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FEATURES
- Plastic package has Underwriters Laboratory Flammability Classification 94V-0 * Low power loss,high efficiency * For use in low voltage high frequency inverters, free wheeling,and polarity protection applications * Guardring for over voltage protection * High temperature soldering guaranteed: 260°C/10 seconds at terminals Mechanical Data Case: SOD-123FL/MINI SMA molded plastic over sky die Terminals: Tin Plated, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any si tcudorp fo lairetam eht taht eralced eW Weight: 0.0155g )dnuopmoc yxope neerg( eerf neggolaH Handling precautin::None 1.Electrical Characteristic Maximum & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified. Parameter Symbol symbol B120F B130F B140F B145F B150F B160F B180F B1100F B1150F B1200F Unit device marking code 12 13 14 145 15 16 18 110 115 120 Maximum repetitive peak reverse voltage VRRM 20 30 40 45 50 60 80 100 150 200 V Maximum RMS voltage VRMS 14 21 28 31.5 35 42 56 70 105 140 V Maximum DC blocking voltage VDC 20 30 40 45 50 60 80 100 150 200 V Maximum average forward rectified current at TC = 75°C IF(AV) A Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM A Typical thermal resistance (Note 1) RθJA RθJC °C/W Operating junction temperature range TJ °C storage temperature range TSTG °C Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified. Parameter Symbol symbol Unit Maximum instantaneous forward voltage at(IF = 0.1 A, TJ = 25°C) (IF = 0.7 A, TJ = 25°C) (IF = 1.0 A, TJ = 25°C) VF 0.5 0.35 0.45 0.50 0.90 0.92 V Maximum DC reverse current at rated DC blocking voltage TA = 25°C Tj = 125°C I R mA Typical junction capacitance at 4.0V, 1MHz CJ PF NOTES: 1. 8.0mm2 (.013mm thick) land areas 0.85 1.0 110 –55 to +150 –65 to +175 0.55 0.5 160 0.7 B120F thru B1200F Schottky Barrier Rectifiers Reverse Voltage 20 to 200V Forward Current 1.0A B120F B130F B140F B145F B150F B160F B180F B1100F B1150F B1200F Lead(Pb)-FreeP b CATHODE ANODE WEITRON http://www.weitron.com.tw 1/6 28-May-2016
2.Ratings and Characteristic Curves ( TA = 25°C unless otherwise noted ) Fig. 1 – Forward Current Derating Curve Average Forward Rectified Current (A) 0 25 50 75 100 125 150 175 1.0 0.5 60 Hz Resistive or Inductive Load CASE TEMPERATURE:Tc(°C) Fig 4. – Typical Reverse Characteristics Instantaneous Reverse Current (mA) 0 20 40 60 80 100 1.0 0.1 0.01 0.001 Percent of Rated Peak Reverse Voltage (%) Tj=125 Tj=75 Tj=25 Fig 6. – Typical Junction Capacitance 0.1 1 10 100 1000 100 TJ = 25°C f = 1.0 MHz Vsig = 50 V Reverse Voltage (V) Junction Capacitance (pF) Fig 5. –typical transient thermal impedance Transient thermal impedance(°C/W) 1.0 0.1 100 0.01 0.1 1.0 10 t,Pulse duration,sec Fig. 2 – Maximum Non-repetitive Peak Forward Surge Current 1 10 TJ = TJ max 8.3ms Single Half Sine- Number of Cycles at 60Hz Peak forward surge current (A) TJ = 25°C Pulse width = 300µs 1% Duty Cycle Instantaneous Forward Current (A) 1.0 0.1 0.01 100 Fig 3. – Typical Instantaneous Forward Characteristics Instantaneous Forward Voltage (V) TJ = 25°C Pulse width = 300µs 1% Duty Cycle B120F thru B1200F WEITRON http://www.weitron.com.tw 2/6 28-May-2016
- dimension: Suggested solder pad layout Dimensions in inches and (millimeters) SOD-123FL MIN MAX MIN MAX A 3.5 3.9 0.138 0.159 B 0.75 0.95 0.029 0.037 C 2.6 3.0 0.103 0.119 D 1.6 2.0 0.063 0.079 E H 0.9 1.2 0.036 0.047 J 0.12 0.22 0.005 0.009 K 0.032Typ0.8Typ INCHES 0.45Typ 0.018Typ DIM MILLIMETERS PACKAGE A B C B A C B120F thru B1200F WEITRON http://www.weitron.com.tw 3/6 28-May-2016
4.Packing information Unit:mm A 0.1 2.00 B 0.1 3.85 C 0.1 1.10 d 0.1 1.50 D 2.0 - D1 min - D 2.0 178.00 D1 min 62.00 D2 0.5 13.00 E 0.1 1.75 F 0.1 3.50 P 0.1 4.00 P0 0.1 4.00 P1 0.1 2.00 T 0.1 0.23 W 0.3 8.00 W1 1.0 11.40 Symbol tolerance SOD-123FL Embossment center Sprocket hole position Item Punch hole position Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter Overall tape thickness 7" Reel inner diameter Feed hole diameter Punch hole pitch Spocket hole pitch Tape width Reel width WEITRON http://www.weitron.com.tw 4/6 28-May-2016 B120F thru B1200F
5.Suggested thermal profile for soldering process 1. Storage environment:Temperature=5~40℃ Humidity=55±25% 2. Reflow soldering of surface-mount device 3. Reflow soldering Time maintained above: - Temperature (TL) - Time(tL) 217℃ 60-260sec Peak Temperature(TP) 255 -0/+5℃ Time 25℃ to Peak Temperature Ramp-down Rate <6℃/sec <6minutes Average ramp-up rate(TL to TP) <3℃/sec Profile Feature Time within 5℃ of actual Peak Temperature(TP) 10~30sec Tsmax to TL - Ramp-up Rate Preheat - Temperature Min(Tsmin) - Temperature Max(Tsmax) - Time(min to max)(ts) 150℃ 200℃ 60~120sec Soldering Condition <3sec B120F thru B1200F WEITRON http://www.weitron.com.tw 5/6 28-May-2016
6.High reliability test capabilities Solder Resistance MIL-STD-750D METHOD-2031 Solderability at 245±5℃ for 5 sec MIL-STD-202F METHOD-208 High Temperature Reverse Bias R =80% rate at Tj =150℃ for 168hr MIL-STD-750D METHOD-1038 Forward Operation Life MIL-STD-750D METHOD-1027 Intermittent Operation Life MIL-STD-750D METHOD-1036 Pressure Cooker 15PSIG at TA=121℃ for 4hrs JESD22-A102 Temperature Cycling MIL-STD-750D METHOD-1051 Thermal Shock MIL-STD-750D METHOD-1056 Forward Surge MIL-STD-750D METHOD-4066-2 Humidity at TA=85℃,RH=85% for 1000hrs MIL-STD-750D METHOD-1021 High Temperature Storage Life MIL-STD-750D METHOD-1031 Item Test Condition Reference -55℃ to +125℃ dwelled for 30 min. and transferred for 5min. Total 10 cycles 0℃ for 5min. Rise to 100℃ for 5min. Total 10 cycles 8.3ms single half sine-wave superimposed on rated load,one surge T A=25℃,IF=IO On state:power on for 5 min. Off state:power off for 5 min. on and off for 500 cycles at 260±5℃ for 10±2sec immerse body into solder 1/16" ± 1/32" Rated average rectifier current TA=25℃ for 500hrs WEITRON http://www.weitron.com.tw 6/6 28-May-2016 B120F thru B1200F at 175℃ for 1000hrs V