AVR

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• Manufacturer or author: TDK Corporation
• PDF pages: 12

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Voltage Protection Devices February 2022 Voltage Protection Devices February 2022 AVRM/AVR-M : Standard Type AVRL : Low Capacitance Type AVRH : High reliability Type SGNE : Low Clamp Type Chip varistors ESD/Voltage protection devices AVR/SGNE series REACH SVHC-Free Lead FreeRoHS Pb Halogen Free BrCl

(2/12) 20220209 / vpd_varistors_avr_en.fm Voltage Protection Devices Chip varistors CHARACTERISTICS OF CHIP VARISTOR Varistors are voltage dependent no nlinear resistive elements with a resistance that decreases rapidl y when the voltage is over the constant value. Varistors become zener diode of 2 serial connection and equiva- lent, and does not have polarity. CURRENT vs. VOLTAGE CHARACTERISTICS THE EFFECT OF THE VARISTOR Without varistor A malfunction and failure of electronic equipment With Varistor Suppress abnormal voltage by inserting varistor in a circuit EQUIVALENT CIRCUIT OF CHIP VARISTORS CHIP VARISTORS FEATURE IEC61000-4-2 LEVEL4 compliant. Reliability characteristics eval uated based on AEC-Q200 con- dition. (Automotive products) High ESD withstanding voltage Small-sized products are available 125°C, 150°C Supported Fig.1 Internal structure of multilayer chip varistors Overview of the AVR/SGNE series RoHS Directive Compliant Product Compatible with lead-free solders Chip varistor /V1mA:12V Zener diode /Vz:6.8V Positive direction Negative direction Voltage(V) Current(A) 10–1 10–2 10–3 10–4 10–5 –10–1 –10–2 –10–3 –10–4 –10–5 ESD, Surge voltage Power line Signal line IC ESD, Surge voltage Power line Signal line Insert a varistor between a line and ground : Chip varistor IC No. Name (1) Semiconductor ceramics (2) Internal electrode(Pd) (3) Terminal electrode Ag (4) Ni (5) Sn

2 Zener Diodes

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(3/12) 20220209 / vpd_varistors_avr_en.fm Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use. Please note that the contents may change without any prior notice due to reasons such as upgrading. Voltage Protection Devices Chip varistors PART NUMBER CONSTRUCTION Overview of the AVR/SGNE series AVRM 1608 C 390 K T 271 N Series name L x W dimensions Structure code Varistor voltage Varistor voltage tolerance Packaging style Capacitance Capacitance tolerance (%)(mm) (V) (%) (pF) 0402 0.4x0.2 C General structure 390=39×10 0 K ±10 T Taping 271=27×10 1 K± 1 0 0603 0.6x0.3 6R8 6.8 M ±20 B Bulk 221 220 M ±20 1005 1.0x0.5 270 27 N ±30 271 270 N ±30 1608 1.6x0.8 390 39 2012 2.0×1.2 AVR-M 1608 C 270 M T AAB Series name L x W dimensions Structure code Varistor voltage Varistor voltage tolerance Packaging style Company special symbol(mm) (V) (%) 0603 0.6x0.3 C General structure 270=27×10 0 K ±10 T Taping 1005 1.0x0.5 G Conductive paste compatible 080 8 M ±20 B Bulk 1608 1.6x0.8 120 12 N ±30 2012 2.0×1.2 270 27 AVRL 10 1A 3R3 F T A Series name L x W dimensions Maximum continuous voltage Capacitance Capacitance tolerance Packaging style Company special symbol(mm) (V) (pF) (pF) 04 0.4x0.2 1A 10 R50 0.5 F ±1 T Taping 06 0.6x0.3 1D 20 1R1 1.1 G ±2 B Bulk 10 1.0×0.5 1E 25 3R3 3.3 N ±0.3 16 1.6×0.8 6R8 6.8 AVRH 10 C 270 K T 150 N A 8 Series name L x W dimensions Structure code Varistor voltage Varistor voltage tolerance Packaging style Capacitance Capacitance tolerance ESD voltage amount IEC61000-4-2 Operating temperature limit (°C)(mm) (V) (%) (pF) (kV) 1005 1.0x0.5 C General structure 270=27×100 K ±10 T Taping 150=15×10 0 K ±10% A 25 8 150 270 27 B Bulk 4R7 4.7 M ±20% E 8 390 39 150 15 N ±30% 101 100 500 50 Y ±0.13pF SGNE 04 C 080 M T 150 N 25 Series name L x W dimensions Structure code Varistor voltage Varistor voltage tolerance Packaging style Capacitance Capacitance tolerance ESD clamping voltage Average voltage (IEC61000-4-2, 8kV)(mm) (V) (%) (pF) 04 0.4x0.2 C General structure 080=8×10 0 K ±10 T Taping 150=15×10 0 N ±30% 06 0.6x0.3 080 8 B Bulk 6R8 4.7 Y ±0.13pF 10 1.0×0.5 270 27 150 15 Shape symbol (JIS) L W T B RoHS Directive Compliant Product Compatible with lead-free solders W T L B

