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Agilent ATF-501P8 High Linearity Enhancement Mode [1] Pseudomorphic HEMT in 2x2 mm2 LPCC[3] Package Data Sheet
Description
Agilent Technologies’s ATF- 501P8 is a single-voltage high linearity, low noise E-pHEMT housed in an 8-lead JEDEC- standard leadless plastic chip carrier (LPCC [3]) package. The device is ideal as a medium- power amplifier. Its operating frequency range is from 400 MHz to 3.9 GHz. The thermally efficient package measures only 2mm x 2mm x 0.75mm. Its backside metalization provides excellent thermal dissipation as well as visual evidence of solder reflow. The device has a Point MTTF of over 300 years at a mounting temperature of +85ºC. All devices are 100% RF & DC tested.
Features
- Single voltage operation
- High Linearity and P1dB
- Low Noise Figure
- Excellent uniformity in product specifications
- Small package size: 2.0 x 2.0 x 0.75 mm
- Point MTTF > 300 years[2]
- MSL-1 and lead-free
- Tape-and-Reel packaging option available Specifications
- 2 GHz; 4.5V, 280 mA (Typ.)
- 45.5 dBm Output IP3
- 29 dBm Output Power at 1dB gain compression
- 1 dB Noise Figure
- 15 dB Gain
- 14.5 dB LFOM[4]
- 65% PAE
- 23oC/W thermal resistance
Applications
- Front-end LNA Q2 and Q3, Driver or Pre-driver Amplifier for Cellular/ PCS and WCDMA wireless infrastructure
- Driver Amplifier for WLAN, WLL/ RLL and MMDS applications
- General purpose discrete E-pHEMT for other high linearity applications Pin Connections and Package MarkingNote: Package marking provides orientation and identification: “0P” = Device Code “x” = Date code indicates the month of manufacture.Notes: 1. Enhancement mode technology employs a single positive V gs, eliminating the need of negative gate voltage associated with conventional depletion mode devices. 2. Refer to reliability datasheet for detailed MTTF data. 3. Conforms to JEDEC reference outline MO229 for DRP-N. 4. Linearity Figure of Merit (LFOM) is essentially OIP3 divided by DC bias power. Pin 1 (Source) Pin 2 (Gate) Pin 3 Pin 4 (Source) Pin 8 Pin 7 (Drain) Pin 6 Pin 5 0Px Top View Pin 8 Source (Thermal/RF Gnd) Pin 7 (Drain) Pin 6 Pin 5 Pin 1 (Source) Pin 2 (Gate) Pin 3 Pin 4 (Source) Bottom View Attention: Observe precautions for handling electrostatic sensitive devices. ESD Machine Model (Class A) ESD Human Body Model (Class 1B) Refer to Agilent Application Note A004R: Electrostatic Discharge Damage and Control.
TA = 25°C, DC bias for RF parameters is Vds = 4.5V and Ids = 280 mA unless otherwise specified. Symbol Parameter and T est Condition Units Min. Typ. Max.
- Measurements at 2 GHz obtained using production test board described in Figure 2 while measurement at 0.9GHz obtained from loa d pull tuner.
- i ) 2 GHz OIP3 test condition: F1 = 2.0 GHz, F2 = 2.01 GHz and Pin = -5 dBm per tone.
ii ) 900 MHz OIP3 test condition: F1 = 900 MHz, F2 = 910 MHz and Pin = -5dBm per tone.
- Use proper bias, board, heatsinking and derating designs to ensure max channel temperature is not exceeded.
See absolute max ratings and application note for more details. Figure 6. Block diagram of the 2 GHz production test board used for NF, Gain, OIP3 , P1dB and PAE measurements at 2 GHz. This c ircuit achieves a trade-off between optimal OIP3, P1dB and VSWR. Circuit losses have been de-embedded from actual measurements.
50 Ohm
Figure 3. Simplified schematic of production test board. Primary purpose is to show 15 Ohm series resistor placement in gate supply. Transmission line tapers, tee intersections, bias lines and parasitic values are not shown.
