ATF-53189 HP | Alldatasheet
Document overview
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- PDF pages: 14
Technical content
Features
- Single voltage operation
- High Linearity and Gain
- Low Noise Figure
- Excellent uniformity in product specifications
- SOT 89 standard package
- Point MTTF > 300 years [2]
- MSL-1 and lead-free
- Tape-and-Reel packaging option available Specifications 2 GHz, 4.0V, 135 mA (Typ.)
- 40.0 dBm Output IP3
- 23.0 dBm Output Power at 1dB gain compression
- 0.85 dB Noise Figure
- 15.5 dB Gain
- 46% PAE at P1dB
- LFOM [3] 12.7 dB
Applications
- Front-end LNA Q1 and Q2, Driver or Pre-driver Amplifier for Cellular/ PCS and WCDMA wireless infrastructure
- Driver Amplifier for WLAN, WLL/ RLL and MMDS applications
- General purpose discrete E-pHEMT for other high linearity applications Pin Connections and Package MarkingNotes: Package marking provides orientation and identification: “3G” = Device Code “x” = Month code indicates the month of manufacture. D = Drain S = Source G = Gate Notes: 1. Enhancement mode technology employs a single positive Vgs, eliminating the need of negative gate voltage associated with conventional depletion mode devices. 2. Refer to reliability datasheet for detailed MTTF data. 3. Linearity Figure of Merit (LFOM) is OIP3 divided by DC bias power.
Description
Agilent Technologies’s ATF-53189 is a single-voltage high linearity, low noise E-pHEMT FET packaged in a low cost surface mount SOT89 package. The device is ideal as a high-linearity, low noise, medium-power amplifier. Its operating frequency range is from 50 MHz to 6 GHz. ATF-53189 is ideally suited for Cellular/PCS and WCDMA wireless infrastructure, WLAN, WLL and MMDS application, and general purpose discrete E-pHEMT amplifiers which require medium power and high linearity. All devices are 100% RF and DC tested. 3GX Bottom View DS S G Top View GS S D
Symbol Parameter Units Maximum Vds Drain–Source Voltage[2] V7 Vgs Gate–Source Voltage[2] V -5 to 1.0 Vgd Gate Drain Voltage[2] V -5 to 1.0 Ids Drain Current[2] mA 300 Igs Gate Current mA 20 Pdiss T otal Power Dissipation[3] W 1.0 Pin max. RF Input Power dBm +24 Tch Channel T emperature °C 150 Tstg Storage T emperature °C -65 to 150 Notes: 1. Operation of this device above any one of these parameters may cause permanent damage. 2. Assuming DC quiescent conditions. 3. Board (package belly) temperature T B is 25°C. Derate 14.30 mW/°C for TB > 80°C. 4. Channel-to-board thermal resistance measured using 150°C Liquid Crystal Measurement method. TA = 25°C, DC bias for RF parameters is Vds = 4.0V and Ids = 135 mA unless otherwise specified. Symbol Parameters and Test Conditions Units Min. Typ. Max. Vgs Operational Gate Voltage Vds = 4.0V, Ids = 135 mA V — 0.65 — Vth Threshold Voltage Vds = 4.0V, Ids = 8 mA V — 0.30 — Ids Drain to Source Current Vds = 4.0V, Vgs = 0V µA — 3.70 — Gm T ransconductance Vds = 4.0V, Gm = ∆Ids/∆Vgs; mmho — 650 — ∆Vgs = Vgs1 – Vgs2 Vgs1 = 0.6V, Vgs2 = 0.55V Igss Gate Leakage Current Vds = 0V, Vgs = -4V µA -10.0 -0.34 — NF Noise Figure f = 2 GHz dB — 0.85 — f = 900 MHz dB — 0.80 — G Gain [1] f = 2 GHz dB 14.0 15.5 17.0 f = 900 MHz dB — 17.2 — OIP3 Output 3 rd Order Intercept Point[1] f = 2 GHz dBm 36.0 40.0 — f = 900 MHz dBm — 42.0 — P1dB Output 1dB Compressed [1] f = 2 GHz dBm — 23.0 — f = 900 MHz dBm — 21.7 — PAE Power Added Efficiency f = 2 GHz % — 46.0 — f = 900 MHz % — 33.8 — ACLR Adjacent Channel Leakage Offset BW = 5 MHz dBc — -54.0 — Power Ratio[1,2] Offset BW = 10 MHz dBc — -64.0 — Notes: 1. Measurements at 2 GHz obtained using production test board described in Figure 1. 2. ACLR test spec is based on 3GPP TS 25.141 V5.3.1 (2002-06) - T est Model 1 - Active Channels: PCCPCH + SCH + CPICH + PICH + SCCPCH + 64 DPCH (SF=128) - Freq = 2140 MHz - Pin = -8 dBm - Channel Integrate Bandwidth = 3.84 MHz Thermal Resistance[2,4] θch-b = 70°C/W
- Typical describes additional product performance information that is not covered by the product warranty.
