B170_10 DIODES | Alldatasheet

Document overview

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Technical content

Features

  • Guard Ring Die Constructi on for Transient Protection
  • Ideally Suited for Automated Assembly
  • Low Power Loss, High Efficiency
  • Surge Overload Rating to 30A Peak
  • For Use in Low Voltage, High Frequency Inverters, Free Wheeling, and Polarity Protection Application
  • High Temperature Soldering: 260°C/10 Second at Terminal
  • Lead Free Finish/RoHS Compliant (Note 1)
  • Green Molding Compound (No Halogen and Antimony) (Note 2) Mechanical Data
  • Case: SMA / SMB
  • Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0
  • Moisture Sensitivity: Level 1 per J-STD-020
  • Terminals: Lead Free Plating (Matte Tin Finish). Solderable per MIL-STD-202, Method 208
  • Polarity: Cathode Band or Cathode Notch
  • Weight: SMA 0.064 grams (approximate) SMB 0.093 grams (approximate) Ordering Information (Note 3) Part Number Case Packaging B1x-13-F SMA 5000/Tape & Reel B1xB-13-F SMB 3000/Tape & Reel *x = Device type, e.g. B180-13-F (SMA package); B1100B-13-F (SMB package). Notes: 1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes. 2. Product manufactured with Data Code 0924 (week 24, 2009) and newer are built with Green Molding Compound. 3. For packaging details, go to our website at http://www.diodes.com. Marking Information Top View Bottom View Green XXX = Product type marking code, ex: B170 (SMA package) XXXX = Product type marking code, ex: B190B (SMB package) = Manufacturers’ code marking YWW = Date code marking Y = Last digit of year (ex: 2 for 2002) WW = Week code 01 to 52 YWW xxx(x)

Document number: DS30018 Rev. 10 - 2 2 of 4 www.diodes.com September 2010 © Diodes Incorporated B170/B - B1100/B Maximum Ratings @TA = 25°C unless otherwise specified Single phase, half wave, 60Hz, resistive or inductive load. For capacitance load, derate current by 20%. Characteristic Symbol B170/B B180/B B190/B B1100/B Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 70 80 90 100 V RMS Reverse Voltage VR(RMS) 49 56 63 70 V Average Rectified Output Current @ T T = 125°C IO 1.0 A Non-Repetitive Peak Forward Surge Current 8.3ms Single Half Sine-Wave Superimposed on Rated Load IFSM 30 A Repetitive Peak Reverse Current IRRM 1.0 A Thermal Characteristics Characteristic Symbol B170/B B180/B B190/B B1100/B Unit Typical Thermal Resistance Junction to Terminal (Note 4) RθJT 25 °C/W Operating and Storage Temperature Range TJ, TSTG -65 to +150 °C Electrical Characteristics @TA = 25°C unless otherwise specified Characteristic Symbol Min Typ Max Unit Test Condition Forward Voltage Drop VF - - 0.79 0.69 V IF = 1.0A, TA = 25°C IF = 1.0A, TA = 100°C Leakage Current (Note 5) IR - 0.5 5.0 mA @ Rated VR, TA = 25°C @ Rated VR, TA = 100°C Total Capacitance CT - - 80 pF VR = 4V, f = 1MHz Notes: 4. Valid provided that terminals are kept at ambient temperature. 5. Short duration pulse test used to minimize self-heating effect. 0.01 0.1 1.0 I , INSTANTANEOUS FORWARD CURRENT (A)F V , INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 1 Typical Forward Characteristics F T = 25°C I Pulse Width = 300µs J F 100 1,000 0.1 1 10 100 C , TOTAL CAPACITANCE (pF)T V , DC REVERSE VOLTAGE (V) Fig. 2 Total Capacitance vs. Reverse Voltage R

Document number: DS30018 Rev. 10 - 2 3 of 4 www.diodes.com September 2010 © Diodes Incorporated B170/B - B1100/B 0.5 1.0 25 50 75 100 125 150 I A V E RAGE FORWARD CURRENT (A)F(AV), T , TERMINAL TEMPERATURE ( C) Fig. 3 Forward Current Derating Curve T ° 11 0 1 00 I, PEAK FORWARD SURGE CURRENT (A)FSM NUMBER OF CYCLES AT 60 Hz Fig. 4 Max Non-Repetitive Peak Forward Surge Current Single Half Sine-Wave T = 150 CJ ° Package Outline Dimensions Suggested Pad Layout SMB Dim Min Max A 3.30 3.94 B 4.06 4.57 C 1.96 2.21 D 0.15 0.31 E 5.00 5.59 G 0.05 0.20 H 0.76 1.52 J 2.00 2.50 All Dimensions in mm SMA Dim Min Max A 2.29 2.92 B 4.00 4.60 C 1.27 1.63 D 0.15 0.31 E 4.80 5.59 G 0.05 0.20 H 0.76 1.52 J 2.01 2.30 All Dimensions in mm SMA Dimensions Value (in mm) Z 6.5 G 1.5 X 1.7 Y 2.5 C 4.0 SMB Dimensions Value (in mm) Z 6.7 G 1.8 X 2.3 Y 2.5 C 4.3 A B C D GH E J

Document number: DS30018 Rev. 10 - 2 4 of 4 www.diodes.com September 2010 © Diodes Incorporated B170/B - B1100/B IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries rese rve the right to make modifications, enhanc ements, improvements, corrections or ot her changes without further notice to this document and any product descri bed herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or an y product described herein; neither does Di odes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or us er of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthoriz ed sales channel. Should Customers purchase or use Diodes Inco rporated products for any unintended or una uthorized application, Customers shall i ndemnify and hold Diodes Incorporated and its representativ es harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical component s in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when proper ly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support dev ice or system whose failure to perform can be reasonably expect ed to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifi cations of their life support dev ices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or s ystems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporate d and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2010, Diodes Incorporated www.diodes.com