(4/12) 20220209 / vpd_varistors_avr_en.fm Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use. Please note that the contents may change without any prior notice due to reasons such as upgrading. Voltage Protection Devices Chip varistors TERMINOLOGY 1 8/20µs test waveform 2 10/1000µs test waveform Overview of the AVR/SGNE series Item Unit Description Varistor voltage (Breakdown voltage) V1mA (V) Chip varistor-terminal voltage when DC1mA was flowed Maximum continuous voltage Vdc (V) DC voltage that is continuously applied between chip varistor terminals Terminal chip varistors leakage current-value: 50µA max. Voltage appearing across the varistor when a pulse current (8/20µs?1) of specified peak value is applied. Clamping voltage Vcl (V) Voltage between terminal chip varistors of the Specified peak current value of the impulse current (8/ 20µs 1) is applied Maximum energy E (Joule) When applied specified peak impulse current-value current (10/1000µs 2) once, maximum energy that electrical property of chip varistors be not deteriorated Maximum peak current Ip (A) When applied impulse current (8/20µs 1) once, maximum current that electrical property of chip varis- tors be not deteriorated Capacitance C (pF) Oscillator frequency 1kHz or 1MHz, capacitance between chip varistor-terminal in oscillator voltage 1Vrms RoHS Directive Compliant Product Compatible with lead-free solders 20µs 50% 90% 100%Current Time 8µs 1000µs 50% 90% 100% 10µs Current Time

