CR1) µF 1) Capacitance value measured at 1 kHz Max. dimensions w x h x l mm Ordering code (composition see below) IRMS,max2) 70 °C 10 kHz A 2) Max ripple current I RMS at 70 °C, 10 kHz for ΔT ≤20 °C at ΔESRtyp ≤±5% ESRtyp 70 °C 10 kHz mΩ ESLtyp3) nH 3) Typical ESL value measured at resonance frequen cy (see specific graphs of Z versus frequency) tan δ 1 kHz 10-3 tan δ 10 kHz 10-3 Un- taped pcs./ MOQ VR,70 °C = 450 V DC, Vop,85 °C = 450 V DC VR,70 °C = 800 V DC, Vop,85 °C = 700 V DC VR,70 °C = 1100 V DC, Vop,85 °C = 920 V DC VR,70 °C = 1300 V DC, Vop,85 °C = 110 V DC MOQ = Minimum Order Quantity, consisting of 4 packing units. Further intermediate capacitance values are available on request. Composition of ordering code + = Capacitance tolerance code: J= ± 5 % K = ±10% Packing code: 000 = untaped (lead length 6 –1 mm)
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32776 MKP DC link – high density series up to 480 μF Ordering codes and packing units (lead spacing 37.5 mm) CR1) µF 1) Capacitance value measured at 1 kHz Max. dimensions w x h x l mm mm Ordering code (composition see below) IRMS,max2) 70 °C 10 kHz A 2) Max ripple current IRMS at 70 °C, 10 kHz for ΔT ≤20 °C at ΔESRtyp ≤±5% ESRtyp 70 °C 10 kHz mΩ ESLtyp3) nH 3) Typical ESL value measured at resonance frequency (see specific graphs of Z versus frequency) tan δ 10-3 tan δ 10-3 Un- taped pcs./ MOQ VR,70 °C = 450 V DC, Vop,85 °C = 450 V DC VR,70 °C = 575 V DC, Vop,85 °C = 500 V DC MOQ = Minimum Order Quantity, consisting of 4 packing units. Further intermediate capacitance values are available on request. Composition of ordering code + = Capacitance tolerance code: J= ± 5 % K = ±10% Packing code: 000 = untaped (lead length 6 –1 mm)
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32776 MKP DC link – high density series up to 480 μF Ordering codes and packing units (lead spacing 37.5 mm) CR1) µF 1) Capacitance value measured at 1 kHz Max. dimensions w x h x l mm mm Ordering code (composition see below) IRMS,max2) 70 °C 10 kHz A 2) Max ripple current IRMS at 70 °C, 10 kHz for ΔT ≤20 °C at ΔESRtyp ≤±5% ESRtyp 70 °C 10 kHz mΩ ESLtyp3) nH 3) Typical ESL value measured at resonance frequency (see specific graphs of Z versus frequency) tan δ 10-3 tan δ 10-3 Un- taped pcs./ MOQ VR,70 °C = 800 V DC, Vop,85 °C = 700 V DC VR,70 °C = 900 V DC, Vop,85 °C = 800 V DC MOQ = Minimum Order Quantity, consisting of 4 packing units. Further intermediate capacitance values are available on request. Composition of ordering code + = Capacitance tolerance code: J= ± 5 % K = ±10% Packing code: 000 = untaped (lead length 6 –1 mm)
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32776 MKP DC link – high density series up to 480 μF Ordering codes and packing units (lead spacing 37.5 mm) CR1) µF 1) Capacitance value measured at 1 kHz Max. dimensions w x h x l mm mm Ordering code (composition see below) IRMS,max2) 70 °C 10 kHz A 2) Max ripple current IRMS at 70 °C, 10 kHz for ΔT ≤20 °C at ΔESRtyp ≤±5% ESRtyp 70 °C 10 kHz mΩ ESLtyp3) nH 3) Typical ESL value measured at resonance frequency (see specific graphs of Z versus frequency) tan δ 10-3 tan δ 10-3 Un- taped pcs./ MOQ VR,70 °C = 1100 V DC, Vop,85 °C = 920 V DC VR,70 °C = 1300 V DC, Vop,85 °C = 1100 V DC MOQ = Minimum Order Quantity, consisting of 4 packing units. Further intermediate capacitance values are available on request. Composition of ordering code + = Capacitance tolerance code: J= ± 5 % K = ±10% Packing code: 000 = untaped (lead length 6 –1 mm)
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32778 MKP DC link – high density series up to 480 μF Ordering codes and packing units (lead spacing 52.5 mm, P1 = 20.3 mm) CR1) µF 1) Capacitance value measured at 1 kHz Max. dimensions w x h x l mm Ordering code (composition see below) IRMS,max2) 70 °C 10 kHz A 2) Max ripple current IRMS at 70 °C, 10 kHz for ΔT ≤20 °C at ΔESRtyp ≤±5% ESRtyp 70 °C 10 kHz mΩ ESLtyp3) nH 3) Typical ESL value measured at resonance frequen cy (see specific graphs of Z versus frequency) tan δ 10-3 tan δ 10-3 Un- taped pcs./ MOQ VR,70 °C = 450 V DC, Vop,85 °C = 450 V DC VR,70 °C = 575 V DC, Vop,85 °C = 500 V DC MOQ = Minimum Order Quantity, consisting of 4 packing units. Further intermediate capacitance values are available on request. Composition of ordering code + = Capacitance tolerance code: J= ± 5 % K = ±10% Packing code: 000 = untaped (lead length 6 –1 mm)
