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Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 5

Technical content

Features

  • Guard Ring Die Construction for Transient Protection
  • Ideally Suited for Automated Assembly
  • Low Power Loss, High Efficiency
  • Surge Overload Rating to 30A Peak
  • For Use in Low Voltage, High Frequency Inverters, Free Wheeling, and Polarity Protection Application
  • Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Notes 3 & 4)
  • Qualified to AEC-Q101 Standards for High Reliability Mechanical Data
  • Case: SMA/SMB
  • Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0
  • Moisture Sensitivity: Level 1 per J-STD-020
  • Terminals: Lead Free Plating (Matte Tin Finish). Solderable per MIL-STD-202, Method 208
  • Polarity: Cathode Band or Cathode Notch
  • Weight: SMA 0.064 grams (approximate) SMB 0.093 grams (approximate) Ordering Information (Note 5) Part Number Qualification Case Packaging B1XX-13-F Commercial SMA 5000/Tape & Reel B140Q-13-F Automotive SMA 5000/Tape & Reel B150Q-13-F Automotive SMA 5000/Tape & Reel B1XXB-13-F Commercial SMB 3000/Tape & Reel *xx = Device Type, e.g. B120-13-F (SMA Package); B120B-13-F (SMB Package). Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. Product manufactured with Date Code 0924 (week 24, 2009) and newer are built with Green Molding Compound. 5. For packaging details, go to our website at http://ww w.diodes.com/products/packages.html Marking Information Top View Bottom View Green B1X0 = Product type marking code, ex: B120 (SMA package) B1X0B = Product type marking code, ex: B160B (SMB package) = Manufacturers’ code marking YWW = Date code marking Y = Last digit of year (ex: 2 for 2002) WW = Week code (01 to 53) YWW B1X0(B)

Document number: DS13002 Rev. 18 - 2 2 of 5 www.diodes.com May 2013 © Diodes Incorporated B120/B - B160/B Maximum Ratings (@TA = +25°C, unless otherwise specified.) Single phase, half wave, 60Hz, resistive or inductive load For capacitance load, derate current by 20%. Characteristic Symbol B120/B B130/B B140/B B150/B B160/B Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 20 30 40 50 60 V RMS Reverse Voltage VR(RMS) 14 21 28 35 42 V Average Rectified Output Current @ TT = +130°C IO 1.0 A Non-Repetitive Peak Forward Surge Current 8.3ms Single Half Sine-Wave Superimposed on Rated Load IFSM 30 A Thermal Characteristics Characteristic Symbol B120/B B130/B B140/B B150/B B160/B Unit Typical Thermal Resistance Junction to Terminal (Note 6) RθJT 20 °C/W Operating and Storage Temperature Range TJ, TSTG -65 to +150 °C Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition Forward Voltage Drop B120/B, B130/B, B140/B B150/B, B160/B VF - 0.5 0.7 V IF = 1.0A IF = 1.0A Leakage Current (Note 7) IR - 0.5 10 mA @ Rated VR, TA = +25°C @ Rated VR, TA = +100°C Total Capacitance CT - - 110 pF VR = 4V, f = 1MHz Notes: 6. Thermal Resistance: Junction to terminal, unit mounted on PC board with 5.0 mm2 (0.013 mm thick) copper pads as heat sink. 7. Short duration pulse test used to minimize self-heating effect. 0.1 1.0 I , INSTANTANEOUS FORWARD CURRENT (A)F V , INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 1 Typical Forward Characteristics - B120/B thru B140/B F T = +25 CA ° T = +75 CA ° T = +125 CA ° T = -25 CA ° 0.01 0.1 1.0 I , INSTANTANEOUS FORWARD CURRENT (A)F V , INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 2 Typical Forward Characteristics - B150/B thru B160/B F I Pulse Width = 300 msF T = 125ºCA T = 25ºCA

Document number: DS13002 Rev. 18 - 2 3 of 5 www.diodes.com May 2013 © Diodes Incorporated B120/B - B160/B 100 0.1 0.01 1,000 10,000 0 20 40 V , INSTANTANEOUS REVERSE VOLTAGE (V) Fig. 3 Typical Reverse Characteristics, B120/B thru B140/B R 10 30 50 I , INSTANTANEOUS REVERSE CURRENT (µA)R 100 0.1 1,000 10,000 0 20 40 60 70 V , INSTANTANEOUS REVERSE VOLTAGE (V) Fig. 4 Typical Reverse Characteristics, B150/B thru B160/B R 10 30 50 I , INSTANTANEOUS REVERSE CURRENT (µA)R 100 1,000 0.1 1 10 100 C , TOTAL CAPACITANCE (pF)T V , DC REVERSE VOLTAGE (V) Fig. 5 Total Capacitance vs. Reverse Voltage R 0.5 1.0 25 50 75 100 125 150 I AVERAGE RECTIFIED CURRENT (A)O, T , TERMINAL TEMPERATURE (ºC) Fig. 6 Forward Current Derating Curve T 1 10 100 I , PEAK FORWARD SURGE CURRENT (A)FSM Fig. 7 Max Non-Repetitive Peak Forward Surge Current NUMBER OF CYCLES AT 60 Hz Single Half Sine-Wave

Document number: DS13002 Rev. 18 - 2 4 of 5 www.diodes.com May 2013 © Diodes Incorporated B120/B - B160/B Package Outline Dimensions Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version. Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. SMA Dim Min Max A 2.29 2.92 B 4.00 4.60 C 1.27 1.63 D 0.15 0.31 E 4.80 5.59 G 0.05 0.20 H 0.76 1.52 J 2.01 2.30 All Dimensions in mm SMB Dim Min Max A 3.30 3.94 B 4.06 4.57 C 1.96 2.21 D 0.15 0.31 E 5.00 5.59 G 0.05 0.20 H 0.76 1.52 J 2.00 2.50 All Dimensions in mm Dimensions SMA (in mm) SMB (in mm) C 4.00 4.30 G 1.50 1.80 X 2.50 2.50 X1 6.50 6.80 Y 1.70 2.30 A B C D GH E J C Y G X

Document number: DS13002 Rev. 18 - 2 5 of 5 www.diodes.com May 2013 © Diodes Incorporated B120/B - B160/B IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such appli cations shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees ar ising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or system s without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when proper ly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety -critical, life support devices or systems , notwithstanding any devices - or systems -related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2013, Diodes Incorporated www.diodes.com