(5/12) 20220209 / vpd_varistors_avr_en.fm Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use. Please note that the contents may change without any prior notice due to reasons such as upgrading. Voltage Protection Devices Chip varistors PRODUCT CHARACTERISTICS LIST AVR/SGNE seriesɹProduct characteristics list Item V (1mA) C1kHz *C1MHz Vdc Clamping voltage 8/20µs Maximum energy 10/1000µs Maximum peak current 8/20µs Operating temperature range IEC61000-4-2 (Contact) AEC-Q200 (V) (pF) DC (V) Vcl (V) E (J) Ip (A) (°C) 150pF/330 AVRL061FR50ETA 140(112 to 168) 0.5(0.3 to 0.7)* 30 — — — –40 to +85 4kV (Level2) AVRM0603C080MT101N 8(6.4 to 9.6) 100(70 to 130) 5.5 17(1A) 0.01 4 –40 to +85 8kV (Level4) AVRM0603C120MT101N 12(9.6 to 14.4) 100(70 to 130) 5.5 20(1A) 0.01 5 –40 to +85 8kV (Level4) AVRM0603C200MT150N 20(16 to 24) 15(10.5 to 19.5)* 12 40(1A) 0.01 1 –40 to +85 8kV (Level4) AVR-M1005C080MTAAB 8(6.4 to 9.6) 650(520 to 780) 5.5 14(1A) 0.04 25 –40 to +85 8kV (Level4) AVR-M1005C080MTABB 8(6.4 to 9.6) 100(55 to 145) 5.5 15(1A) 0.02 3 –40 to +85 8kV (Level4) AVR-M1005C080MTACB 8(6.4 to 9.6) 33(14 to 52) 5.5 19(1A) 0.01 1 –40 to +85 8kV (Level4) AVR-M1005C080MTADB 8(6.4 to 9.6) 480(384 to 576) 5.5 14(1A) 0.04 25 –40 to +85 8kV (Level4) AVR-M1005C120MTAAB 12(9.6 to 14.4) 130(104 to 156) 7.5 20(1A) 0.05 10 –40 to +85 8kV (Level4) AVR-M1005C120MTACC 12(9.6 to 14.4) 460(276 to 644)* 7.5 21(1A) 0.01 24 –40 to +85 8kV (Level4) AVR-M1005C180MTAAB 18(14.4 to 21.6) 120(72 to 168)* 11 30(1A) 0.06 16 –40 to +85 8kV (Level4) AVRM1005C270KT101N 27(24.0 to 30.0) 100(70 to 130) 19 44(1A) 0.06 4 –40 to +85 8kV (Level4) AVR-M1005C270MTAAB 27(21.6 to 32.4) 40(30 to 48) 15 47(1A) 0.04 47 –40 to +85 8kV (Level4) AVRH10C390KT500NA8 39(35.0 to 43.0) 50(35 to 65) 28 72(2A) 0.02 15 –55 to +150 25kV ✔ AVRH10C101KT4R7FA8 100(90 to 110) 4.7(3.7 to 5.7)* 70 190(1A) 0.03 1 –55 to +150 25kV ✔ AVR-M1608C080MTAAB 8(6.4 to 9.6) 650(520 to 780) 5.5 15(2A) 0.09 30 –40 to +85 8kV (Level4) AVR-M1608C120MT2AB 12(9.6 to 14.4) 400(320 to 480) 7.5 20(2A) 0.06 15 –40 to +85 8kV (Level4) AVR-M1608C120MT6AB 12(9.6 to 14.4) 1050(840 to 1260) 7.5 20(2A) 0.09 50 –40 to +85 8kV (Level4) AVR-M1608C180MT6AB 18(14.4 to 21.6) 600(480 to 720) 11 30(2A) 0.10 30 –40 to +85 8kV (Level4) AVR-M1608C220KT2AB 22(19.8 to 24.2) 210(147 to 273) 16 37(2A) 0.03 10 –40 to +125 25kV ✔ AVR-M1608C220KT6AB 22(19.8 to 24.2) 560(392 to 728) 16 34(2A) 0.10 30 –40 to +125 25kV ✔ AVR-M1608C270MTAAB 27(21.6 to 32.4) 30(21 to 39) 17 52(2A) 0.05 2 –55 to +150 25kV ✔ AVR-M1608C270KTACB 27(24.0 to 30.0) 60(42 to 78) 19 54(2A) 0.05 10 –55 to +150 25kV ✔ AVRM1608C270KT800M 27(24.0 to 30.0) 80(64 to 96) 19 53(2A) 0.02 28 –55 to +150 25kV ✔ AVR-M1608C270KT2AB 27(24.0 to 30.0) 160(112 to 208) 19 42(2A) 0.10 20 –55 to +150 25kV ✔ AVRM1608C270KT221M 27(24.0 to 30.0) 220(176 to 264) 19 52(2A) 0.10 40 –55 to +150 25kV ✔ AVR-M1608C270KT6AB 27(24.0 to 30.0) 430(301 to 559) 19 42(2A) 0.10 48 –55 to +150 25kV ✔ AVR-M1608G270KT6AB 27(24.0 to 30.0) 430(301 to 559) 19 42(2A) 0.10 48 –55 to +150 25kV ✔ AVRM1608C390KT271N 39(35.0 to 43.0) 270(189 to 351) 28 69(2A) 0.10 78 –55 to +150 25kV ✔ AVRM1608C560KT101M 56(50.4 to 61.6) 100(80 to 120) 40 113(2A) 0.10 60 –55 to +150 25kV ✔ AVRM1608C720KT750M 72(64.8 to 79.2) 75(60 to 90) 53 135(2A) 0.10 40 –55 to +150 25kV ✔ AVR-M2012C120MT6AB 12(9.6 to 14.4) 1000(550 to 1450) 7.5 20(5A) 0.20 60 –40 to +85 8kV (Level4) AVR-M2012C220KT6AB 22(19.8 to 24.2) 800(560 to 1040) 16 38(5A) 0.30 100 –40 to +125 25kV ✔ AVRM2012C330KT801N 33(29.7 to 36.3) 800(560 to 1040) 24 59(5A) 0.50 240 –55 to +150 25kV ✔ AVR-M2012C390KT6AB 39(35.0 to 43.0) 430(387 to 483) 28 62(5A) 0.30 100 –55 to +150 25kV ✔ AVRM2012C560KT251M 56(50.4 to 61.6) 250(200 to 300) 40 113(5A) 0.30 150 –55 to +150 25kV ✔ AVRM2012C720KT201M 72(64.8 to 79.2) 200(160 to 240) 53 142(5A) 0.30 100 –55 to +150 25kV ✔ RoHS Directive Compliant Product Compatible with lead-free solders

