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2021 Microchip Technology Inc. Product Brief DS40002310A-page 1 mXT2912TD-AxUW 1.0
Description
The mXT2912TD-AxUW 1.0 uses a unique charge-transfer acquis ition engine to implement Mi crochip’s patented capacitive sensing method. Coupled with a state-of-the-art CPU, the entire touchscreen sensing solution can measure, classify and track a number of individual finger touches with a high degree of accuracy in the shortest response time. The mXT2912TD-AxUW 1.0 allows for both mutual and self capacitance measurements, with the self capacitance measurements being used to augment the mutual capacitance measurements to produce reliable touch information. Automotive Applications
- ASIL-B related FMEDA processes applied maXTouch® Adaptive Sensing Touchscreen Technology Keys Touch Sensor Technology
- Discrete/out-cell support including glass and PET film- based sensors
- On-cell/touch-on display support including TFT, LCD (ITPS, IPS) and OLED
- Synchronization with disp lay refresh timing capability
- Support for standard (for example, Diamond) and proprietary sensor patterns (review of designs by Microchip or a Microchip-qualified touch sensor module partner is recommended) Front Panel Material and Design
- Works with PET or glass, including curved profiles (configuration and stack-up to be approved by Microchip or a Microchip-qualified touch sensor module partner)
- Support for non-rectangular sensor designs (for example, circular, rounded or with cutouts) Touch Performance
- Moisture/Water Compensation - No false touch with condensation or water drop up to 22 mm diameter - One-finger tracking with condensation or water drop up to 22 mm diameter
- Mutual capacitance and self capacitance measurements supported for robust touch detection
- P2P mutual capacitance measurements supported for extra sensitive multi-touch sensing
- Noise suppression technology to combat ambient and power-line noise - Up to 240 V PP between 1 Hz and 1 kHz sinusoidal waveform - Up to 20 V PP between 1 kHz and 1 MHz sinusoidal waveform
- AEC-Q100 Qualified
- Developed following Automotive SPICE® Level 3 certified processes
- CISPR 25 compliant (for both mutual and self capacitance measurements)
- Microchip has patents related to the Ultrawide Touch technology. The touch sensor, which will be developed by the customer, its partners, and/or Microchip for Ultrawide touch programs, can only be part of a touch solution that incorporates a Microchip touchscreen controller to implement the relevant functionality.
- Single ultrawide touchscreen up to 20 X lines by
142 Y lines, made up of 40 X by 71 Y in a multiplexed
arrangement (subject to configuration)
- Touchscreen size 34 inches (7:1 aspect ratio), assuming a sensor electrode pitch of 6 mm. Other sizes are possible with different electrode pitches and appropriate sensor material
- Multiple touch support with up to 16 concurrent touches tracked in real time
- Up to 32 nodes can be allocated as mutual capacitance sensor keys in addition to the touchscreen, defined as 2 key arrays (subject to availability of X and Y lines and other configurations)
- Adjacent Key Suppression (AKS) technology is supported for false key touch prevention
- 10 mm glass (or 5 mm PMMA) with bare finger (dependent on screen size, touch size, configuration and stack-up)
- 6 mm glass (or 3 mm PMMA) with multi-finger 5 mm glove (2.7 mm PMMA equivalent) (dependent on screen size, touch size, configuration and stack-up) maXTouch 2911-node Touchscreen Controller Product Brief
mXT2912TD-AxUW 1.0 DS40002310A-page 2 Product Brief 2021 Microchip Technology Inc.