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32778 MKP DC link – high density series up to 480 μF Ordering codes and packing units (lead spacing 52.5 mm, P1 = 20.3 mm) * This part is affected by "Dual Use" regulations according to the law of the country the production site is located in. De- liveries of such products are subject to prior approval of the respective local authorities based on customer declarations. The delivery to certain countries may be restricted. CR1) µF 1) Capacitance value measured at 1 kHz Max. dimensions w x h x l mm Ordering code (composition see below) IRMS,max2) 70 °C 10 kHz A 2) Max ripple current IRMS at 70 °C, 10 kHz for ΔT ≤20 °C at ΔESRtyp ≤±5% ESRtyp 70 °C 10 kHz mΩ ESLtyp3) nH 3) Typical ESL value measured at resonance frequen cy (see specific graphs of Z versus frequency) tan δ 10-3 tan δ 10-3 Un- taped pcs./ MOQ VR,70 °C = 800 V DC, Vop,85 °C = 700 V DC 80 130.0 x 24.0 x 57.5 270 130.0 x 58.0 x 57.5 VR,70 °C = 900 V DC, Vop,85 °C = 800 V DC 70 130.0 x 24.0 x 57.5 MOQ = Minimum Order Quantity, consisting of 4 packing units. Further intermediate capacitance values are available on request. Composition of ordering code + = Capacitance tolerance code: J= ± 5 % K = ±10% Packing code: 000 = untaped (lead length 6 –1 mm)
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32778 MKP DC link – high density series up to 480 μF Ordering codes and packing units (lead spacing 52.5 mm, P1 = 20.3 mm) * This part is affected by "Dual Use" regulations according to the law of the country the production site is located in. De- liveries of such products are subject to prior approval of the respective local authorities based on customer declarations. The delivery to certain countries may be restricted. CR1) µF 1) Capacitance value measured at 1 kHz Max. dimensions w x h x l mm Ordering code (composition see below) IRMS,max2) 70 °C 10 kHz A 2) Max ripple current IRMS at 70 °C, 10 kHz for ΔT ≤20 °C at ΔESRtyp ≤±5% ESRtyp 70 °C 10 kHz m Ω ESLtyp3) nH 3) Typical ESL value measured at resonance frequen cy (see specific graphs of Z versus frequency) tan δ 10-3 tan δ 10-3 Un- taped pcs./ MOQ VR,70 °C = 1100 V DC, Vop,85 °C = 920 V DC 60 130.0 x 24.0 x 57.5 VR,70 °C = 1300 V DC, Vop,85 °C = 1100 V DC 38 130.0 x 24.0 x 57.5 120 130.0 x 58.0 x 57.5 MOQ = Minimum Order Quantity, consisting of 4 packing units. Further intermediate capacitance values are available on request. Composition of ordering code + = Capacitance tolerance code: J= ± 5 % K = ±10% Packing code: 000 = untaped (lead length 6 –1 mm)
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32774 ... B32778 MKP DC link – high density series up to 480 μF Technical data Reference standard: IEC 61071:2007 and AEC-Q200D. All data given at T = 20 °C, unless otherwise specified. Typical waveforms Restrictions: VR: Maximum operating peak voltage of either polarity but of a non-reversing waveform, for which the capacitor has been designed for continuous operation. Operating temperature range (case) Max. operating temperature, T op,max +105 °C Upper category temperature Tmax +105 °C Lower category temperature Tmin –40 °C Insulation resistance Rins given as time constant τ = CR ∙ Rins, rel. humidity ≤ 65% (minimum as-delivered values) τ > 10 000 s (after 1 min) For VR ≥500 V measured at 500 V For VR <500 V measured at VR DC test voltage between terminals (10 s) 1.5 ∙ VR Voltage test terminal to case (10 s) 2110 V AC, 50 Hz Pulse Handling Capability (V/µs) I P (A) / C (µF) Reliability: Failure rate λ 10 fit (≤ 10 ∙ 10–9/h) at 0.5 ∙ VR, 40 °C For conversion to other operating conditions and tem- peratures, refer to chapter "Quality, 2 Reliability". Service life t SL 100 000 h at VR and 70 °C VR (V DC) 450 575 800 900 1100 1300 Continuous operating voltage Vop (V DC) at 70 °C 450 575 800 900 1100 1300 Continuous operating voltage Vop (V DC) at 85 °C 450 500 700 800 920 1100 For temperatures between 85 °C and 105 °C 1.33%/°C of Vop derating compared to Vop at 85 °C