(6/12) 20220209 / vpd_varistors_avr_en.fm Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use. Please note that the contents may change without any prior notice due to reasons such as upgrading. Voltage Protection Devices Chip varistors DISCHARGE VOLTAGE WAVEFORM (EXAMPLE) WITHOUT VARISTOR, WAVEFORM AT VARISTOR INSTALLATION WAVEFORM AT VARISTOR INSTALLATION Test conditions 150pF/330 (IEC61000-4-2) Contact discharge, Charged voltage 8kV TEST CIRCUIT DIAGRAM AVR/SGNE seriesɹ Electrostatic absorption characteristics RoHS Directive Compliant Product Compatible with lead-free solders –50 0 50 100 150 200 250 300 Time(ns) Voltage(V) 1600 1200 1000 800 400 600 200 –200 1800 1400 Without Varistor AVRH10C270KT150NA8 AVR-M1608C270KT6AB AVR-M1608C220KT6AB –50 0 50 100 150 200 250 300 Time(ns) Voltage(V) 160 120 100 –20 180 140 AVRH10C270KT150NA8 AVR-M1608C270KT6AB AVR-M1608C220KT6AB 50Ω Discharge gun ESD simulator Test sample Oscilloscope 60dB attenuator I/O impedance: 50Ω ESD Simulator Discharge Point Chip Varistor PCB SMA Connector Coaxial Cable Attenuator(60dB) 50Ω Oscilloscope 50Ω Shield

(7/12) 20220209 / vpd_varistors_avr_en.fm Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use. Please note that the contents may change without any prior notice due to reasons such as upgrading. Voltage Protection Devices Chip varistors Board design When attached to chip varistors, amount of silver used (fillet size) has direct impact on chip varistors after mounting. Thus, sufficient consideration is necessary. Set of land dimensions (1) As the stress rises in the chip varistors owing to the increase in silver, breakage and cracks will occur. Cause including crack, as caution on board land design, configure the shape and dimensions so that the amount of silver is appropriate. If you installed 2 or more parts in the Common Land, separated by a solder resist and special land of each component. (2) When peak levels panning-at soldering is excessive, by solder contraction stress, mechanical-thermal stress causes a Y asuku chip crack. In addition, when the peak level is underestimated, ter- minal electrode fixed strength is insufficient. This causes chip dropouts and may affect circuit reliability. Representative example of the panning of peak levels is shown in the following. Recommended silver dose Case and suggested protocol want to avoid Attention on a circuit board design RoHS Directive Compliant Product Compatible with lead-free solders Dimensions shape Symbol A B C AB C 4PMEFSWPMVNF PWFSMPBE Solder stress is increased, and it is easy for a crack to form. %FDFOUTPMEFS WPMVNF 4PMEFSWPMVNF EFGJDJU Fixed strength is weak, and there is connection a prob- lem and risk of loss. Example Cases to avoid Improvement example (land division) Lead wire and land of part discrete doubles up Arrangements in the vicinity Arrangements of chip component's companion .PTUMBSHFTFSWJOHBNPVOU .JOJNVNQSJNFBNPVOU SolderChip Leads PCB Solder resist Leads Solder (ground solder) Chassis Solder resist L2 L2>L1 Land Land Excess solder Missing solder Solder resist

(8/12) 20220209 / vpd_varistors_avr_en.fm Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use. Please note that the contents may change without any prior notice due to reasons such as upgrading. Voltage Protection Devices Chip varistors Arrangements of components (1) I was based on camber of substrate and suggested protocol of chip varistors arrangement, as stress does not join to the utmost is shown in following. (2) In payment near by board, depending on mount position of chip varistors, as mechanical stress varies, please refer to the following diagram. The order of A > B = C > D > E eases the stress. Attention on a circuit board design RoHS Directive Compliant Product Compatible with lead-free solders Substrate for flexural stress Adverse events Substrate for flexural stress Good example Direction of surface solderSolder the mountain fold as a top. Solder the mountain fold as a bottom. [Please review the italicized portion, as I am unsure what you mean to con- vey here.] Chip arrangements (direction) Mounted vertically to the per- foration and slit. Mounted horizontally to the perforation and slit. Distance from perforation and slit portion Close location is disadvanta- geous of perforation and slit. It is an advantage so distant location away places the perfo- ration and slit. Perforation or slit Perforation or slit Perforation or slit Perforation or slit (L1<L2) (L1<L2) B E D A C Slit Perforation

