STB100NF04_07 STMICROELECTRONICS | Alldatasheet

Document overview

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Technical content

N-channel 40V - 0.0043Ω - 120A - TO-220 - D2PAK STripFET™ II Power MOSFET General features ■ Standard threshold drive ■ 100% avalanche tested

Description

This Power MOSFET is the latest development of STMicroelectronics unique “Single Feature Size™” strip-based process. The resulting transistor shows extremely high packing density for low on-resistance, rugged avalanche characteristics and less critical alignment steps therefore a remarkable manufacturing reproducibility.

Applications

■ Switching application Internal schematic diagram Type V DSS RDS(on) ID Pw STP100NF04 40V < 0.0046 Ω 120A 300W STB100NF04 40V < 0.0046 Ω 120A 300W D²PAK TO-220 Order codes Part number Marking Package Packaging STB100NF04 B100NF04 D²PAK Tape & Reel STP100NF04 P100NF04 TO-220 Tube

Contents: STB100NF04 - STP100NF04 Contents:

1 Electrical ratings

Table 1. Absolute maximum ratings

  1. Current limited by package
  2. Pulse width limited by safe operating area.
  3. ISD ≤120A, di/dt ≤300A/µs, VDD < V(BR)DSS. Tj < Tjmax
  4. Starting Tj=25°C, I D=60A, VDD=30V

Table 2. Thermal resistance

2 Electrical characteristics

Table 3. On/off Table 4. Dynamic

Table 5. Source drain diode

  1. Pulse width limited by safe operating area.
  2. Pulsed: pulse duration=300µs, duty cycle 1.5%

2.1 Electrical characterist ics (curves)

Figure 1. Power Derating vs. Tc Figure 2. Max Id Current vs. Tc Figure 3. Output Characteristics Figure 4. Transfer Characteristics Figure 5. Transconductance Figure 6. Static Drain-source on Resistance

Figure 17. Allowable Iav vs. Time in Avalanche

2.2 Spice thermal model

Table 6. Spice parameter Figure 18. Spice model schematic

3 Test circuit

Figure 19. Unclamped inductive load test Figure 20. Unclamped inductive waveform Figure 21. Switching times test circuit for Figure 22. Gate charge test circuit Figure 23. Test circuit for inductive load Figure 24. Switching time waveform

4 Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com

DIM. mm. inch A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.024 0.034 b1 1.15 1.70 0.045 0.066 c 0.49 0.70 0.019 0.027 D 15.25 15.75 0.60 0.620 E 10 10.40 0.393 0.409 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.194 0.202 F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.244 0.256 J1 2.40 2.72 0.094 0.107 L 13 14 0.511 0.551 L1 3.50 3.93 0.137 0.154 L20 16.40 0.645 L30 28.90 1.137 øP 3.75 3.85 0.147 0.151 Q 2.65 2.95 0.104 0.116 TO-220 MECHANICAL DATA

DIM. mm. inch A 4.4 4.6 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.7 0.93 0.027 0.036 B2 1.14 1.7 0.044 0.067 C 0.45 0.6 0.017 0.023 C2 1.23 1.36 0.048 0.053 D 8.95 9.35 0.352 0.368 D1 8 0.315 E 10 10.4 0.393 E1 8.5 0.334 G 4.88 5.28 0.192 0.208 L 15 15.85 0.590 0.625 L2 1.27 1.4 0.050 0.055 L3 1.4 1.75 0.055 0.068 M 2.4 3.2 0.094 0.126 R0 . 4 0 . 0 1 5 V2 0º 4º D2PAK MECHANICAL DATA

STB100NF04 - STP100NF04 Packaging mechanical data

5 Packaging mechanical data

  • on sales type DIM. mm inch MIN. MAX. MIN. MAX. A 330 12.992 B 1.5 0.059 C 12.8 13.2 0.504 0.520 D 20.2 0795 G 24.4 26.4 0.960 1.039 N 100 3.937 T 30.4 1.197 BASE QTY BULK QTY 1000 1000 REEL MECHANICAL DATA DIM. mm inch MIN. MAX. MIN. MAX. A0 10.5 10.7 0.413 0.421 B0 15.7 15.9 0.618 0.626 D 1.5 1.6 0.059 0.063 D1 1.59 1.61 0.062 0.063 E 1.65 1.85 0.065 0.073 F 11.4 11.6 0.449 0.456 K0 4.8 5.0 0.189 0.197 P0 3.9 4.1 0.153 0.161 P1 11.9 12.1 0.468 0.476 P2 1.9 2.1 0.075 0.082 R 50 1.574 T 0.25 0.35 0.0098 0.0137 W 23.7 24.3 0.933 0.956 TAPE MECHANICAL DATA

6 Revision history

Table 7. Revision history 01-Mar-2006 3 Removed I²PAK and inserted D²PAK.