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32774 ... B32778 MKP DC link – high density series up to 480 μF ^vAC ≤0.2 · VR NOTE 1 An overvoltage equal to 1.5 ∙ VR for 30 ms is permitted 1000 times during the life of the capacitor. The amplitudes of the overvoltages that may be tolerated without significant reduction in the life time of the capacitor depend on their duration, the number of application and the capacitor temperature. In addition these values assume that the overvoltages may appear when the internal temperature of the capacitor is less than 0 °C but within the temperature category. NOTE 2 The average applied voltage must not be higher than the specified voltage. Pulse handling capability "dV/dt" represents the maximum permissible voltage change per unit of time for non-sinusoidal voltages, expressed in V/μs. Note: The values of dV/dt provided below must not be exceeded in order to avoid damaging the capacitor. dV/dt values Overvoltage Maximum duration within one day Observation 1.1 ∙ VR 1.15 ∙ VR 1.2 ∙ VR 1.3 ∙ VR 30% of on-load duration 30 min 5 min 1 min System regulation System regulation System regulation System regulation Lead spacing 27.5 mm 37.5 mm Type B32774 B32776 V R (V DC) 450 800 1100 1300 450 575 800 900 1100 1300 dV/dt in V/µs 30 40 75 100 21 22 22 35 54 73 Lead spacing 52.5 mm Type B32778 V R (V DC) 450 575 800 900 1100 1300 dV/dt in V/µs 14 14 15 22 35 50
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32774 MKP DC link – high density series up to 480 μF Characteristics curves Additional technical information can be found under "Design support" on www.tdk-electronics.tdk.com. Impedance Z versus frequency f (typical values) Lead spacing 27.5 mm
450 V DC
(typical values) Lead spacing 27.5 mm Impedance Z versus frequency f (typical values) Lead spacing 27.5 mm
800 V DC
(typical values) Lead spacing 27.5 mm
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32774 MKP DC link – high density series up to 480 μF Impedance Z versus frequency f (typical values) Lead spacing 27.5 mm
1100 V DC
(typical values) Lead spacing 27.5 mm Impedance Z versus frequency f (typical values) Lead spacing 27.5 mm
1300 V DC
(typical values) Lead spacing 27.5 mm Additional technical information can be found under "Design support" on www.tdk-electronics.tdk.com.
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32776 MKP DC link – high density series up to 480 μF Characteristics curves Additional technical information can be found under "Design support" on www.tdk-electronics.tdk.com. Impedance Z versus frequency f (typical values) Lead spacing 37.5 mm (typical values) Lead spacing 37.5 mm Impedance Z versus frequency f (typical values) Lead spacing 37.5 mm (typical values) Lead spacing 37.5 mm
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32776 MKP DC link – high density series up to 480 μF Impedance Z versus frequency f (typical values) Lead spacing 37.5 mm
575 V DC
(typical values) Lead spacing 37.5 mm Impedance Z versus frequency f (typical values) Lead spacing 37.5 mm (typical values) Lead spacing 37.5 mm Additional technical information can be found under "Design support" on www.tdk-electronics.tdk.com.
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32776 MKP DC link – high density series up to 480 μF Impedance Z versus frequency f (typical values) Lead spacing 37.5 mm B32776E8*/800 V DC ESR versus frequency f (typical values) Lead spacing 37.5 mm B32776E8*/800 V DC Impedance Z versus frequency f (typical values) Lead spacing 37.5 mm (typical values) Lead spacing 37.5 mm Additional technical information can be found under "Design support" on www.tdk-electronics.tdk.com.
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32776 MKP DC link – high density series up to 480 μF Impedance Z versus frequency f (typical values) Lead spacing 37.5 mm
900 V DC
(typical values) Lead spacing 37.5 mm Impedance Z versus frequency f (typical values) Lead spacing 37.5 mm (typical values) Lead spacing 37.5 mm Additional technical information can be found under "Design support" on www.tdk-electronics.tdk.com.
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32776 MKP DC link – high density series up to 480 μF Impedance Z versus frequency f (typical values) Lead spacing 37.5 mm (typical values) Lead spacing 37.5 mm Impedance Z versus frequency f (typical values) Lead spacing 37.5 mm (typical values) Lead spacing 37.5 mm Additional technical information can be found under "Design support" on www.tdk-electronics.tdk.com.
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32776 MKP DC link – high density series up to 480 μF Impedance Z versus frequency f (typical values) Lead spacing 37.5 mm (typical values) Lead spacing 37.5 mm Impedance Z versus frequency f (typical values) Lead spacing 37.5 mm (typical values) Lead spacing 37.5 mm Additional technical information can be found under "Design support" on www.tdk-electronics.tdk.com.