(9/12) 20220209 / vpd_varistors_avr_en.fm Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use. Please note that the contents may change without any prior notice due to reasons such as upgrading. Voltage Protection Devices Chip varistors Application to board Mounting head pressure Under suction nozzle if dead point too, during implementation, excessive force joins of chip varistors low, as cause causes of crack, please use with reference to something about following. 1) Being set to top surface of substrate so that under suction nozzle as for dead center, substrate does not bend back, and adjust, please. 2) Nozzle pressure at implementation is 0.1 to 0.3N in static load, please. 3) Substrate fixes up back surface of substrate with support pin in impact of suction nozzle to wely deflection to the utmost, and substrate hold deflection, please. A representative example is shown in the following. Mechanical shock that, if positioning your nail to wear, ragged edge of positionings, participates in chip varistors are locally, and chip varistors, as there is possibility of crack generated, cut the closed positioning, and maintenance and inspection, and, exchange of manage dimensions and position nail periodically, please. Soldering Significant impact is possible on the performance of chip varistors, flux checks something about follow, please use. (1) Flux uses one with 0.1wt % (Cl conversion) or less halide sub- stance contains amounts, please. In addition, do not do this with strongly acidic objects. Flux during is soldered (2) Chip varistors is applied the smalleset amount necessary, please. (3) If Used soluble flux, perform thorough wash particularly, please. Reflow temperature profile Soldering iron The tip temperature and also by (1) types of soldering irons, the size of the substrate, and the geometry of the land pattern. Being earlier, but when as there is possibility that crack occurs in the heat ander- son impaction, point soldering iron temperature is high, please do solder work within the following conditions. Direct iron tip is in contact with the (2) chip varistors body, and the strain owing to thermal shock in particular grows even if a crack is generated. Therefore, please do not touch it directly to the terminal electrodes. Local precautions RoHS Directive Compliant Product Compatible with lead-free solders Cases to avoid Recommended case Single-sided mounting Double-sided mounting Crack Support pin Solder peeling Crack Support pin Item Specification For eutectic mixture solder Use of lead-free solder Preheating temperature 160 to 180°C 150 to 180°C Solder melting temperature 200°C 230°C Maximum temperature 240°C maxɽ 260°C max. Preheating time 100s max. 120s max. Time to reach higher than the solder melting temperature 30s max. 40s max. number of possible reflow cycles 2 max. 2 max. Temperature of iron tips (°C) Wattage ʢWʣ Pallet point shape (mm) Soldering time (Second) Frequency NBY 30max. ø3.0max. 5 max. Within each terminal once (Within total of twice) Natural cooling Preheating Soldering T3 T3 t: Time Peak T: Temperature

(10/12) 20220209 / vpd_varistors_avr_en.fm Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use. Please note that the contents may change without any prior notice due to reasons such as upgrading. Voltage Protection Devices Chip varistors Cleaning (1) If cleaning liquid is inappropriate, residues and other foreign body of fluxes builds up on chip varistors, and can degrade the per- formance of chip varistors (particularly the insulation resistance). (2) Wash conditions may compromise performance of chip varistors if they are improper (wash due, wash excess). 2-1) For wash due (a) By substance of a system in flux residue halide, metal including terminal electrodes may experience corrosion. (b) Substance of a system in flux residue halide builds up on chip varistors, and reduces the insulation resistance. (c) Soluble flux makes comparisons of colophony series flux, and there is event with trends of significant (1) and(2). 2-2) For excess wash (1) Owing to lavage, chip varistors deteriorates, and reduces perfor- mance of chip varistors. (2) In ultrasonography, when output is passed, substrate resonates size, and crack occurs in body and sprang of chip varistors in vibration of substrate. Since this may reduce the strength of the terminal electrode, please note the following conditions. [Please review the italicized portion, as I am unsure what you mean to convey here.] Ultrasound output Ultrasonic frequency Ultrasound cleaning time 2-3) Concentration including halogen that when cleaning liquid to pollution, when you released is higher, and may cause similar of results into wash due. Substrate handling after component mounting (1) When substrate is divided, a flexible so that show in following dia- gram to substrate, and is given by stress including twist, as there is possibility that crack occurs of chip varistors, please check that stress is within acceptable limits. (2) During each substrate operational check, push pressure with contact failure of check pin of boards checkers of check pin may be toned up to be prevented. As substrate is bent under loading, chip varistors is broken owing to stress. There is also the possibility that solder on the terminal electrode will peel off. Follow the diagram for reference, and check that the substrate bends, please. Single-part component handling To drop impact, as there is possibility that breakage and crack is entered, do not chip varistors that(1) chip varistors falls. (2) At stacking storage after implementation and treatment of sub- strate, corner of boards is regarded as chip varistors. Please be careful, as there is the possibility that breakage and cracks will occur on impact. Attention after implementation RoHS Directive Compliant Product Compatible with lead-free solders Bends Twist Item Cases to avoid Recommended case Substrate sags Peeling Check pin Check pin Support pin Floor Crack #PBSE Crack

