STB185N55 STMICROELECTRONICS | Alldatasheet

Document overview

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Technical content

Datasheet sections

  • 1 Electrical ratings
  • 2 Electrical characteristics
  • 3 Test circuit
  • 4 Package mechanical data
  • 5 Packaging mechanical data
  • 6 Revision history

This is preliminary information on a new product foreseen to be developed. Details are subject to change without notice. August 2006 Rev 3 1/12 STB185N55 STP185N55 N-channel 55V - 2.9mΩ - 120A - D2PAK/TO-220 MDmesh™ low voltage Power MOSFET General features ■ Ultra low on-resistance ■ 100% avalanche tested

Description

This n-channel enhancement mode Power MOSFET is the latest refinement of STMicroelectronic unique “single feature size™“ strip-based process with less critical aligment steps and therefore a remarkable manufacturing reproducibility. The resulting transistor shows extremely high packing density for low on- resistance, rugged avalanche characteristics and low gate charge.

Applications

■ Switching application – Automotive Internal schematic diagram Type V DSS RDS(on) ID STB185N55 55V 3.5m Ω 120A(1) 1. Value limited by wire bonding STP185N55 55V 3.8m Ω 120A(1) D2PAK TO-220 Order codes Part number Marking Package Packaging STB185N55 B185N55 D 2PAK Tape & reel STP185N55 P185N55 TO-220 Tube

1 Electrical ratings

Table 1. Absolute maximum ratings

  1. Current limited by package.
  2. Pulse width limited by safe operating area.
  3. Starting Tj=25°C, Id=60A, Vdd=40V

Table 2. Thermal data

  1. When mounted o inch² FR4 2oz Cu.

2 Electrical characteristics

Table 3. On/off states Table 4. Dynamic

  1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.

Table 5. Source drain diode

  1. Pulse width limited by safe operating area
  2. Pulsed: pulse duration = 300µs, duty cycle 1.5%

3 Test circuit

Figure 1. Switching times test circuit for Figure 2. Gate charge test circuit Figure 3. Test circuit for inductive load Figure 4. Unclamped Inductive load test Figure 5. Unclamped inductive wavefo rm Figure 6. Switching time waveform

4 Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at : www.st.com

DIM. mm. inch A 4.4 4.6 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.7 0.93 0.027 0.036 B2 1.14 1.7 0.044 0.067 C 0.45 0.6 0.017 0.023 C2 1.23 1.36 0.048 0.053 D 8.95 9.35 0.352 0.368 D1 8 0.315 E 10 10.4 0.393 E1 8.5 0.334 G 4.88 5.28 0.192 0.208 L 15 15.85 0.590 0.625 L2 1.27 1.4 0.050 0.055 L3 1.4 1.75 0.055 0.068 M 2.4 3.2 0.094 0.126 R0 . 4 0 . 0 1 5 V2 0º 4º D2PAK MECHANICAL DATA

DIM. mm. inch A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.024 0.034 b1 1.15 1.70 0.045 0.066 c 0.49 0.70 0.019 0.027 D 15.25 15.75 0.60 0.620 E 10 10.40 0.393 0.409 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.194 0.202 F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.244 0.256 J1 2.40 2.72 0.094 0.107 L 13 14 0.511 0.551 L1 3.50 3.93 0.137 0.154 L20 16.40 0.645 L30 28.90 1.137 øP 3.75 3.85 0.147 0.151 Q 2.65 2.95 0.104 0.116 TO-220 MECHANICAL DATA

Packaging mechanical data STB185N55 - STP185N55

5 Packaging mechanical data

  • on sales type DIM. mm inch MIN. MAX. MIN. MAX. A 330 12.992 B 1.5 0.059 C 12.8 13.2 0.504 0.520 D 20.2 0795 G 24.4 26.4 0.960 1.039 N 100 3.937 T 30.4 1.197 BASE QTY BULK QTY 1000 1000 REEL MECHANICAL DATA DIM. mm inch MIN. MAX. MIN. MAX. A0 10.5 10.7 0.413 0.421 B0 15.7 15.9 0.618 0.626 D 1.5 1.6 0.059 0.063 D1 1.59 1.61 0.062 0.063 E 1.65 1.85 0.065 0.073 F 11.4 11.6 0.449 0.456 K0 4.8 5.0 0.189 0.197 P0 3.9 4.1 0.153 0.161 P1 11.9 12.1 0.468 0.476 P2 1.9 2.1 0.075 0.082 R 50 1.574 T 0.25 0.35 0.0098 0.0137 W 23.7 24.3 0.933 0.956 TAPE MECHANICAL DATA

6 Revision history

Table 6. Revision history