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Technical content

Features

  • Intel Xeon E3 Quad-Core or Core™ i3 Dual-Core Uniprocessor
  • DDR3 1600/ECC memory up to 32 GB maximum capacity
  • Intel C216 chipset
  • Dual 10GBASE-KX4/1000BASE-BX Fabric Interface channels
  • RAID 0/1/5 SATA ports
  • Support Intel DPDK Specifications
  • CPU / Chipset / Memory CPU Single Quad-Core Intel® Xeon® E3-1275 v2 3.5GHz, 8MB, L2 cache Single Quad-Core Intel® Xeon® E3-1225 v2 3.2GHz, 8MB, L2 cache Single Dual-Core Core™ i3 3.3GHz, 3MB L3 cache Chipset Intel® C216 Chipset Memory Four DDR3-1600 240-pin VLP UDIMM sockets, up to 32GB
  • BIOS Chip AMIBIOS® 8 on SPI flash memory

Intel® PXE pre-boot

  • I/O Interfaces Graphics Intel® Integrated HD Graphics with DirectX 11 support, up to UXGA 1920 x 1400 resolution Ethernet Dual Base Interface channels Dual 10GBASE-KX4/1000BASE-BX Fabric Interface channels Six 10/1001000BASE-T Egress ports Storage One 2.5” SATA bay On board bootable CFast socket USB Two USB 2.0 ports
  • PICMG Standard AdvancedTCA PICMG® 3.0 R3.0 PICMG® 3.1 Ethernet Over PICMG 3.0 R1.0 , Option1/9
  • Other Features Operating System Windows® Server 2008, Red Hat Enterprise Linux® 6 Operating Systems Windows Server 2008 R2, Red Hat Enterprise Linux 6, Intel® DPDK supported
  • Mechanical and Environmental Form Factor: PICMG® 3.0 R2.0 ECN001 AdvancedTCA® Dimensions: 322.25mm x 280mm x 6HP (L x W x H) Operating Temp. 0˚C to +50˚C Storage Temp.: -20˚C to +80˚C Humidity 5% to 95%, non-condensing Shock 15G peak-to-peak, 11ms duration, non-operation Vibration Non-operation: 1.88Grms, 5-500Hz each axis Operation: 0.5Grms, 5-500Hz each axis Certifications FCC, CE, UL

www.adlinktech.com All products and company name listed are trademarks or trade names of their respective companies. Updated Jul. 06, 2018. ©2018 ADLINK Technology, Inc. All Rights Reserved. All specifications are subject to change without further notice. Functional Diagram Mechanical Layout Front Panel LED Indicators and Reset Front Panel I/O Interfaces Zone3-RTM Single Intel® Xeon® E3-1275 v2 V2/1225 V2 or Core™ i3 3220 Zone1- Power/IPMI For DDR3-1600 UDIMM socket Intel Workstation chipset C216 Zone2- Base Interface: 2x GbE Fabric Interface: 2x 10GbE 6x GbE (RJ-45) User Hot Swap Media Out of Service COM VGA USB Z O N E Z O N E F R O N T P A N E L Cfast Card BIOS BIOS Z O N E DDR3 1600 UDIMM DDR3 1600 UDIMM COM COM B/FLPC IPMB 0/1 COM x 1 USB x 2 SATA x2, USB x2, COM x1, PCI-E x 8 (Gen3) FCH1 RTM RTM IPMC Smart Fusion A2F500Super I/O Intel Xeon E3-1275 V2/

1225 V2/

x4 DMI 2.0 Intel C216 Series PCHSATA x2 core core core core FCH2 BCH1 BCH2 PCI-E x 8 Intel 82599EB Fabric Riser Card RTM RTM RGB USB x2 SPISPI USB USB V G A DDR3 1600 UDIMM DDR3 1600 UDIMM SATA RJ-45 USB x2 Front Panel COM PCI-E x 1 Front Panel SATA RJ-45 Intel I210AT/IS Intel I210AT/IS Intel I210AT Intel I210AT Intel I210AT Intel I210AT Intel I210AT/IS Intel I210AT/IS RJ-45/SFP RJ-45 RJ-45/SFP RJ-45/SFP RJ-45/SFP PCI-E x 1 PCI-E x 1 PCI-E x 1 PCI-E x 1 PCI-E x 1 PCI-E x 8 PCI-E x 1 PCI-E x 4 AMC PCI-E x 1 RTM 2.5" SATA HDD (Gen3) (Xeon processor only) PCI-E Switch RTM PCI-E x 4 PCI-E x 4

Ordering Information

  • aTCA-9300/S1275V2 Single Quad-Core E3 1275 v2 3.5GHz Xeon 10GbE processor blade, 8 PCIe lanes to RTM
  • aTCA-9300/S1225V2 Single Quad-core E3 1225 v2 3.2GHz Xeon 10GbE processor blade, 8 PCIe lanes to RTM
  • aTCA-9300/S3220 Single Dual-Core Core™ i3 3.3GHz 10GbE processor blade,

8 PCIe lanes to RTM

  • aTCA-R6270 Rear Transition Module with USB2.0 x2, SFP+ 10GbE port and SATA drive bay x2 (hot swappable)