- Burst Frequency - Flexible and dynamic Tx burst frequency selection to reduce EMC disturbance - Controlled Tx burst frequency drift over process and temperature range - Configurable Tx waveform shaping to reduce emissions
- Scan Speed - Typical report rate for 10 touches 50 Hz (subject to configuration) - Initial touch latency <20 ms for first touch from idle (subject to configuration) - Configurable to allow for power and speed optimization On-chip Gestures
- Reports one-touch and two-touch gestures Enhanced Algorithms
- Lens bending algorithms to remove display noise
- Touch suppression algorithms to remove unintentional large touches, such as palm
- Palm Recovery Algorithm for quick restoration to normal state Data Store
- 60-byte CRC-checksummed data area for use as a run-time Product Data Store Area
- Up to 64 bytes of user’s custom data (not CRC checksummed) Power Saving
- Programmable timeout for automatic transition from Active to Idle state
- Pipelined analog sensing detection and digital pr ocessing to optimize system power efficiency Application Interfaces Power Supply Package
- 176-lead LQFP 24 × 24 × 1.4 mm, 0.5 mm pitch Operating Temperature Design Services
- Review of device configuration, stack-up and sensor patterns
- I 2C client interface with support for Standard mode (up to 100 kHz), Fast mode (up to 400 kHz), Fast-mode Plus (up to 1 MHz)
- SPI client interface (up to 8 MHz)
- Interrupt to indicate when a message is available
- Additional SPI Debug Interface to read th e raw data for tuning and debugging purposes
- Digital (Vdd) 3.3V nominal
- Digital I/O (VddIO) 3.3V nominal
- Analog (AVdd) 3.3V nominal
- High voltage external X line drive (XVdd) up to 8.5V
- ATMXT2912TD-ATUW: –40C to +85C (Grade 3)
- ATMXT2912TD-ABUW: –40C to +105C (Grade 2)
mXT2912TD-AxUW 1.0 2021 Microchip Technology Inc. Product Brief DS40002310A-page 3 PIN CONFIGURATION 176-lead LQFP 113 111 110 109 108 107 118 117 116 115 114 112 122 121 120 119 132 131 130 129 128 127 126 125 124 123 106 105 104 103 102 101 100 157 155154153152151162161160159158 156166165164163176175174173172171170169 168167 150149148 142147146145144143 141140139 138137136135134133 64 66 67 68 69 7059 60 61 62 63 6555 56 57 5845 46 47 48 49 50 51 52 53 54 71 72 73 7974 75 76 77 78 80 81 82 83 84 85 86 87 88 X29 mXT2912TD-AxUW X20 X30 X31 X32 X33 X34 X35 X36 X37 X38 X39 NC NC X10 X11 X12 X13 X14 X15 X16 X17 X18 XVDD GND X19 Y64 VDDIN Y65 Y66 Y67 Y68 Y69 Y70 NC NC DS0 GND AVDD NC NC NC VDDIO RESET SCL/SCK SDA/MOSI VDDIO GPIO0/SS ADDSEL/MISO GND GPIO1 COMMSEL GPIO2 CHG GPIO3 GPIO4 GPIO5 DBG_SS /GPIO6 HSYNC VSYNC GND VDDCORE Y18 GND AVDD Y17 Y16 Y15 Y14 Y13 Y12 Y11 Y10 NC Y63 NC Y37 Y41 Y42 Y43 Y44 Y45 Y46 Y47 Y48 Y49 Y50 Y51 Y52 Y53 GND AVDD Y54 Y55 Y56 Y57 Y58 Y59 Y60 Y61 Y62 GND AVDD XVDD VDDCORE GND Y36 Y38 Y39 Y40 GND DBG_CLK DBG_DATA VDDIO TEST NC NC NC NC NC NC AVDD GND NC VREGBOOST GND AVDD Y35 Y34 Y33 Y32 Y31 Y30 Y28 Y27 Y26 Y25 Y24 Y23 Y22 Y21 Y20 Y19 NC X40 GND XVDD X21 X22 X23 X24 X25 X26 X27 X28 Y29 Top view
mXT2912TD-AxUW 1.0 DS40002310A-page 4 Product Brief 2021 Microchip Technology Inc.
1.0 PACKAGING INFORMATION
1.1 Package Marking Information
1.1.1 176-LEAD LQFP
1.1.2 ORDERABLE PART NUMBERS
The product identification system for maXTouch devices is described in “Product Identification System”. That section also lists example part numbers for the device. P i n1I D Abbreviation of Part Number MXT2912TD Date (Year and Week) and Die Revision yywwR CCC Country Code Lot Traceability Code yywwNNN
mXT2912TD-AxUW 1.0 2021 Microchip Technology Inc. Product Brief DS40002310A-page 5
1.2 Package Details
D
0.20 C A-B D
0.10 C A-B D
C SEATING PLANE N/4 TIPS TOP VIEW SIDE VIEW NOTE 1 0.08 C Microchip Technology Drawing C04-21013 Rev A Sheet 1 of 2 176X For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: 176-Lead Plastic Quad Flatpack (2VB) - 24x24x1.4 mm Body [LQFP] Atmel Legacy Global Package Code AGR D D E E A B e 1 2 3 N A A1 176X b
0.20 C A-B D 4X
mXT2912TD-AxUW 1.0 DS40002310A-page 6 Product Brief 2021 Microchip Technology Inc. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Pin 1 visual index feature may vary, but must be located within the hatched area. Dimensioning and tolerancing per ASME Y14.5M H SECTION A-A L (L1) c Number of Terminals Overall Height Terminal Width Overall Width Terminal Length Molded Package Width Molded Package Thickness Pitch Standoff Units Dimension Limits A b e L E N
0.50 BSC
1.40 0.45 0.17 0.05 0.22 0.60 MILLIMETERS MIN NOM 176 0.75 0.27 1.60 0.15 MAX L1 1.00 REF -Footprint Overall Length Molded Package Length D
26.00 BSC
24.00 BSC
Terminal Thickness c 0.09 - 0.20 R -0.08 -Lead Bend Radius -0.08 0.20 3.5°0° 7°Foot Angle -0° -Lead Angle ࣄ2 12°11° 13°Terminal-to-Exposed-Pad 1.35 1.45 Lead Bend Radius Microchip Technology Drawing C04-21013 Rev A Sheet 2 of 2 176-Lead Plastic Quad Flatpack (2VB) - 24x24x1.4 mm Body [LQFP] Atmel Legacy Global Package Code AGR
