B300W35A109A1G

DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 9

Technical content

© Semiconductor Components Industries, LLC, 2015 March, 2015 − Rev. 0

1 Publication Order Number:

BelaSigna® 300 AM is a DSP−based audio processor which is able to execute the AfterMaster HD algorithm within a system that also includes a host processor and/or external 12S− based mono or stereo A/D converters and D/A converters. AfterMaster HD is an algorithm which processes audio signals in real−time to provide a significant increase in loudness, clarity, depth, and fullness. BelaSigna 300 AM is specifically designed for use in applications requiring a solution to overcome the limitations of small or downward−facing speakers, includi ng flat−screen televisions or headphones. This datasheet describes only the specific information required to integrate BelaSigna 300 AM into an audio system. For a more general description of the programmable BelaSigna 300 device from ON Semiconductor, please refer to the BelaSigna 300 datasheet. Key Features

• Ultra−low−power: typically 4−8 mA when executing AfterMaster HD
• Miniature Form Factor: available in a miniature 3.63 mm x 2.68 mm x 0.92 mm (including solder balls) WLCSP package.
• Full Range of Configurable Interfaces: including a fast I2C−based interface for download and general configuration of the AfterMaster HD algorithm, a highly configurable PCM interface to stream data into and out of the device, a high−speed UART, an SPI port and 5 GPIOs
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant www.onsemi.com MARKING DIAGRAM WLCSP−35 W SUFFIX CASE 567AG BELASIGNA300 35−02−G XXXXYZZ BELASIGNA300 = Device Code 35 = Number of Balls 02 = Revision of Die G = Pb−Free XXXX = Date Code Y = Assembly Plant Identifier = (May be Two Characters) ZZ = Traceability Code Device Package

ORDERING INFORMATION

(Pb−Free) Shipping† 2500 / Tape & Reel †For information on tape and reel specifications, in - cluding part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification s Brochure, BRD8011/D.

Table 1. ABSOLUTE MAXIMUM RATINGS should not be assumed, damage may occur and reliability may be affected.

1. Functional operation only guaranteed below 0 °C for digital core (VDDC) and system voltages above 1.0 V.
2. Parameters may exceed listed tolerances when out of the temperature range 0 to 50 °C.

= 1.8 V unless otherwise noted). The system clock (SYS_CLK) was generated externally at 38 MHz. Parameters marked as screened are tested on each chip. Other parameters are qualified but not tested on every part. Table 2. ELECTRICAL SPECIFICATIONS

Table 2. ELECTRICAL SPECIFICATIONS (continued) performance may not be indicated by the Electrical Characteristics if operated under different conditions.

All BelaSigna 300 AM packages are Pb−free, RoHS−compliant and Green. BelaSigna 300 AM parts are qualified against standards outlined in the following sections. The solder ball composition for the WLCSP package is SAC266. Table 3. WLCSP PACKAGE−LEVEL QUALIFICATION Table 4. WLCSP BOARD−LEVEL QUALIFICATION Figure 1. BelaSigna 300 with AfterMaster Layout Schematic

A total of 35 active pins are present on the BelaSigna 300 AM WLCSP package. They are organized in a staggered array. A description of these pins is given in Table 5. Table 5. WLCSP PAD DESCRIPTIONS

