MD7IC2251N FREESCALE | Alldatasheet
Document overview
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Technical content
Features
- 100% PAR Tested for Guaranteed Output Power Capability
- Production Tested in a Symmetrical Doherty Configuration
- Characterized with Large- -Signal Load- -Pull Parameters and Common Source S- -Parameters
- On- -Chip Matching (50 Ohm Input, DC Blocked)
- Integrated Quiescent Current Temperature Compensation with Enable/Disable Function(2)
- Integrated ESD Protection
- 225°C Capable Plastic Package
- In Tape and Reel. R1 Suffix = 500 Units, 44 mm Tape Width, 13 inch Reel.
Figure 1. Functional Block Diagram Figure 2. Pin Connections the source terminal for the transistors.
- P3dB = Pavg + 7.0 dB where Pavg is the average output power measured using an unclippedW- -CDMA single- -carrier input signal where output
PAR is compressed to 7.0 dB @ 0.01% probability on CCDF.
- Refer to AN1977,Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Familyand to AN1987,Quiescent Current Control
- Peaking and Carrier orientation isdetermined by the test fixture design.
© Freescale Semiconductor, Inc., 2012.All rights reserved.
Freescale Semiconductor, Inc. Table 1. Maximum Ratings Table 2. Thermal Characteristics Table 3. ESD Protection Characteristics Table 4. Moisture Sensitivity Level Table 5. Electrical Characteristics(TA =2 5°C unless otherwise noted)
- Continuous use at maximum temperature will affect MTTF.
- MTTF calculator available at http://www.freescale.com/rf
Select Documentation/Application Notes - - AN1955.
- Each side of device measured separately.
Freescale Semiconductor, Inc. Table 5. Electrical Characteristics(TA =2 5°C unless otherwise noted)(continued) Probability on CCDF. ACPR measured in 3.84 MHz Channel Bandwidth @±5M H zO f f s e t . Probability on CCDF. ACPR measured in 3.84 MHz Channel Bandwidth @±5M H zO f f s e t .
- Each side of device measured separately.
- Part internally matched both on input and output.
- Measurement made with device in a Symmetrical Doherty configuration.
- Measurement made with device in straight lead configuration before anylead forming operation is applied.
Freescale Semiconductor, Inc.
1.4 Vdc, 2110- -2170 MHz Bandwidth
- Measurement made with device in a Symmetrical Doherty configuration.
- P3dB = Pavg + 7.0 dB where Pavg is the average output power measured using an unclipped W- -CDMA single- -carrier input signal where
output PAR is compressed to 7.0 dB @ 0.01% probability on CCDF.
- Refer to AN1977,Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Familyand to AN1987,Quiescent Current Control
Freescale Semiconductor, Inc. Figure 3. MD7IC2251NR1(GNR1) Production Test Circuit Component Layout Table 6. MD7IC2251NR1(GNR1) Production Test Circuit Component Designations and Values
Freescale Semiconductor, Inc. Figure 4. MD7IC2251NR1(GNR1) Characterization Test Circuit Component Layout Table 7. MD7IC2251NR1(GNR1) Characterization Test Circuit Component Designations and Values
Freescale Semiconductor, Inc. Figure 5. Output Peak- -to- -Average Ratio Compression (PARC) Broadband Performance @ Pout = 12 Watts Avg. Figure 6. Intermodulation Distortion Products Figure 7. Output Peak- -to- -Average Ratio
30 Gps, POWER GAIN (dB)
3.84 MHz Channel Bandwidth, Input Signal
3.84 MHz Channel Bandwidth
Freescale Semiconductor, Inc. Pout, OUTPUT POWER (WATTS) AVG. Figure 8. Single- -Carrier W- -CDMA Power Gain, Power Figure 9. Broadband Frequency Response
2110 MHz
2140 MHz
2170 MHz
Figure 10. CCDF W- -CDMA IQ Magnitude Channel Bandwidth @±5M H zO f f s e t .
3.84 MHz
Figure 11. Single- -Carrier W- -CDMA Spectrum
Freescale Semiconductor, Inc. MD7IC2251NR1 MD7IC2251GNR1 PACKAGE DIMENSIONS
MD7IC2251NR1 MD7IC2251GNR1 RF Device Data Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc. MD7IC2251NR1 MD7IC2251GNR1
MD7IC2251NR1 MD7IC2251GNR1 RF Device Data Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc. MD7IC2251NR1 MD7IC2251GNR1
MD7IC2251NR1 MD7IC2251GNR1 RF Device Data Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc. MD7IC2251NR1 MD7IC2251GNR1 PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS Refer to the following documents, software and tools to aid your design process. Application Notes
- AN1907: Solder Reflow Attach Method for High Power RF Devices in Over- -Molded Plastic Packages
- AN1955: Thermal Measurement Methodology of RF Power Amplifiers
- AN1977: Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family
- AN1987: Quiescent Current Control for the RF Integrated Circuit Device Family
- AN3789: Clamping of High Power RF Transistors and RFICs in Over- -Molded Plastic Packages Engineering Bulletins
- EB212: Using Data Sheet Impedances for RF LDMOS Devices Software
- Electromigration MTTF Calculator
- RF High Power Model
- .s2p File Development Tools
- Printed Circuit Boards For Software and Tools, do a Part Number search at http://www.freescale.com, and select the Part Number link. Go to the Software & Tools tab on the parts Product Summary page to download the respective tool.
REVISION HISTORY
The following table summarizes revisions to this document. Revision Date Description
0 May 2012 • Initial Release of Data Sheet
MD7IC2251NR1 MD7IC2251GNR1 RF Device Data Freescale Semiconductor, Inc. Information in this document is provided solely to enablesystem and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particularpurpose, nor does Freescale assume any liability arising outof the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including typicals, must be validated for each customer application by customers technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: http://www.reg.net/v2/webservices/Freescale/Docs/TermsandConditions.htm. Freescale, the Freescale logo, AltiVec, C- -5, CodeTest, CodeWarrior, ColdFire, C- -Ware, Energy Efficient Solutions logo, Kinetis, mobileGT, PowerQUICC, Processor Expert, QorIQ, Qorivva, StarCore, Symphony, and VortiQa are trademarks of ColdFire+, CoreNet, Flexis, MagniV, MXC, Platform in a Package, QorIQ Qonverge, QUICC Engine, Ready Play, SafeAssure, SMARTMOS, TurboLink, Vybrid, and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. E 2012 Freescale Semiconductor, Inc. How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Document Number: MD7IC2251N Rev. 0, 5/2012