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32776 MKP DC link – high density series up to 480 μF Impedance Z versus frequency f (typical values) Lead spacing 37.5 mm (low profile, 2 pins) ESR versus frequency f (typical values) Lead spacing 37.5 mm (low profile, 2 pins) Impedance Z versus frequency f (typical values) Lead spacing 37.5 mm (low profile, 4 pins) ESR versus frequency f (typical values) Lead spacing 37.5 mm (low profile, 4 pins) Characteristics curves Additional technical information can be found under "Design support" on www.tdk-electronics.tdk.com.
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32778 MKP DC link – high density series up to 480 μF Characteristics curves Additional technical information can be found under "Design support" on www.tdk-electronics.tdk.com. Impedance Z versus frequency f (typical values) Lead spacing 52.5 mm (typical values) Lead spacing 52.5 mm Impedance Z versus frequency f (typical values) Lead spacing 52.5 mm (typical values) Lead spacing 52.5 mm
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32778 MKP DC link – high density series up to 480 μF Impedance Z versus frequency f (typical values) Lead spacing 52.5 mm (typical values) Lead spacing 52.5 mm Impedance Z versus frequency f (typical values) Lead spacing 52.5 mm (typical values) Lead spacing 52.5 mm Additional technical information can be found under "Design support" on www.tdk-electronics.tdk.com.
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32778 MKP DC link – high density series up to 480 μF Impedance Z versus frequency f (typical values) Lead spacing 52.5 mm B32778G0*/1100 V DC ESR versus frequency f (typical values) Lead spacing 52.5 mm B32778G0*/1100 V DC Impedance Z versus frequency f (typical values) Lead spacing 52.5 mm (typical values) Lead spacing 52.5 mm Additional technical information can be found under "Design support" on www.tdk-electronics.tdk.com.
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32778 MKP DC link – high density series up to 480 μF Impedance Z versus frequency f (typical values) Lead spacing 52.5 mm (low profile) ESR versus frequency f (typical values) Lead spacing 52.5 mm (low profile) Impedance Z versus frequency f (typical values) Lead spacing 52.5 mm (12 pins) ESR versus frequency f (typical values) Lead spacing 52.5 mm (12 pins) Characteristics curves Additional technical information can be found under "Design support" on www.tdk-electronics.tdk.com.
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32774 MKP DC link – high density series up to 480 μF Characteristics curves Permissible current IRMS versus frequency f at 70 °C Lead spacing 27.5 mm B32774D*
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32776 MKP DC link – high density series up to 480 μF Characteristics curves Permissible current IRMS versus frequency f at 70 °C Lead spacing 37.5 mm B32776E* B32776G*
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32776 MKP DC link – high density series up to 480 μF Lead spacing 37.5 mm B32776T* Characteristics curves Permissible current IRMS versus frequency f at 70 °C
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32778 MKP DC link – high density series up to 480 μF Characteristics curves Permissible current IRMS versus frequency f at 70 °C Lead spacing 52.5 mm B32778G* (4 pins) B32778T* (4 pins) 10 5 10 3 IRMS A 51 0 4 f Hz 10 5 KMK1508-9 55 µF/450 V 40 µF/575 V 30 µF/800 V 25 µF/900 V 20 µF/1100 V 14 µF/1300 V
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32778 MKP DC link – high density series up to 480 μF B32778J* (12 pins) Characteristics curves Permissible current IRMS versus frequency f at 70 °C Lead spacing 52.5 mm
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32774 ... B32778 MKP DC link – high density series up to 480 μF Curves characteristics (IRMS derating versus temperature) Maximum IRMS current as function of the ambient temperature: IRMS (TA) = Factor x IRMS (70 °C)
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32774 ... B32778 MKP DC link – high density series up to 480 μF Heat transference for self heating calculation The equivalent heat coefficient "G (mW/ºC)" is given for measuring the temperature on the lateral surface of the plastic box as Figure 1 shows. By using a thermocouple and avoiding effect of radi- ation and convection the temperature measured dur ing operation conditions should be a result of the dissipated power divided by the equivalent heat coefficient. Figure 1 Box dimensions Equivalent heat coefficient w (mm) h (mm) l (mm) G (mW/ °C) 11.0 19.0 31.5 25 11.0 21.0 31.5 28 12.5 21.5 31.5 30 13.5 23.0 31.5 32 14.0 24.5 31.5 35 15.0 24.5 31.5 36 16.0 32.0 31.5 45 18.0 27.5 31.5 44 18.0 33.0 31.5 48 19.0 30.0 31.5 48 20.0 11.0 31.5 65 21.0 31.0 31.5 51 22.0 36.5 31.5 58 12.0 22.0 41.5 70 14.0 25.0 41.5 43 16.0 28.5 41.5 50 18.0 32.5 41.5 59 20.0 39.5 41.5 72 24.0 19.0 41.5 50 24.0 15.0 41.5 44 28.0 37.0 42.0 83 28.0 42.5 41.5 90 30.0 45.0 42.0 100 33.0 48.0 42.0 100 43.0 22.0 41.5 80 30.0 45.0 57.5 125 35.0 50.0 57.5 145 43.0 24.0 57.5 103 45.0 57.0 57.5 185 60.0 45.0 57.5 192 130.0 24.0 57.5 200 130.0 58.0 57.5 300