Figure 6. Typical IV Curve.
- F min values at 2 GHz and higher are based on measurements while the Fmin below 2 GHz have
calculated. Refer to the noise parameter application section for more information.
- S and noise parameters are measured on a microstrip line made on 0.025 inch thick alumina
Figure 31. MSG/MAG & |S21|2 vs. and
- F min values at 2 GHz and higher are based on measurements while the Fmin below 2 GHz have
calculated. Refer to the noise parameter application section for more information.
- S and noise parameters are measured on a microstrip line made on 0.025 inch thick alumina
Figure 32. MSG/MAG & |S21|2 vs. and
- F min values at 2 GHz and higher are based on measurements while the Fmin below 2 GHz have
calculated. Refer to the noise parameter application section for more information.
- S and noise parameters are measured on a microstrip line made on 0.025 inch thick alumina
Figure 33. MSG/MAG & |S21|2 vs. and
- F min values at 2 GHz and higher are based on measurements while the Fmin below 2 GHz have
calculated. Refer to the noise parameter application section for more information.
- S and noise parameters are measured on a microstrip line made on 0.025 inch thick alumina
Figure 34. MSG/MAG & |S21|2 vs. and
- F min values at 2 GHz and higher are based on measurements while the Fmin below 2 GHz have
calculated. Refer to the noise parameter application section for more information.
- S and noise parameters are measured on a microstrip line made on 0.025 inch thick alumina
Figure 35. MSG/MAG & |S21|2 vs. and
Ordering Information
Part Number No. of Devices Container ATF-52189-TR1 3000 13 ” Reel ATF-52189-BLK 100 Anti-static bag Device Models, PCB Layout and Stencil Device Refer to Agilent’s Web Site: www.agilent.com/view/rf DIMENSIONS Millimeters COMMON MIN. 1.40 0.44 0.36 0.35 4.40 1.62 2.30 2.13
1.50 BSC
3.00 BSC
3.95 0.90 NOM. 1.50 0.50 0.42 0.40 4.50 1.73 2.50 2.20 4.10 1.10 MAX. 1.60 0.56 0.48 0.44 4.60 1.83 2.60 2.29 4.25 1.20 SYMBOL A B C D E e H L Notes: 1. Dimensioning and tolerancing per ANSI.Y14.5M-1982 2. Controlling dimension: Millimeter convertions to inches are not necessarily exact. 3. Dimension B1, 2 places. DIMENSIONS Inches MIN. 0.055 0.017 0.014 0.014 0.173 0.064 0.090 0.084
0.059 BSC
0.118 BSC
0.155 0.035 NOM. 0.059 0.0195 0.0165 0.016 0.177 0.068 0.096 0.087
0.188 BSC
0.161 0.038 MAX. 0.063 0.022 0.019 0.017 0.181 0.072 0.102 0.090 0.167 0.047 e BOTTOM #3 #2 #1 E1E A C D L H B #3#2#1
8.00±0.10 (0.315±0.004) 4.00±0.10 (0.157±0.004) φ1.50±0.10 (0.059+0.004) φ1.50±0.25 (0.059+0.010) 2.00±0.05 (0.069±0.004) 5.50±0.05 5° MAX 1.91±0.10 (0.075±0.004) 4.78±0.10 (0.188±0.004) 0.292±0.013 (0.0115±0.0005) 4.60±0.10 (0.181±0.004) Dimensions in mm (inches) www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (65) 6756 2394 India, Australia, New Zealand: (65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (65) 6755 2044 Taiwan: (65) 6755 1843 Data subject to change. Copyright © 2005 Agilent Technologies, Inc. January 14, 2005 5989-2075EN