B1150E

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FEATURES

• Plastic package has Underwriters Laboratory Flammability Classification 94V-0 * Low power loss,high efficiency * For use in low voltage high frequency inverters, free wheeling,and polarity protection applications * Guardring for over voltage protection * High temperature soldering guaranteed: 260°C/10 seconds at terminals Mechanical Data Case: SOD-323HE molded plastic over sky die Terminals: Tin Plated, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any We declare that the material of product is Weight: 0.011 g Haloggen free (green epoxy compound) Handling precautin:None 1.Electrical Characteristic Maximum & Thermal Characteristics Ratings at 25 ambient temperature unless otherwise specified. Parameter Symbol symbol B120E B130E B140E B150E B160E B180E B1100E B1150E B1200E Unit device marking code 12 13 14 15 16 18 110 115 120 Maximum repetitive peak reverse voltage VRRM 20 30 40 50 60 80 100 150 200 V Maximum RMS voltage VRMS 14 21 28 35 42 56 70 105 140 V Maximum DC blocking voltage VDC 20 30 40 50 60 80 100 150 200 V Maximum average forward rectified current at Tc = 75°C IF(AV) A Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM A Typical thermal resistance (Note 1) RθJA RθJL °C/W Operating junction temperature range TJ °C storage temperature range TSTG °C Electrical Characteristics Ratings at 25 ambient temperature unless otherwise specified. Parameter Symbol symbol Unit Maximum instantaneous forward voltage at(IF = 0.7 A, TJ = 25°C) (IF = 1.0 A, TJ = 25°C) VF 0.9 0.92 V Maximum DC reverse current at rated DC blocking voltage TA = 25°C TJ = 125°C IR 0.25 0.13 mA Typical junction capacitance at 4.0V, 1MHz CJ PF NOTES: 1. 8.0mm2 (.013mm thick) land areas 0.7 0.85 0.48 0.55 0.03 1.0 220 –55 to +125 –55 to +150 Schottky Barrier Rectifiers Reverse Voltage 20 to 200V Forward Current 1.0A 160 CATHODE ANODE B120E thru B1200E Lead(Pb)-FreeP b B1200EB1150EB1100EB180EB160EB150EB140EB130EB120E WEITRON http://www.weitron.com.tw 1/5 05-May-2016

2.Ratings and Characteristic Curves ( TA = 25 C unless otherwise noted ) Fig. 1 Forward Current Derating Curve Average Forward Rectified Current (A) 0 25 50 75 100 125 150 175 1.0 0.5 60 Hz Resistive or Inductive Load Case Temperature, Fig 4. Typical Reverse Characteristics Instantaneous Reverse Current (mA) 0 20 40 60 80 1.0 0.1 0.01 0.001 Percent of Rated Peak Reverse Voltage (%) Tj=125 Tj=75 Tj=25 Fig 6. Typical Junction Capacitance 0.1 1 10 1000 100 TJ = 25 C f = 1.0 MHz Vsig = Reverse Voltage (V) Junction Capacitance (pF) Fig 5. typical transient thermal impedance Transient thermal impedance(。C/W) 100 1000 0.01 0.1 1.0 10 100 t,Pulse duration,sec Fig. 2 Maximum Non-repetitive Peak Forward Surge Current 1 10 100 TJ = TJ max 8.3ms Single Half Sine-wave Number of Cycles at 60Hz Peak forward surge current (A) TJ = 25! C Pulse width = 300µs 1% Duty Cycle Instantaneous Forward Current (A) 1.0 0.1 0.01 100 Fig 3. Typical Instantaneous Forward Characteristics Instantaneous Forward Voltage (V) TJ = 25 C Pulse width = 300µs 1% Duty Cycle B120E thru B1200E WEITRON http://www.weitron.com.tw 2/5 05-May-2016 Ċ

1. dimension: 負極 正極 Suggested solder pad layout Dimensions in inches and (millimeters) B A MIN MAX MIN MAX A 2.30 2.70 0.091 0.106 B 1.20 1.35 0.047 0.053 C 1.75 1.95 0.069 0.077 D E 0.55 0.75 0.022 0.030 F 0.10 0.20 0.004 0.008 G 0.50 0.55 0.020 0.022 H 0.50 0.55 0.020 0.022 I 0.40 0.60 0.016 0.024 J 1.15 1.55 0.045 0.061 K DIM 0.8Typ INCHES 0.032Typ 0.30Typ 0.012Typ MILLIMETERS D E C PACKAGE A B C D E A C DD B E F SOD-323HE G H J I I K B120E thru B1200E WEITRON http://www.weitron.com.tw 3/5 05-May-2016

5.Suggested thermal profile for soldering process 1. Storage environment Temperature=5~40 ℃ Humidity=55±25% 2. Reflow soldering of surface-mount device 3. Reflow soldering Tsmax to TL - Ramp-up Rate <6minutes Peak Temperature(TP) Soldering Condition Time maintained above: - Temperature (TL) - Time(tL) <3sec 255 -0/+5℃ 10~30sec <6℃/sec Average ramp-up rate(TL to TP) <3℃/sec Profile Feature Ramp-down Rate Preheat - Temperature Min(Tsmin) - Temperature Max(Tsmax) - Time(min to max)(ts) 150℃ 200℃ 60~120sec Time 25℃ to Peak Temperature Time within 5℃ of actual Peak Temperature(TP) 217℃ 60-260sec Pt t25℃ to Peak ts preheat TL Temperature time TP TL Ts min Ts max Ramp-up Ramp-down Critical Zone TL to TP WEITRON http://www.weitron.com.tw 4/5 05-May-2016 B120E thru B1200E

6.High reliability test capabilities Solder Resistance MIL-STD-750D METHOD-2031 Solderability at 245±5℃ for 5 sec MIL-STD-202F METHOD-208 High Temperature Reverse Bias VR=80% rate at Tj=125℃ for 168hrs MIL-STD-750D METHOD-1038 Forward Operation Life MIL-STD-750D METHOD-1027 Intermittent Operation Life MIL-STD-750D METHOD-1036 Pressure Cooker 15PSIG at TA=121℃ for 4hrs JESD22-A102 Temperature Cycling MIL-STD-750D METHOD-1051 Thermal Shock MIL-STD-750D METHOD-1056 Forward Surge MIL-STD-750D METHOD-4066-2 Humidity at TA=85℃, RH =85% for 1000hrs MIL-STD-750D METHOD-1021 High Temperature Storage Life at 150℃ for 1000hrs MIL-STD-750D METHOD-1031 Rated average rectifier current -55℃ to +125℃ dwelled for 30 min. and transferred for 5min. Total 10 cycles TA=25℃, IF=IO 8.3ms single half sine-wave superimposed on rated load,one surge at 260±5℃ for 10±2sec immerse 0℃ for 5min. Rise to 100℃ for 5min. Total 10 cycles Item Test Condition Reference B120E thru B1200E WEITRON http://www.weitron.com.tw 5/5 05-May-2016