B1S DAESAN | Alldatasheet
Document overview
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- PDF pages: 2
Technical content
Features
- Glass Passivated Die Construction
- Diffused Junction
- Low Forward Voltage Drop, High Current Capability
- Surge Overload Rating to 30A Peak
- Designed for Printed Circuit Board Applications
- Plastic Material - UL Flammability Classification 94V-0 Maximum Ratings And Electrical Characteristics
- Case : Molded Plastic
- Terminals : Solder Plated Leads, Solderable per MIL-STD-202, Method 2026
- Polarity : As Marked on Case
- Approx. Weight : 0.125 grams
- Mounting Position : Any
- Marking : Type Number (Ratings at 25¡É ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive load. For capacitive load, derate by 20%) CURRENT 0.8 Amperes VOLTAGE 100 to 1000 Volts Notes: (1) Measured at 1.0MHz and Applied Reverse Voltage of 4.0V DC. (2) Thermal Resistance, junction to ambient, measured on PC board with 5.02mm (0.03mm thick) land areas. Peak Repetitive Reverse voltage Working Peak Reverse voltage DC Blocking voltage RMS Reverse voltage Average Rectified Output Current @ TA=40 Non-Repetitive Peak Forward Surge Current, 8.3ms single half-sine-wave superimposed on rated load (JEDEC method) VoltsForward voltage (per element) @ IF=0.4 A VRMM VRWM VR
100 Volts
1.0VFM VRMS 0.8 Amp30IFSM Tj TSTG 500 -55 to +150 ¡É Amp Peak Reverse Current at Rated DC Blocking voltage (per element) Typical Junction Capacitance per element (Note 1) Operating and Storage Temperature Range B1S B2S B4S B6S B8S B10S 200 400 140 280 600 420 800 560 1000
700 Volts
¥ìA ¡É/W pF Io IRM Cj R¥èJA @ TA=25¡É @ TA=125¡É Typical Thermal Resistance, Junction to Ambient (Note 2) 75 A B C D E G H J L K MiniDIP Dim Min Max A 5.43 5.75 B 3.60 4.00 C 0.15 0.05 0.35 D 0.20 7.00E G 0.70 1.10 H 4.50 4.90 J 2.80 2.90 K 2.50 2.70 L 0.50 0.80 A ll Dimens ions in mm
RATING AND CHARACTERISTIC CURVES B1S THRU B10S 0.01 0.1 1.0 0.2 0.6 1.0 1.4 I , INST ANT ANEOUS FOR WARD CURRENT (A)F V , INST ANT ANEOUS FOR WARD V OLTAGE (V) Fi g. 2 T ypical Forward Characteristics (per leg) F T = 25 C Pulse Width = 300 s j 0.4 0.8 1.2 1.6 1.0 10 I , PEAK FOR WARD SURGE CURRENT (A)FSM NUMBER OF CYCLES AT 60 Hz Fi g. 3 Maximum Peak Forward Sur ge Current (per leg) T = 25 C Single Half Sine-W ave Pulse Width = 5.3ms (JEDEC Method) A 100 1 10 100 C , JUNCTION CAP ACIT ANCE (pF)j V , REVERSE VOL TAGE (V) Fi g. 4 Typical Junction Capacitance R T = 25 C f = 1.0MHz j 0.01 0.1 1.0 100 0 20 40 60 80 100 120 140 I , INST ANT ANEOUS REVERSE CURRENT ( A)R PERCENT OF RA TED PEAK REVERSE VOL TAGE (%) Fi g. 5 Typical Reverse Characteristics (per element) T = 25 Cj T = 125 Cj 0.2 0.4 0.6 0.8 0 40 80 120 160 I , AVERAGE FOR WARD RECTIFIED CURRENT (A)(AV) T , AMBIENT TEMPERA TURE ( C ) Fi g. 1 Output Current Deratin g Curve A Resistive or Inductive Load Ceramic PC Board