MW7IC930N NXP | Alldatasheet

Document overview

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Technical content

Features

  • Characterized with Series Equivalent Large- -SignalImpedance Parameters and Common Source S- -Parameters
  • On- -Chip Matching (50 Ohm Input, DC Blocked, >5 Ohm Output)
  • Integrated Quiescent Current Temperature Compensation with Enable/ Disable Function(2)
  • Integrated ESD Protection
  • 225°C Capable Plastic Package
  • RoHS Compliant
  • In Tape and Reel. R1 Suffix = 500 Units per 44 mm, 13 inch Reel. Document Number: MW7IC930N Rev. 1, 10/2010 Freescale Semiconductor Technical Data 728- -768 MHz, 920- -960 MHz, 3.2 W AVG., 28 V SINGLE W- -CDMA RF LDMOS WIDEBAND INTEGRATED POWER AMPLIFIERS MW7IC930NR1 MW7IC930GNR1 MW7IC930NBR1 CASE 1886- -01 TO- -270 WB- -16 PLASTIC MW7IC930NR1 CASE 1329- -09 TO- -272 WB- -16 PLASTIC MW7IC930NBR1 CASE 1887- -01 TO- -270 WB- -16 GULL PLASTIC MW7IC930GNR1 (Top View) GND NC RFin VGS1 GND RFout/VDS2 GND V GS2 9 GND Quiescent Current Temperature Compensation(2) VDS1 RFin VGS1 RFout/VDS2 VGS2 VDS1 NC NC NC NC Note: Exposed backside of the package is the source terminal for the transistors.

Figure 1. Functional Block Diagram Figure 2. Pin Connections

  1. 900 MHz Driver Frequency Band table data collected inthe 900 MHz application test fixture. See Fig. 7.
  2. Refer to AN1977,Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Familyand to AN1987,Quiescent Current Control

© Freescale Semiconductor, Inc., 2009- -2010.All rights reserved.

Table 1. Maximum Ratings Table 2. Thermal Characteristics Table 3. ESD Protection Characteristics Table 4. Moisture Sensitivity Level Table 5. Electrical Characteristics(TA =2 5°C unless otherwise noted)

  1. Continuous use at maximum temperature will affect MTTF.
  2. MTTF calculator available at http://www.freescale.com/rf

Select Documentation/Application Notes - - AN1955.

  1. VGG =3 . 3xVGS(Q). Parameter measured on Freescale Test Fixture, due to resistive divider network on the board. Refer to Test Circuit

Table 5. Electrical Characteristics(TA =2 5°C unless otherwise noted)(continued) Probability on CCDF. ACPR measured in 3.84 MHz Channel Bandwidth @±5M H zO f f s e t . on CCDF. ACPR measured in 3.84 MHz Channel Bandwidth @±5M H zO f f s e t .

  1. VGG =2 . 2 5xVGS(Q). Parameter measured on Freescale Test Fixture, due to resistive divider network on the board. Refer to Test Circuit
  2. Part internally matched both on input and output.
  3. Measurement made with device in straight lead configuration before anylead forming operation is applied.

Probability on CCDF. ACPR measured in 3.84 MHz Channel Bandwidth @±5M H zO f f s e t .

  1. Refer to AN1977,Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Familyand to AN1987,Quiescent Current Control

Figure 3. MW7IC930NR1(GNR1)(NBR1) Test Circuit Component Layout — 900 MHz Table 6. MW7IC930NR1(GNR1)(NBR1) Test Circuit Component Designations and Values — 900 MHz

Figure 4. Output Peak- -to- -Average Ratio Compression (PARC) Broadband Performance @ Pout = 3.2 Watts Avg. Figure 5. Intermodulation Distortion Products Figure 6. Output Peak- -to- -Average Ratio

3.84 MHz Channel Bandwidth

Pout, OUTPUT POWER (WATTS) AVG. Figure 7. Single- -Carrier W- -CDMA Power Gain, Power Added Figure 8. Broadband Frequency Response

960 MHz

920 MHz

940 MHz

960 MHz 940 MHz

Figure 9. CCDF W- -CDMA IQ Magnitude Channel Bandwidth @±5M H zO f f s e t .

3.84 MHz

Figure 10. Single- -Carrier W- -CDMA Spectrum

Figure 11. Series Equivalent Input and Load Impedance — 900 MHz

Figure 12. Pulsed CW Output Power

Figure 13. MW7IC930NR1(GNR1)(NBR1) Test Circuit Component Layout — 700 MHz Table 7. MW7IC930NR1(GNR1)(NBR1) Test Circuit Component Designations and Values — 700 MHz

Pout, OUTPUT POWER (WATTS) AVG. Figure 14. Single- -Carrier W- -CDMA Power Gain, Power Added

728 MHz

748 MHz

768 MHz

Figure 15. Series Equivalent Input and Load Impedance — 700 MHz

MW7IC930NR1 MW7IC930GNR1 MW7IC930NBR1 PACKAGE DIMENSIONS

MW7IC930NR1 MW7IC930GNR1 MW7IC930NBR1 RF Device Data Freescale Semiconductor

MW7IC930NR1 MW7IC930GNR1 MW7IC930NBR1

MW7IC930NR1 MW7IC930GNR1 MW7IC930NBR1 RF Device Data Freescale Semiconductor

MW7IC930NR1 MW7IC930GNR1 MW7IC930NBR1

MW7IC930NR1 MW7IC930GNR1 MW7IC930NBR1 RF Device Data Freescale Semiconductor

MW7IC930NR1 MW7IC930GNR1 MW7IC930NBR1

MW7IC930NR1 MW7IC930GNR1 MW7IC930NBR1 RF Device Data Freescale Semiconductor

MW7IC930NR1 MW7IC930GNR1 MW7IC930NBR1

MW7IC930NR1 MW7IC930GNR1 MW7IC930NBR1 RF Device Data Freescale Semiconductor PRODUCT DOCUMENTATION AND SOFTWARE Refer to the following documents, tools and software to aid your design process. Application Notes

  • AN1907: Solder Reflow Attach Method for High Power RF Devices in Plastic Packages
  • AN1955: Thermal Measurement Methodology of RF Power Amplifiers
  • AN1977: Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family
  • AN1987: Quiescent Current Control for the RF Integrated Circuit Device Family
  • AN3263: Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over- -Molded Plastic Packages
  • AN3789: Clamping of High Power RF Transistors and RFICs in Over- -Molded Plastic Packages Engineering Bulletins
  • EB212: Using Data Sheet Impedances for RF LDMOS Devices Software
  • Electromigration MTTF Calculator
  • RF High Power Model
  • .s2p File For Software, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the Software & Tools tab on the part’s Product Summary page to download the respective tool.

REVISION HISTORY

The following table summarizes revisions to this document. Revision Date Description 0 Aug. 2009 • Initial Release of Data Sheet 1 Oct. 2010 • Table 1, Maximum Ratings, increased Input Power from 4.7 dBm to 20 dBm to reflect the true capability of the device, p. 2

MW7IC930NR1 MW7IC930GNR1 MW7IC930NBR1 Information in this document is provided solely to enablesystem and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its productsfor any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and allliability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components insystems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributorsharmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescalet and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009- -2010. All rights reserved. How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516

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