15 Ohm
110 Ohm
- S parameter is measured on a microstrip line
Figure 56. MSG/MAG & |S21|
- S parameter is measured on a microstrip line
Figure 57. MSG/MAG & |S21|
- S parameter is measured on a microstrip line
Figure 58. MSG/MAG & |S21|
- S parameter is measured on a microstrip line
Figure 59. MSG/MAG & |S21|
- S parameter is measured on a microstrip line
Figure 60. MSG/MAG & |S21|
- S parameter is measured on a microstrip line
Figure 61. MSG/MAG & |S21|
- S parameter is measured on a microstrip line
Figure 62. MSG/MAG & |S21|
- S parameter is measured on a microstrip line
Figure 63. MSG/MAG & |S21|
- S parameter is measured on a microstrip line
Figure 64. MSG/MAG & |S21|
2 x 2 LPCC (JEDEC DFP-N) Package Dimensions
Ordering Information
Part Number No. of Devices Container ATF-501P8-TR1 3000 7 ” Reel ATF-501P8-TR2 10000 13 ”Reel ATF-501P8-BLK 100 antistatic bag Device Models Refer to Agilent’s Web Site www.agilent.com/view/rf D E A P e pin1 R L b DIMENSIONS ARE IN MILLIMETERS DIMENSIONS MIN. 0.70
0.203 REF
0.225 1.9 0.65 1.9 1.45
0.50 BSC
NOM. 0.75 0.02 0.25 2.0 0.80 2.0 1.6 MAX. 0.80 0.05 0.275 2.1 0.95 2.1 1.75 A b D E e pin1 0PX Top View End ViewEnd View Bottom View A A1
PCB Land Pattern and Stencil Design 2.80 (110.24) 0.70 (27.56) 0.25 (9.84) 0.25 (9.84) 0.50 (19.68) 0.28 (10.83) 0.60 (23.62) φ0.20 (7.87) PIN 1 Soldermask RF transmission line 0.80 (31.50) 0.15 (5.91) 0.55 (21.65) 1.60 (62.99) 2.72 (107.09) 0.63 (24.80) 0.22 (8.86) 0.32 (12.79) 0.50 (19.68) 0.25 (9.74) 0.63 (24.80) Stencil Layout (top view)PCB Land Pattern (top view) Notes: Typical stencil thickness is 5 mils. Measurements are in millimeters (mils). 0.72 (28.35) PIN 1 1.54 (60.61) USER FEED DIRECTION COVER TAPE CARRIER TAPE REEL 8 mm 4 mm 0PX0PX0PX0PX
F W E 10° Max DESCRIPTION SYMBOL SIZE (mm) SIZE (inches) LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER P 2.30 ± 0.05 2.30 ± 0.05 1.00 ± 0.05 4.00 ± 0.10 1.00 + 0.25 0.091 ± 0.004 0.091 ± 0.004 0.039 ± 0.002 0.157 ± 0.004 0.039 + 0.002 CAVITY DIAMETER PITCH POSITION D E 1.50 ± 0.10 4.00 ± 0.10 1.75 ± 0.10 0.060 ± 0.004 0.157 ± 0.004 0.069 ± 0.004 PERFORATION WIDTH THICKNESS W 8.00 + 0.30 0.254 ± 0.02 0.315 ± 0.012 8.00 – 0.10 0.315 ± 0.004 0.010 ± 0.0008 CARRIER TAPE CAVITY TO PERFORATION (WIDTH DIRECTION) CAVITY TO PERFORATION (LENGTH DIRECTION) F 3.50 ± 0.05 2.00 ± 0.05 0.138 ± 0.002 0.079 ± 0.002 DISTANCE WIDTH TAPE THICKNESS C Tt 5.4 ± 0.10 0.062 ± 0.001 0.205 ± 0.004 0.0025 ± 0.0004 COVER TAPE D Tt 10° Max www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (65) 6756 2394 India, Australia, New Zealand: (65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (65) 6755 2044 Taiwan: (65) 6755 1843 Data subject to change. Copyright © 2004 Agilent Technologies, Inc. August 24, 2004 5988-9767EN