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32774 ... B32778 MKP DC link – high density series up to 480 μF Self Heating by power dissipation & equivalent heat coefficient The IRMS and consequently the power dissipation must be limited during operation in order to not exceed the maximum limit of ΔT allowed for this series. ΔTmax given for this series is equal or lower than 20 °C at rated temperature (70 °C), for higher ambient temperatures ΔTmax (T) will have the same derating factor than IRMS versus temperature and then an equivalent derating as per: ambient temperatures ΔTmax (T) will have the same derating factor than IRMS versus temperature and then an equivalent derating as per: ΔTmax (T) = (Factor)2 × ΔT (70 °C). For any particular IRMS the ΔT may be calculated by: ΔT (°C) = Pdis (mW) / G(mW/°C). Where ΔT (°C) is the difference between the temperature measured on the box (see Figure 1) and the ambient temperature when capacitor is working during normal operation; ΔT (°C) = Top (°C) – TA (°C). It represents the increasing of temperature provoked by the IRMS during operation. G (mW/°C) is the equivalent heat coefficient described above and Pdis (mW) is the dissipated power defined by: Pdis (mW) = ESRtyp (mΩ) × IRMS2 (ARMS). Example for thermal calculation: We will take as reference B32778G0306K (30 µF/1100 V) type for thermal calculation. Considering the following load and capacitor characteristics: IRMS : 12 ARMS at 20 kHz T A: 85 °C 30 × 45 × 57.5 box G (mW/°C): 125 Then we have to find the ESRtyp at 20 kHz what is approx . 8.2 mΩ. So according to: Pdis (mW) = ESRtyp (mΩ) × IRMS2 (ARMS) we have the following: Pdis (mW) = 8.2 mΩ × 12 ARMS2 = 1181 mW and as per: ΔT (°C) = Pdis (mW) / G (mW/°C) we have the following: What is below of the ΔTmax (85 °C) = (Factor)2 × ΔT (70 °C) = (0.7)2 × 20 °C = 9.8 °C. On the other hand we may confirm that max IRMS at 20 kHz at 70 °C = 17.5 ARMS And then max IRMS for 85 °C of ambient temperature is defined as follows: IRMS (85 °C) = Factor × IRMS (70 °C) = 0.7 × 17.5 ARMS = 12.25 ARMS. What confirms once again that I RMS (12 ARMS at 20 kHz) is below the max specified for such fre- quency and ambient temperature.
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32774 ... B32778 MKP DC link – high density series up to 480 μF Life time expectancy - typical curves B3277x-4 (450 V DC) B3277x-5/8/9/0/1 (575 V DC / 800 V DC / 900 V DC / 1100 V DC / 1300 V DC ) Note: Confidence level of 95%
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32774 ... B32778 MKP DC link – high density series up to 480 μF Testing and Standards Test Reference Conditions of test Performance requirements Electrical parameters (Routine test) IEC61071:2007 Voltage between terminals,
1.5 VR, during 10 s
Insulation resistance, Rins at VR if VR <500 V or
500 V if VR ≥500 V
Capacitance, C at 1 kHz (room temperature) Dissipation factor, tan δ at 1/10 kHz (room temperature) Within specified limits Robustness of termina- tions (Type test) IEC 60068-2-21-2006 Tensile strength (test Ua1) Capacitance and tan δ within specified limitsWire diameter Tensile force 0.5 <d1 ≤0.8 mm 0.8 <d1 ≤1.25 mm 10 N 20 N Resistance to soldering heat (Type test) IEC 60068-2-20:2008, test Tb, method 1A Solder bath temperature at 260 ±5 °C, immersion for 10 seconds ΔC/C0 ≤2% |Δ tan δ| ≤0.002 Rapid change of temperature (Type test) IEC 60384-16:2005 T A = lower category temperature TB = upper category temperature Five cycles, duration t = 30 min |ΔC/C0| ≤2% |Δ tan δ| ≤0.002 Rins ≥50% of initial limit Vibration (Type test) IEC 60384-16:2005 Test F C: vibration sinusoidal Displacement: 0.75 mm Accleration: 98 m/s2 Frequency: 10 Hz ... 500 Hz Test duration: 3 orthogonal axes, 2 hours each axe No visible damage Bump (Type test) IEC 60384-16:2005 Test Eb: Total 4000 bumps with 390 m/s2 mounted on PCB 6 ms duration No visible damage |ΔC/C0| ≤2% |Δ tan δ| ≤0.002 Rins ≥50% of initial limit Climatic se- quence (Type test) IEC 60384-16:2005 Dry heat Tb / 16 h Damp heat cyclic, 1st cycle Cold Ta / 2 h Damp heat cyclic, 5 cycles No visible damage |ΔC/C0| ≤3% |Δ tan δ| ≤0.001 Rins ≥50% of initial limit
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32774 ... B32778 MKP DC link – high density series up to 480 μF Damp heat, steady state (Type test) IEC 60384-16:2005 Test Ca 40 °C / 93% RH / 56 days No visible damage |ΔC/C0| ≤5% |Δ tan δ| ≤0.005 Rins ≥50% of initial limit Endurance (Type test) IEC 60384-16:2005 70 °C / 1.25 VR / 1000 hours or 85 °C / 1.25 Vop / 1000 hours or 100 °C / 1.25 Vop / 1000 hours No visible damage |ΔC/C0| ≤5% at 1 kHz |Δ tan δ| ≤0.005 Rins ≥50% of initial limit Test Reference Conditions of test Performance requirements
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32774 ... B32778 MKP DC link – high density series up to 480 μF Mounting guidelines
1 Soldering
1.1 Solderability of leads
The solderability of terminal leads is tested to IEC 60068-2-20:2008, test Ta, method 1. Before a solderability test is carried out, terminals are subjected to accelerated ageing (to IEC 60068-2-2:2007, test Ba: 4 h exposure to dry heat at 155 °C). Since the ageing temperature is far higher than the upper category temperature of the capacitors, the terminal wires should be cut off from the capacitor before the ageing proc edure to prevent the sold erability being impaired by the products of any capacitor decomposition that might occur.
