ATF-58143 HP | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 10

Technical content

Features

  • Low noise and high linearity performance
  • Enhancement Mode Technology [1]
  • Excellent uniformity in product specifications
  • Low cost surface mount small plastic package SOT-343 (4 lead SC-70) in Tape-and-Reel packaging option available
  • Lead-free option available Specifications 2 GHz; 3V, 30 mA (Typ.)
  • 30.5 dBm output 3 rd order intercept
  • 19 dBm output power at 1 dB
  • 0.5 dB noise figure
  • 16.5 dB associated gain

Applications

  • Q1 LNA for cellular/PCS/WCDMA base stations
  • Q1, Q2 LNA and Pre-driver amplifier for 3–4 GHz WLL
  • Other low noise and high linearity applications at 450 MHz to 6 GHz Note: 1. Enhancement mode technology requires positive Vgs, thereby eliminating the need for the negative gate voltage associated with conventional depletion mode devices. Surface Mount Package SOT-343 Pin Connections and Package Marking SOURCE DRAIN GATE SOURCE 8Fx Note: T op View. Package marking provides orientation and identification “8F” = Device Code “x” = Date code character identifies month of manufacture. Attention: Observe precautions for handling electrostatic sensitive devices. ESD Machine Model (Class A) ESD Human Body Model (Class 0) Refer to Agilent Application Note A004R: Electrostatic Discharge Damage and Control.

Symbol Parameter and T est Condition Units Min. Typ. [2] Max.

  1. Measurements obtained using production test board described in Figure 5.
  2. T ypical values determined from a sample size of 500 parts from 3 wafers.

Figure 5. Block diagram of 2 GHz production test board used for Noise Figure, Associated Gain, match and associated impedance matching circuit losses.

  1. F min values at 2 GHz and higher are based on measurements while the Fmins below 2 GHz have been extrapolated. The Fmin values are based on a set of

the noise parameter application section for more information.

  1. S and noise parameters are measured on a microstrip line made on 0.025 inch thick alumina carrier. The input reference plane is at the end of the gate

within 0.010 inch from each source lead contact point, one via on each side of that point. Figure 19. MSG/MAG and S21 vs. Frequency

  1. F min values at 2 GHz and higher are based on measurements while the Fmins below 2 GHz have been extrapolated. The Fmin values are based on a set of

the noise parameter application section for more information.

  1. S and noise parameters are measured on a microstrip line made on 0.025 inch thick alumina carrier. The input reference plane is at the end of the gate

within 0.010 inch from each source lead contact point, one via on each side of that point. Figure 20. MSG/MAG and S21 vs. Frequency

Ordering Information

Part Number No. of Devices Container ATF-58143-TR1 3000 7" Reel ATF-58143-TR2 10000 13" Reel ATF-58143-BLK 100 antistatic bag ATF-58143-TR1G 3000 7” Reel ATF-58143-TR2G 10000 13”Reel ATF-58143-BLKG 100 antistatic bag Symbol MIN. (mm) MAX. (mm) E 1.15 1.35 D 1.85 2.25 HE 1.80 2.40 A 0.80 1.10 A2 0.80 1.00 A1 0.00 0.10 b 0.25 0.40 b1 0.55 0.70 c 0.10 0.20 L 0.10 0.46 Notes: 1. All dimensions are in mm. 2. Dimensions are inclusive of plating. 3. Dimensions are exclusive of mold flash and metal blurr. 4. All specifications comply to EIAJ SC70. 5. Die is facing up for mold and facing down for trim/form, i.e., reverse trim/form. 6. Package surface to be mirror finish.

Recommended PCB Pad Layout for Agilent's SC70 4L/SOT-343 Products (Dimensions in inches/mm) Device Orientation USER FEED DIRECTION COVER TAPE CARRIER TAPE REEL END VIEW 8 mm 4 mm TOP VIEW

T ape Dimensions For Outline 4T For product information and a complete list of Agilent contacts and distributors, please go to our web site. www.agilent.com/semiconductors E-mail: SemiconductorSupport@agilent.com Data subject to change. Copyright © 2004 Agilent T echnologies, Inc. Obsoletes 5988-1922EN December 10, 2004 5989-1919EN T ape Dimensions and Product Orientation Description Symbol Size (mm) Size (inches) Cavity Length A o 2.40 ± 0.10 0.094 ± 0.004 Width B o 2.40 ± 0.10 0.094 ± 0.004 Depth K o 1.20 ± 0.10 0.047 ± 0.004 Pitch P 4.00 ± 0.10 0.157 ± 0.004 Bottom Hole Diameter D 1 1.00 + 0.25 0.039 + 0.010 Perforlation Diameter D 1.50 + 0.10 0.061 + 0.002 Pitch P O 4.00 ± 0.10 0.157 ± 0.004 Position E 1.75 ± 0.10 0.069 ± 0.004 Thickness t 1 0.254 ± 0.02 0.0100 ± 0.0008 Cover Tape Width C 5.40 ± 0.010 0.205 + 0.004 Thickness T t 0.062 ± 0.001 0.0025 ± 0.0004 Distance Cavity to Perforation F 3.50 ± 0.05 0.138 ± 0.002 (Width Direction) Cavity to Perforation P 2 2.00 ± 0.05 0.079 ± 0.002 (Length Direction)