(11/12) 20220209 / vpd_varistors_avr_en.fm Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use. Please note that the contents may change without any prior notice due to reasons such as upgrading. Voltage Protection Devices Chip varistors REEL DIMENSIONS PACKAGE QUANTITY / INDIVIDUAL WEIGHT TAPE DIMENSIONS Packaging style RoHS Directive Compliant Product Compatible with lead-free solders ø180±2.0 2.0±0.5 ø13±0.2 ø21±0.8 Dimensions in mm 0.8 ø60min. 14.0max. 9.0max. Type Package quantity Individual weight (pieces/reel) ʢmgʣ AVRM0402/AVRL04/SNGE04 20,000 0.1 AVRM0603/AVR-M0603/AVRL06/ SGNE06 15,000 0.2 AVRM1005/AVR-M1005/AVRL10/ AVRH10 10,000 1.2 AVRM1608/AVR-M1608/AVRL16 4,000 5 AVRM2012/AVR-M2012 2,000 13 Dimensions in mm Type A B P1 T 4.0±0.12.0±0.05 B A P1 8.0±0.3 1.75±0.1 3.5±0.05 T 1.5 +0.1 Dimensions in mm 160min. Taping 200min. 200min.Drawing direction

(12/12) 20220209 / vpd_varistors_avr_en.fm Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use. Please note that the contents may change without any prior notice due to reasons such as upgrading. Voltage Protection Devices REMINDERS FOR USING THESE PRODUCTS Before using these products, be sure to request the delivery specifications. SAFETY REMINDERS Please pay sufficient attention to the warnings for safe designing when using this products. Please pay careful attention to the precautions and follow safe designing practices when using these products. Please observe the following precautions in order to avoid problems with chip varistors such as characteristic degradation and element destruction Please store these products in an environment with a temperature of 5 to 40°C and humidity level of 20 to 70%RH, and use them within six months. Poor storage conditions may lead to the deterioration of the solderability of the edge electrodes, so please be careful to avoid contact with humidity, dew condensation, dust, toxic gas (hydrogen, hydrogen sulfide, sulfurous acid, chlorine, ammonia, etc.), direct sunlight, and so on. Please do not use products that have been dropped or detached when mounting. Please solder with the reflow soldering method, and not the flow (dip) soldering method. Please observe the following precautions to avoid problems with varistors such as characteristic degradation and element destruction, which ultimately lead to the generation of heat and smoke with the elements. Do not use in locations where the temperatures exceed the operating temperature range such as under direct sunlight or near sources of heat. Do not use in locations where there are high levels of humidity such as under direct exposure to weather and areas where steam is released. Do not use in locations such as dusty areas, high-saline environments, places where the atmosphere is contaminated with corrosive gas, etc. Avoid powerful vibrations, impact (such as by dropping), pressure, etc. that may lead to splitting in the products. Do not use with a voltage that exceeds the maximum allowable circuit voltage. When resin coating (including modular) a varistor, do not use a resin that will cause deterioration of the varistor. Be sure never to use resin that generates hydrogen as palladium is used for the inner electrode. Avoid attachment near combustible materials. Please contact our sales offices when considering the use of the products listed on this catalog for applications, whose perfor mance and/or quality require a more stringent level of safety or reliability, or whose failure, malfunction or trouble could cause serious damage to society, person or property ('specific uses' such as automobiles, airplanes,medical instruments, nuclear devices, etc.) as well as when considering the use for applications that exceed the range and conditions of this catalog. Please also contact us when using these products for automotive applications. As range of catalog, conditions are transcended, or for damage that generated by was used in application specific, etc, accept no the responsibility, wish. Please take appropriate measures such as acquiring protective circuits and devices that meet the uses, applications, and conditions of the instruments and keeping backup circuits. REMINDERS