BelaSigna 300 with AfterMaster HD www.onsemi.com WLCSP Assembly / Design Notes For PCB manufacture with BelaSigna 300 AM WLCSP, ON Semiconductor recommends solder−on−pad (SoP) surface finish. With SoP, the solder mask opening should be non−solder mask−defined (NSMD) and copper pad geometry will be dictated by the PCB vendor’s design requirements. Alternative surface finishes are ENiG and OSP; volume of screened solder paste (#5) should be less than 0.0008 mm 3. If no pre−screening of solder paste is used, then following conditions must be met: 1. the solder mask opening should be >0.3 mm in diameter, 2. the copper pad will have 0.25 mm diameter, and 3. soldermask thickness should be less than 1 mil thick above the copper surface. ON Semiconductor can provide BelaSigna 300 AM WLCSP land pattern CAD files to assist your PCB design upon request. WLCSP Weight BelaSigna 300 AM WLCSP (B300W35A109XXG) has an average weight of 0.095 grams. Digital Interfaces General−Purpose Input Output (GPIO) Ports BelaSigna 300 AM has five GPIO ports that can connect to external digital inputs such as push buttons, or digital outputs such as the control or trigger of an external companion chip (GPIO[0..4]). The direction of these ports (input or output) is configurable and each pin has an internal pull−up resistor when configured as a GPIO. A read from an unconnected pin will give a value of logic 1. Four of the five GPIO pins are multiplexed with an LSAD (see the Low−Speed A.D Converters section) and as such the functionality of the pin can be either a GPIO or an LSAD depending on the configuration. Note that GPIO0 cannot be used as an LSAD. Inter−IC Communication (I2C) Interfaces The I2C interface is an industry−standard interface that can be used for high−speed transmission of data between BelaSigna 300 AM and an external device. The interface operates at speeds up to 400 Kbit/sec for system clocks (EXT_CLK) higher than 1.6 MHz. In product development mode, the I 2C interface is used for application debugging purposes, communicating with the BelaSigna 300 AM development tools. The interface can be configured to operate in either master mode or slave mode. Serial Peripheral Interface (SPI) Port An SPI port is available on BelaSigna 300 AM for applications such as communication with a non−volatile memory (EEPROM). The I/O levels on this port are defined by the VBAT. The SPI port operates in master mode only, which supports communications with slave SPI devices. The SPI port on BelaSigna 300 AM only supports master mode, so it will only communicate with SPI slave devices. When connecting to an SPI slave device other than a boot EEPROM, the SPI_CS pin should be left unconnected and the slave device CS line should be driven from a GPIO to avoid BelaSigna 300 AM boot malfunction. When connecting to an SPI EEPROM for boot, the designer can choose to connect the SPI_CS pin to the EEPROM or use a GPIO (high at boot) for a design with several daisy-chained SPI devices. PCM Interface BelaSigna 300 AM includes a highly configurable pulse code modulation (PCM) interface that can be used to stream audio signal data into and out of the device. The I/O levels on this port are defined by the voltage on the VBAT pin.

BelaSigna 300 with AfterMaster HD www.onsemi.com Sample Shipping Label Figure 4. Sample Shipping Label for the re−flow and the assembly that is being re−flowed. J−STD−020D.01 can be used as a guideline. To order BelaSigna 300 with AM, please contact your account manager and ask for part number B300W35A109A1G. Chip Identification Chip identification information can be retrieved by using the Communications Accelerator Adaptor (CAA) tool along with the protocol software provided by ON Semiconductor (see CAA instruction manual). For BelaSigna 300 AM, the key identifier components and values are as follows for the different package options: Package Option Chip Family Chip Version Chip Revision WLCSP 0x03 0x02 0x0100 Support Software A set of tools is available at http://onsemi.com for downloading the proprietary AfterMaster HD algorithm to BelaSigna 300 AM. An AfterMaster HD image is supplied by ON Semiconductor, but must be downloaded to BelaSigna 300 AM upon boot. Training To facilitate development on the BelaSigna 300 AM platform, training is available upon request. Contact your account manager for more information. Company or Product Inquiries For more information about ON Semiconductor products or services visit our Web site at http://onsemi.com.

BelaSigna 300 with AfterMaster HD www.onsemi.com PACKAGE DIMENSIONS WLCSP35, 3.63x2.68 CASE 567AG ISSUE B SEATING PLANE 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. DIM A MIN MAX 0.84 MILLIMETERS D 3.63 BSC E b 0.24 0.29 eD 0.25 BSC 1.00 ÈÈ D E AB PIN A1 REFERENCE eD A0.05 BC 0.03 C 0.05 C 35X b 456 C B A 0.10 C A C 0.17 0.23

2.68 BSC

eE 0.433 BSC 0.25 35X DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* 0.250

0.10 C2X TOP VIEW

A2 0.72 REF RECOMMENDED PACKAGE OUTLINE 123789 PITCH C 0.125 BSC E D 1011121314 C 0.433 PITCH 0.125 PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 B300AM/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. BelaSigna is a registered trademark of Semiconductor Components Industries, LLC.