1.2 Resistance to soldering heat
Resistance to soldering heat is tested to IEC 60068-2-20:2008, test Tb, method 1. Conditions: Solder bath temperature 235 ±5 °C Soldering time 2.0 ±0.5 s Immersion depth 2.0 +0/–0.5 mm from capacitor body or seating plane Evaluation criteria: Visual inspection Wetting of wire surface by new solder ≥90%, free-flow- ing solder Series Solder bath temperature Soldering time MKT boxed (except 2. 5 × 6.5 × 7.2 mm) coated uncoated (lead spacing >10 mm) 260 ±5 °C 10 ±1 s MFP MKP (lead spacing >7.5 mm) MKT boxed (case 2.5 × 6.5 × 7.2 mm) 5 ±1 s MKP MKT (lead spacing ≤7.5 mm) uncoated (lead spacing ≤10 mm) insulated (B32559) <4 s recommended soldering profile for MKT uncoated (lead spacing ≤10 mm) and insulated (B32559)
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32774 ... B32778 MKP DC link – high density series up to 480 μF
1.3 General notes on soldering
Permissible heat exposure loads on film capacitor s are primarily characterized by the upper cate- gory temperature Tmax. Long exposure to temperatures above this type-related temperature limit can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical characteristics. For short exposures (as in practical soldering processes) the heat load (and thus the possible effects on a capacitor) will also depend on other factors like: n Pre-heating temperature and time n Forced cooling immediately after soldering n Terminal characteristics: diameter, length, thermal resistance, special configurations (e.g. crimping) n Height of capacitor above solder bath n Shadowing by neighboring components n Additional heating due to heat dissipation by neighboring components n Use of solder-resist coatings Immersion depth 2.0 +0/–0.5 mm from capacitor body or seating plane Shield Heat-absorbing board, (1.5 ±0.5) mm thick, between capacitor body and liquid solder Evaluation criteria: Visual inspection ΔC/C0 tan δ No visible damage 2% for MKT/MKP/MFP 5% for EMI suppression capacitors As specified in sectional specification
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32774 ... B32778 MKP DC link – high density series up to 480 μF The overheating associated with some of thes e factors can usually be reduced by suitable coun- termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced cooling process may possibly have to be included. Recommendations As a reference, the recommended wave soldering profile for our film capacitors is as follows:
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32774 ... B32778 MKP DC link – high density series up to 480 μF Body temperature should follow the description below: n MKP capacitor During pre-heating: Tp ≤110 °C During soldering: Ts ≤120 °C, ts ≤45 s n MKT capacitor During pre-heating: Tp ≤125 °C During soldering: Ts ≤160 °C, ts ≤45 s When SMD components are used together with l eaded ones, the film c apacitors should not pass into the SMD adhesive curing oven. The lea ded components should be assembled after the SMD curing step. Leaded film capacitors are not suitable for reflow soldering. In order to ensure proper conditions for manual or selective soldering, the body temperature of the capacitor (Ts) must be ≤120 °C. One recommended condition for manual soldering is that the tip of the soldering iron should be <360 °C and the soldering contact time should be no longer than 3 seconds. For uncoated MKT capacitors with lead spacings ≤10 mm (B32560/B32561) the following mea- sures are recommended: n pre-heating to not more than 110 °C in the preheater phase n rapid cooling after soldering Please refer to our Film Capacitors Data Book in case more details are needed.
