B270 - B2100
Document overview
- Manufacturer or author: Diodes Incorporated
- PDF pages: 6
Technical content
Features
Schottky Barrier Chip Guard Ring Die Construction for Transient Protection Low Power Loss, High Efficiency Surge Overload Rating to 50A Peak For Use in Low-Voltage, High-Frequency Inverters, Free Wheeling, and Polarity Protection Application High-Temperature Soldering: +260° C/10 Second at Terminal Lead-Free Finish; RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) An automotive -compliant part is available under separate datasheet (B270Q-B2100Q) Mechanical Data Package: SMB Package Material: Molded Plastic. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Lead Free Plating (Matte Tin Finish). Solderable per MIL-STD-202, Method 208 Polarity: Cathode Band or Cathode Notch Weight: 0.093 grams (Approximate) Ordering Information (Note 4) Part Number Package Packing Qty. Carrier B2xx-13-F SMB 3000 Tape & Reel B2xxx-13-F SMB 3000 Tape & Reel Notes: 1. EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. All applicable RoHS exemptions applied. 2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen - and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl ) and <1000ppm antimony compounds. 4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes -packaging/. Marking Information Green Top View Bottom View XXXX/XXXXX = Product Type Marking Code, ex: B290 (SMB Package) = Manufacturer’s Code Marking YWW = Date Code Marking Y = Last Digit of Year (ex: 3 for 2023) WW = Week Code (01 to 53)
Document number: DS30021 Rev. 13 - 2 2 of 6 www.diodes.com October 2023 © 2023 Copyright Diodes Incorporated. All Rights Reserved. B270 - B2100 Maximum Ratings (@TA = +25° C, unless otherwise specified.) Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Characteristic Symbol B270 B280 B290 B2100 Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 70 80 90 100 V RMS Reverse Voltage VR(RMS) 49 56 63 70 V Average Rectified Output Current @ TT = +125C IO 2.0 A Non-Repetitive Peak Forward Surge Current 8.3ms Single Half Sine-Wave Superimposed on Rated Load IFSM 50 A Thermal Characteristics Characteristic Symbol Value Unit Typical Thermal Resistance Junction to Terminal (Note 5) RJT 15 ° C/W Operating and Storage Temperature Range TJ, TSTG -65 to +150 C Electrical Characteristics (@TA = +25° C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition Forward Voltage Drop VF — — 0.79 0.69 V IF = 2.0A, TA = +25C IF = 2.0A, TA = +100C Leakage Current (Note 6) IR — — 7.0 2.0 µA mA @ Rated VR, TA = +25C @ Rated VR, TA = +100C Total Capacitance CT — 75 — pF VR = 4V, f = 1MHz Notes: 5. Valid provided that terminals are kept at ambient temperature. 6. Short duration pulse test used to minimize self-heating effect. 7. DUT mounted on 1*MRP FR-4 PC board, 2oz.
Document number: DS30021 Rev. 13 - 2 3 of 6 www.diodes.com October 2023 © 2023 Copyright Diodes Incorporated. All Rights Reserved. B270 - B2100 0.01 0.1 1.0 I , INSTANTANEOUS FORWARD CURRENT (A)F V , INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 1 Typical Forward Characteristics F 100 1,000 0.1 1 10 100 C , TOTAL CAPACITANCE (pF)T V , DC REVERSE VOLTAGE (V) Fig. 3 Total Capacitance vs. Reverse Voltage R 0.5 1.0 25 50 75 100 125 150 I , AVERAGE FORWARD CURRENT (A)F(AV) T , TERMINAL TEMPERATURE ( C) Fig. 4 Forward Current Derating Curve T ° 1.5 2.0 2.5 1 10 100 I , PEAK FORWARD SURGE CURRENT (A)FSM NUMBER OF CYCLES AT 60 Hz Fig. 5 Max Non-Repetitive Peak Forward Surge Current Single Half-Sine-Wave TJ = 25° C TJ = 100° C TJ = 125° C TJ = 25° C TJ = 25oC TJ = 25oC
Document number: DS30021 Rev. 13 - 2 5 of 6 www.diodes.com October 2023 © 2023 Copyright Diodes Incorporated. All Rights Reserved. B270 - B2100 Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. SMB SMB Dim Min Max A 2.00 2.50 A1 0.05 0.20 b 1.96 2.21 c 0.15 0.31 D 3.30 3.94 E 5.00 5.59 E1 4.06 4.57 L 0.76 1.52 All Dimensions in mm Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. SMB Dimensions Value (in mm) C 4.30 G 1.80 X 2.50 X1 6.80 Y 2.30 D b A E L c Y X G C
Document number: DS30021 Rev. 13 - 2 6 of 6 www.diodes.com October 2023 © 2023 Copyright Diodes Incorporated. All Rights Reserved. B270 - B2100 IMPORTANT NOTICE 1. DIODES INCORPORATED (Diodes) AND ITS SUBSIDIARIES MAKE NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO ANY INFORMATION CONTAINED IN THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICUL AR PURPOSE OR NON -INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 2. The Information contained herein is for informational purpose only and is provided only to illustrate the operation of Diodes’ products described herein and application examples. Diodes does not assume any liability arising out of the application or use of this document or any product described herein. This document is intended for skilled and technically trained engin eering customers and users who design with Diodes’ products. Diodes’ products may be used to facilitate safety-related applications; however, in all instances customers and users are responsible for (a) selecting the appropriate Diodes products for their applications, (b) evaluating the suitability of Diodes’ products for their intended applications, (c) ensuring their applications, which incorporate Diodes’ products, comply the applicable legal and regulatory requirements as well as safety and functional-safety related standards, and (d) ensuring they design with appropriate safeguards (including testing, validation, quality con trol techniques, redundancy, malfunction prevention, and appropriate treatment for aging degradation) to minimize the risks associ ated with their applications. 3. Diodes assumes no liability for any application -related information, support, assistance or feedback that may be provided by Diodes from time to time. 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