AFT09MS031N FREESCALE | Alldatasheet
Document overview
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- PDF pages: 21
Technical content
Features
- Characterized for Operation from 764 to 941 MHz
- Unmatched Input and Output Allowing Wide Frequency Range Utilization
- Integrated ESD Protection
- Integrated Stability Enhancements
- Wideband Full Power Across the Band (764870 MHz)
- 225°C Capable Plastic Package
- Exceptional Thermal Performance
- High Linearity for: TETRA, SSB, LTE
- Cost- -effective Over- -molded Plastic Packaging
- In Tape and Reel. R1 Suffix = 500 Units, 24 mm Tape Width, 13 inch Reel. Typical Applications
- Output Stage 800 MHz Trunking Band Mobile Radio
- Output Stage 900 MHz Trunking Band Mobile Radio Document Number: AFT09MS031N Rev. 0, 5/2012 Freescale Semiconductor Technical Data 764- -941 MHz, 31 W, 13.6 V WIDEBAND RF POWER LDMOS TRANSISTORS AFT09MS031NR1 AFT09MS031GNR1 T O -- 2 7 0 -- 2 PLASTIC AFT09MS031NR1
Figure 1. Pin Connections source terminal for the transistor. © Freescale Semiconductor, Inc., 2012.All rights reserved.
Freescale Semiconductor, Inc. Table 1. Maximum Ratings Table 2. Thermal Characteristics Table 3. ESD Protection Characteristics Table 4. Moisture Sensitivity Level Table 5. Electrical Characteristics(TA =2 5°C unless otherwise noted)
- Continuous use at maximum temperature will affect MTTF.
- MTTF calculator available at http://www.freescale.com/rf
Select Documentation/Application Notes - - AN1955.
Freescale Semiconductor, Inc. Table 5. Electrical Characteristics(TA =2 5°C unless otherwise noted)(continued)
870 CW >65:1 at all Phase Angles 54
17 No Device Degradation
- Measurement made with device in straight leadconfiguration before any lead forming operation is applied. Lead forming is used for gull
Freescale Semiconductor, Inc. Figure 2. Capacitance versus Drain- -Source Voltage Figure 3. Drain Current versus Drain- -Source Voltage Note: Measured with both sides of the transistor tied together.
2.5 Vdc
3.0 Vdc
3.25 Vdc
3.5 Vdc
Figure 4. MTTF versus Junction Temperature - - CW under indicated test conditions.
3.2 Amps
3.9 Amps
Freescale Semiconductor, Inc.
870 MHz NARROWBAND PRODUCTION TEST FIXTURE
Figure 5. AFT09MS031NR1 Narrowband Test Circuit Component Layout 870 MHz Table 6. AFT09MS031NR1 Narrowband Test Circuit Component Designations and Values 870 MHz
Freescale Semiconductor, Inc. Figure 6. AFT09MS031NR1 Narrowband Test Circuit Schematic 870 MHz Table 7. AFT09MS031NR1 Narrowband Test Circuit Microstrips 870 MHz
Freescale Semiconductor, Inc. Table 8. 760- -870 MHz Broadband Performance(13.6 Vdc, IDQ = 100 mA, TA =2 5°C, CW) Table 9. Load Mismatch/Ruggedness(In Freescale Reference Circuit)
870 CW >65:1 at all
17 No Device
Freescale Semiconductor, Inc. Figure 10. AFT09MS031NR1 Broadband Reference Circuit Component Layout 760- -870 MHz Table 10. AFT09MS031NR1 Broadband Reference Circuit Component Designations and Values 760- -870 MHz
Freescale Semiconductor, Inc. Figure 11. AFT09MS031NR1 Broadband Reference Circuit Schematic 760- -870 MHz Table 11. AFT09MS031NR1 Broadband Reference Circuit Microstrips 760- -870 MHz
Freescale Semiconductor, Inc. Figure 14. CW Output Power versus Gate- -Source Voltage Figure 15. Power Gain, CW Output Power and
870 MHz
760 MHz
820 MHz
Freescale Semiconductor, Inc. Figure 14. Broadband Series Equivalent Source and Load Impedance 760- -870 MHz
Freescale Semiconductor, Inc. AFT09MS031NR1 AFT09MS031GNR1 PACKAGE DIMENSIONS
AFT09MS031NR1 AFT09MS031GNR1 RF Device Data Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc. AFT09MS031NR1 AFT09MS031GNR1
AFT09MS031NR1 AFT09MS031GNR1 RF Device Data Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc. AFT09MS031NR1 AFT09MS031GNR1
AFT09MS031NR1 AFT09MS031GNR1 RF Device Data Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc. AFT09MS031NR1 AFT09MS031GNR1 PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS Refer to the following documents, software and tools to aid your design process. Application Notes
- AN1907: Solder Reflow Attach Method for High Power RF Devices in Over- -Molded Plastic Packages
- AN1955: Thermal Measurement Methodology of RF Power Amplifiers
- AN3263: Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over- -Molded Plastic Packages
- AN3789: Clamping of High Power RF Transistors and RFICs in Over- -Molded Plastic Packages Engineering Bulletins
- EB212: Using Data Sheet Impedances for RF LDMOS Devices Software
- Electromigration MTTF Calculator
- RF High Power Model
- .s2p File Development Tools
- Printed Circuit Boards For Software and Tools, do a Part Number search at http://www.freescale.com, and select the Part Number link. Go to the Software & Tools tab on the parts Product Summary page to download the respective tool.
REVISION HISTORY
The following table summarizes revisions to this document. Revision Date Description
0 May 2012 • Initial Release of Data Sheet
AFT09MS031NR1 AFT09MS031GNR1 RF Device Data Freescale Semiconductor, Inc. Information in this document is provided solely to enablesystem and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particularpurpose, nor does Freescale assume any liability arisingout of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including typicals, must be validated for each customer application by customers technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: http://www.reg.net/v2/webservices/Freescale/Docs/TermsandConditions.htm. Freescale, the Freescale logo, AltiVec, C- -5, CodeTest, CodeWarrior, ColdFire, C- -Ware, Energy Efficient Solutions logo, Kinetis, mobileGT, PowerQUICC, Processor Expert, QorIQ, Qorivva, StarCore, Symphony, and VortiQa are trademarks of ColdFire+, CoreNet, Flexis, MagniV, MXC, Platform in a Package, QorIQ Qonverge, QUICC Engine, Ready Play, SafeAssure, SMARTMOS, TurboLink, Vybrid, and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. E 2012 Freescale Semiconductor, Inc. How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Document Number: AFT09MS031N Rev. 0, 5/2012