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32774 ... B32778 MKP DC link – high density series up to 480 μF Cautions and warnings The table below summarizes the safety instructions that must always be observed. A detailed de- scription can be found in the relevant sections of the chapters "General technical information" and "Mounting guidelines". n Do not exceed the upper category temperature (UCT). n Do not apply any mechanical stress to the capacitor terminals. n Avoid any compressive, tensile or flexural stress. n Do not move the capacitor after it has been soldered to the PC board. n Do not pick up the PC board by the soldered capacitor. n Do not place the capacitor on a PC board whose PTH hole spacing differs from the specified lead spacing. n Do not exceed the specified time or temperature limits during soldering. n Avoid external energy inputs, such as fire or electricity. n Avoid overload of the capacitors. n Consult us if application is with severe temperature and humidity condition. n There are no serviceable or repairable parts inside the capacitor. Opening the capacitor or any attempts to open or repair the capacitor will void the warranty and liability of TDK Electronics. n Please note that the standards referred to in this publication may have been revised in the meantime. Topic Safety information Reference chapter "General technical information" Storage conditions Make sure that capacitors are stored within the specified range of time, temperature and humidity conditions. 4.5 "Storage conditions" Flammability Avoid external energy, such as fire or electricity (passive flammability), avoid overload of the capacitors (active flammability) and consider the flammability of materials. 5.3 "Flammability" Resistance to vibration Do not exceed the tested ability to withstand vibration. The capacitors are tested to IEC 60068-2-6:2007. TDK Electronics offers film capacitors specially designed for operation under more severe vibration regimes such as those found in automotive applications. Consult our catalog "Film Capacitors for Automotive Electronics". 5.2 "Resistance to vibration" Soldering Do not exceed the specified time or temperature limits during soldering. 1 "Soldering" Cleaning Use only suitable solvents for cleaning capacitors. 2 "Cleaning" Embedding of capacitors in finished assemblies When embedding finished circuit assemblies in plastic resins, chemical and thermal influences must be taken into account. Caution: Consult us first, if you also wish to embed other uncoated component types! 3 "Embedding of capacitors in finished assemblies"
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32774 ... B32778 MKP DC link – high density series up to 480 μF Display of ordering codes for TDK Electronics products The ordering code for one and the same product can be represented differently in data sheets, data books, other publications, on the company website, or in order-related documents such as shipping notes, order confirmations and product labels. T he varying representations of the ordering codes are due to different processes employed and do not affect the specifications of the respective pro- ducts. Detailed information can be found on the Internet under www.tdk-electronics.tdk.com/orderingcodes. Correlation of data sheet values and modelling tool outputs Data sheet values and results of design tools ma y deviate as they have not been derived in the same context. While data sheets show individual parameter statements without considering a possible dependency to other parameters. Tools model a complete given scenario as input and processed inside the tool. Furthermore as we constantly strive to improv e our models, the results of tools can change over time and be a non-binding indication only.
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32774 ... B32778 MKP DC link – high density series up to 480 μF Symbols and terms Symbol English German α Heat transfer coefficient Wärmeübergangszahl αC Temperature coefficient of capacitance Temperaturkoeffizient der Kapazität A Capacitor surface area Kondensatoroberfläche βC Humidity coefficient of capacitance Feuchtekoeffizient der Kapazität C Capacitance Kapazität CR Rated capacitance Nennkapazität ΔC Absolute capacitance change Absolute Kapazitätsänderung ΔC/C Relative capacitance change (relative deviation of actual value) Relative Kapazitätsänderung (relative Abweichung vom Ist-Wert) ΔC/CR Capacitance tolerance (relative deviation from rated capacitance) Kapazitätstoleranz (relative Abweichung vom Nennwert) dt Time differential Differentielle Zeit Δt Time interval Zeitintervall ΔT Absolute temperature change (self-heating) Absolute Temperaturänderung (Selbsterwärmung) Δtan δ Absolute change of dissipation factor Absolute Änderung des Verlustfaktors ΔV Absolute voltage change Absolute Spannungsänderung dV/dt Time differential of voltage function (rate of voltage rise) Differentielle Spannungsänderung (Spannungsflankensteilheit) ΔV/Δt Voltage change per time interval Spannungsänderung pro Zeitintervall E Activation energy for diffusion Aktivierungsenergie zur Diffusion ESL Self-inductance Eigeninduktivität ESR Equivalent series resistance Ersatz-Serienwiderstand f Frequency Frequenz f1 Frequency limit for reducing permissible AC voltage due to thermal limits Grenzfrequenz für thermisch bedingte Reduzierung der zulässigen Wechsel- spannung f2 Frequency limit for reducing permissible AC voltage due to current limit Grenzfrequenz für strombedingte Redu- zierung der zulässigen Wechselspannung fr Resonant frequency Resonanzfrequenz FD Thermal acceleration factor for diffusion Therm. Beschleunigungsfaktor zur Diffusion FT Derating factor Deratingfaktor i Current (peak) Stromspitze IC Category current (max. continuous current) Kategoriestrom (max. Dauerstrom) IRMS (Sinusoidal) alternating current, root-mean- square value (Sinusförmiger) Wechselstrom iz Capacitance drift Inkonstanz der Kapazität k0 Pulse characteristic Impulskennwert LS Series inductance Serieninduktivität λ Failure rate Ausfallrate λ0 Constant failure rate during useful service life Konstante Ausfallrate in der Nutzungsphase
