MRFG35010AN NXP | Alldatasheet
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9 Watts P1dB @ 3550 MHz, CW Excellent Phase Linearity and Group Delay Characteristics High Efficiency and High Linearity In Tape and Reel. T1 Suffix = 1000 Units, 16 mm Tape Width, 13- -inch Reel. Table 1. Maximum Ratings Table 2. Thermal Characteristics Table 3. ESD Protection Characteristics Table 4. Moisture Sensitivity Level
- For reliable operation, the operating channel temperature should not exceed 150C.
Select Documentation/Application Notes - - AN1955. Freescale Semiconductor, Inc., 2006, 2008- -2009, 2012- -2013. All rights reserved.
Freescale Semiconductor, Inc. Table 5. Electrical Characteristics(TA =2 5C unless otherwise noted) W- -CDMA, 3.84 MHz Channel Bandwidth Carrier. ACPR measured in 3.84 MHz Channel Bandwidth @5M H zO f f s e t . PAR = 8.5 dB @ 0.01% Probability on CCDF.
Freescale Semiconductor, Inc. Figure 1. MRFG35010ANT1 Test Circuit Component Layout — 3550 MHz Table 6. MRFG35010ANT1 Test Circuit Component Designations and Values — 3550 MHz
Freescale Semiconductor, Inc. Figure 2. MRFG35010ANT1 Test Circuit Schematic — 3550 MHz Table 7. MRFG35010ANT1 Test Circuit Microstrips — 3550 MHz
Freescale Semiconductor, Inc. Figure 3. Single- -Carrier W- -CDMA Power Gain Figure 4. Single- -Carrier W- -CDMA ACPR and NOTE: All data is referenced to package lead interface.S and L are the impedances presented to the DUT. All data is generated from load pull, not from the test circuit shown.
3.84 MHz Channel Bandwidth
Freescale Semiconductor, Inc. Figure 7. Series Equivalent Source and Load Impedance — 3550 MHz
Freescale Semiconductor, Inc. Figure 8. MRFG35010ANT1 Test Circuit Component Layout — 750 MHz Table 8. MRFG35010ANT1 Test Circuit Component Designations and Values — 750 MHz
Freescale Semiconductor, Inc. Figure 9. MRFG35010ANT1 Test Circuit Schematic — 750 MHz Table 9. MRFG35010ANT1 Test Circuit Microstrips — 750 MHz
Freescale Semiconductor, Inc. Figure 15. MRFG35010ANT1 Test Circuit Component Layout — 2140 MHz Table 10. MRFG35010ANT1 Test Circuit Component Designations and Values — 2140 MHz
Freescale Semiconductor, Inc. Figure 16. MRFG35010ANT1 Test Circuit Schematic — 2140 MHz Table 11. MRFG35010ANT1 Test Circuit Microstrips — 2140 MHz
Freescale Semiconductor, Inc. Figure 22. MRFG35010ANT1 Test Circuit Component Layout — 2650 MHz Note: Component number C2* is labeled on board but not placed. Table 12. MRFG35010ANT1 Test Circuit Component Designations and Values — 2650 MHz
Freescale Semiconductor, Inc. Figure 23. MRFG35010ANT1 Test Circuit Schematic — 2650 MHz Table 13. MRFG35010ANT1 Test Circuit Microstrips — 2650 MHz
Freescale Semiconductor, Inc. Figure 27. Single- -Carrier W- -CDMA Power Gain Figure 28. Single- -Carrier W- -CDMA ACPR and
Freescale Semiconductor, Inc. PACKAGE DIMENSIONS
Freescale Semiconductor, Inc. MRFG35010ANT1
Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc. MRFG35010ANT1 PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS Refer to the following documents, software and tools to aid your design process. Application Notes AN1955: Thermal Measurement Methodology of RF Power Amplifiers Software .s2p File RF High Power Model Development Tools Printed Circuit Boards Reference Designs W- -CDMA Reference Design for 2.4- -2.5 GHz, 900 mW MRFG35010ANT1 Device 725- -760 MHz, 1.0 W AVG., 12 V LTE Amplifier Lineup Reference Design For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the Software & Tools tab on the part’s Product Summary page to download the respective tool.
REVISION HISTORY
The following table summarizes revisions to this document. Revision Date Description
0 May 2006 Initial Release of Data Sheet
1 Dec. 2008 Removed ”Operating Case Temperature Range” from Maximum Ratings table so that the maximum channel temperature rating is the limiting thermal design criteria and not the case temperature range, p. 1 Added Table 3, ESD Protection Characteristics, p. 1; renumbered subsequent tables 2 June 2009 Modified data sheet to reflect MSL rating change from1 to 3 as a result of the standardization of packing process as described in Product and Process Change Notification number, PCN13516, p. 1 3 Dec. 2012 Added Typical Performance table, p. 1 Table 3, ESD Protection Characteristics, removed the word ”Minimum” after the ESD class rating. ESD ratings are characterized during new product development but are not 100% tested during production. ESD ratings provided in the data sheet are intended to beused as a guideline when handling ESD sensitive devices, p. 1. Added Figs. 8, 15 and 22, Test Circuit Component Layout — 750 MHz, 2140 MHz and 2650 MHz, and Tables 8, 10 and 12, Test Circuit Component Designations and Values — 750 MHz, 2140 MHz and 2650 MHz, p. 8, 12 and 16 Added Figs. 9, 16 and 23, Test Circuit Schematic — 750 MHz, 2140 MHz and 2650 MHz, and Tables 9, 11 and 13, Test Circuit Microstrips — 750 MHz, 2140 MHz and 2650 MHz, p. 9, 13 and 17 Added Figs. 10, 17 and 24, Small- -Signal Gain versus Frequency — 750 MHz, 2140 MHz and 2650 MHz, Figs. 11, 18 and 25, Input Return Loss versus Frequency — 750 MHz, 2140 MHz and 2650 MHz, and Figs. 12, 19 and 26, Output Return Loss versus Frequency — 750 MHz, 2140 MHz and 2650 MHz, p. 10, 14 and 18 Added Figs. 13, 20 and 27, Single- -Carrier W- -CDMA Power Gain and Drain Efficiency versus Output Power — 750 MHz, 2140 MHz and 2650 MHz, and Figs. 14, 21 and 28, Single- -Carrier W- -CDMA ACPR and Input Return Loss versus Output Power — 750 MHz, 2140 MHz and 2650 MHz, p. 11, 15 and 19 4 Aug. 2013 Modified data sheet to reflect tape and reel changes for PLD- -1.5 package devices as described in Product and Process Change Notification number, PCN14498, p. 1 Updated Fig. 1, MRFG35010ANT1 Test Circuit Component Layout — 3550 MHz, to current test circuit component layout for MRFG35010ANT1 part, p. 3
Freescale Semiconductor, Inc. How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Document Number: MRFG35010AN Rev. 4, 8/2013 Information in this document is provided solely to enablesystem and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particularpurpose, nor does Freescale assume any liability arising outof the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/SalesTermsandConditions. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., respective owners. E 2006, 2008- -2009, 2012- -2013 Freescale Semiconductor, Inc.