mXT2912TD-AxUW 1.0 2021 Microchip Technology Inc. Product Brief DS40002310A-page 7 RECOMMENDED LAND PATTERN Dimension Limits Units C2Contact Pad Spacing Contact Pitch MILLIMETERS E MAX 25.40 Contact Pad Length (X176) Contact Pad Width (X176) 1.50 0.30 NOM C1Contact Pad Spacing 25.40 Contact Pad to Center Pad (X172) G1 0.20 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M1. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: E 123 176 SILK SCREEN Microchip Technology Drawing C04-23013 Rev A 176-Lead Plastic Quad Flatpack (2VB) - 24x24x1.4 mm Body [LQFP] Atmel Legacy Global Package Code AGR
mXT2912TD-AxUW 1.0 DS40002310A-page 8 Product Brief 2021 Microchip Technology Inc. APPENDIX A: REVISION HISTORY Revision A (March 2021) Initial edition for firmware revision 1.0.AA – Release
mXT2912TD-AxUW 1.0 2021 Microchip Technology Inc. Product Brief DS40002310A-page 9 PRODUCT IDENTIFICATION SYSTEM The table below gives details on the product identification system for maXTouch devices. See “Orderable Part Numbers” below for example part numbers for the mXT2912TD-AxUW. To order or obtain information, for example on pricing or delivery, refer to the factory or the listed sales office. Orderable Part Numbers Device: Base device name Package: A AM QFP (Plastic Quad Flatpack) VQFN (Plastic Very Thin Quad Flat No Lead) Temperature Range: T B –40C to +85C (Grade 3) –40C to +105C (Grade 2) Tape and Reel Option: Blank R Standard Packaging (Tube or Tray) Tape and Reel (1) Pattern: Extension, QTP, SQTP, Code or Special Requirements (Blank Otherwise) Note 1: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. See “Orderable Part Numbers” below or check with your Microchip Sales Office for package availability with the Tape and Reel option. Orderable Part Number Firmware Revision Description ATMXT2912TD-ATUWVAO (Supplied in trays) 1.0.AA 176-lead LQFP 24 × 24 × 1.4 mm, RoHS compliant Operating temperature range –40C to +85C (Grade 3) ATMXT2912TD-ATRUWVAO (Supplied in tape and reel) ATMXT2912TD-ABUWVAO (Supplied in trays) 1.0.AA 176-lead LQFP 24 × 24 × 1.4 mm, RoHS compliant Operating temperature range –40C to +105C (Grade 2) ATMXT2912TD-ABRUWVAO (Supplied in tape and reel) PART NO. Device []X Temperature Range –XXX Package []X Tape and Reel Option []XXX Pattern
mXT2912TD-AxUW 1.0 DS40002310A-page 10 Product Brief 2021 Microchip Technology Inc. NOTES:
2021 Microchip Technology Inc. Product Brief DS40002310A-page 11 Note the following details of the code protection feature on Microchip devices:
- Microchip products meet the sp ecifications contained in their particular Microchip Data Sheet.
- Microchip believes that its family of products is secu re when used in the intended manner and under normal conditions.
- There are dishonest and possibly ill egal methods being used in attempts to breach the code protection features of the Microchip devices. We believe that these methods require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Attempts to breach these code protection features, most likely, cannot be accomplished without violating Microchip's intellectual property rights.
- Microchip is willing to work with any customer who is concerned about the integrity of its code.
- Neither Microchip nor any other semiconduc tor manufacturer can guarantee the security of its code. Code protection does not mean that we are guaranteeing the product is "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication is provided for the sole purpose of designing with an d using Microchip products. Information regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS". MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF NON- INFRINGEMENT, MERCHANTABILITY , AND FITNESS FOR A PARTICULAR PURPOSE OR WARRANTIES RELATED TO ITS CONDITION, QUALITY, OR PERFORMANCE. IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL OR CONSEQUENTIAL LOSS, DAMAGE, COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THE INFORMATION OR ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES ARE FORESEEABLE. TO THE FULLEST EXTENT ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FOR THE INFORMATION. Use of Microchi p devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conv eyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AgileSwitch, APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, TimePictra, TimeProvider, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, Espresso T1S, EtherGREEN, IdealBridge, In-Circuit Serial Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip Connectivity, JitterBlocker, maxCrypto, maxView, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP, SimpliPHY, SmartBuffer, SMART-I.S., storClad, SQI, SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY, ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2021, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-7909-3 For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality.
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