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32774 ... B32778 MKP DC link – high density series up to 480 μF λtest Failure rate, determined by tests E xperimentell ermittelte Ausfallrate Pdiss Dissipated power Abgegebene Verlustleistung Pgen Generated power Erzeugte Verlustleistung Q Heat energy Wärmeenergie ρ Density of water vapor in air Dichte von Wasserdampf in Luft R Universal molar constant for ga ses Allg. Molarkonstante für Gas R Ohmic resistance of discharge circuit Ohmscher Widerstand des Entladekreises Ri Internal resistance Innenwiderstand Rins Insulation resistance Isolationswiderstand RP Parallel resistance Parallelwiderstand RS Series resistance Serienwiderstand S severity (humidity test) S chärfegrad (Feuchtetest) tT i m e Z e i t T Temperature Temperatur τ Time constant Zeitkonstante tan δ Dissipation factor Verlustfaktor tan δD Dielectric component of dissipation factor Dielektrischer Anteil des Verlustfaktors tan δP Parallel component of dissipation factor Parallelanteil des Verlfustfaktors tan δS Series component of dissipation factor Serienanteil des Verlustfaktors TA Temperature of the air surrounding the com- ponent Temperatur der Luft, die das Bauteil um- gibt Tmax Upper category temperature Obere Kategorietemperatur Tmin Lower category temperature Untere Kategorietemperatur tOL Operating life at operating temperature and voltage Betriebszeit bei Betriebstemperatur und -spannung Top Operating temperature, TA + ΔT Beriebstemperatur, T A + ΔT TR Rated temperature Nenntemperatur Tref Reference temperature Referenztemperatur tSL Reference service life Referenz-Lebensdauer VAC AC voltage Wechselspannung VC Category voltage Kategoriespannung VC,RMS Category AC voltage (Sinusförmige) Kategorie-Wechselspannung VCD Corona-discharge onset voltage Teilentlade-Einsatzspannung Vch Charging voltage Ladespannung VDC DC voltage Gleichspannung VFB Fly-back capacitor voltage Spannung (Flyback) Vi Input voltage Eingangsspannung Vo Output voltage Ausgangssspannung Vop Operating voltage Betriebsspannung Vp Peak pulse voltage Impuls-Spitzenspannung Vpp Peak-to-peak voltage Impedance Spannungshub Symbol English German
Please read Cautions and warnings and Important notes at the end of this document. Metallized polypropylene film capacitors (MKP) B32774 ... B32778 MKP DC link – high density series up to 480 μF VR Rated voltage Nennspannung ^VR Amplitude of rated AC voltage Amplitude der Nenn-Wechselspannung VRMS (Sinusoidal) alternating voltage, root-mean- square value (Sinusförmige) Wechselspannung VSC S-correction voltage Spannung bei Anwendung "S-correction” Vsn Snubber capacitor voltage Spannung bei Anwendung "Beschaltung" Z Impedance Scheinwiderstand Lead spacing Rastermaß Symbol English German e
The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitab ility of our products for certain areas of application. These statements are based on our knowledge of typical require- ments that are often placed on our products in the areas of application concerned. We never- theless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products fo r a particular customer application. As a rule, we are either unfamiliar with individual customer applications or less familiar with them than the cus- tomers themselves. For these reasons, it is al ways ultimately incumbent on the customer to check and decide whether a product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or fail- ure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especia lly in customer applications in which the mal- function or failure of an electronic component could endanger human life or health (e.g. in acci- dent prevention or life-saving systems), it must therefore be ensured by means of suitable de- sign of the customer application or other action taken by the customer (e.g. installation of pro- tective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this pub- lication may contain substances subject to rest rictions in certain jurisdictions (e.g. be- cause they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time . The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequent- ly, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms and Conditions of Supply.
- Our manufacturing sites serving the automotive business apply the IATF 16949 standard. The IATF certifications confirm our compliance with requirements regarding the quality manage- ment system in the automotive industry. Referring to customer requirements and customer spe- cific requirements (“CSR”) TDK always has and will continue to have the policy of respecting in- dividual agreements. Even if IATF 16949 may appear to support the acceptance of unilateral re- quirements, we hereby like to emphasize that only requirements mutually agreed upon can and will be implemented in our Quality Management System. For clarification purposes we like to point out that obligations from IATF 16949 shall only become legally binding if individually agreed upon. 8. The trade names EPCOS, CarXield, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, ModCap, MotorCap, PCC, P haseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap, XieldCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.tdk-electronics.tdk.com/trademarks. Release 2020-06